JPH0333027A - Glass paste for manufacture of ceramic substrate - Google Patents
Glass paste for manufacture of ceramic substrateInfo
- Publication number
- JPH0333027A JPH0333027A JP2158894A JP15889490A JPH0333027A JP H0333027 A JPH0333027 A JP H0333027A JP 2158894 A JP2158894 A JP 2158894A JP 15889490 A JP15889490 A JP 15889490A JP H0333027 A JPH0333027 A JP H0333027A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- glass
- glass paste
- manufacture
- pbo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 239000011521 glass Substances 0.000 title claims abstract description 30
- 239000000919 ceramic Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 11
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000020 Nitrocellulose Substances 0.000 claims abstract description 6
- 150000002148 esters Chemical class 0.000 claims abstract description 6
- 229920001220 nitrocellulos Polymers 0.000 claims abstract description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims abstract description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229940116411 terpineol Drugs 0.000 claims abstract description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 9
- 230000008018 melting Effects 0.000 abstract description 8
- 238000001035 drying Methods 0.000 abstract description 6
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 229930195733 hydrocarbon Natural products 0.000 description 7
- 150000002430 hydrocarbons Chemical class 0.000 description 7
- 239000000126 substance Substances 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000005394 sealing glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 ester alcohols Chemical class 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はセラミック基板の製作に使用するガラスペース
トに関するもので、特に低温で塑性可能なガラスペース
トに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a glass paste used for manufacturing ceramic substrates, and particularly to a glass paste that can be plasticized at low temperatures.
(従来の技術)
集積回路のパソケージ用アルミナ(Ah(h)基板の表
面に、ガラスを主成分とするペースト層を薄く塗布し、
これを可塑化させて得られるセラミック基板は、その表
面の粗さにおいて、封着ガラス自体の色相及び平滑性が
優れ、接着性が秀でる等の特長があり、基板の接合厚さ
をより薄くする用途に広く使われている。(Prior technology) A paste layer containing glass as the main component is applied thinly to the surface of an alumina (Ah(h)) substrate for use in integrated circuits.
Ceramic substrates obtained by plasticizing this have features such as the roughness of the surface, excellent hue and smoothness of the sealing glass itself, and excellent adhesive properties, making it possible to reduce the bonding thickness of the substrates. Widely used.
このような塑性セラミック基板を製造するためには、−
船釣に、アルミナ、バリウムその他、セラミック賞の基
板にPbO−BzOs−ZnO系の低融点ガラス組成粉
末とエチルセルロース又は、ニトロセルロース等の結合
体とイソアミルアセテート溶剤を混合してなるペースト
をスクリーン印刷法等によって塗布し、乾燥及び塑性工
程を経て、ガラスペーストをセラミック基板に接着させ
る方法が使用されている。In order to manufacture such a plastic ceramic substrate, −
For boat fishing, a screen printing method is used to apply a paste made by mixing a PbO-BzOs-ZnO based low melting point glass composition powder, a combination of ethyl cellulose or nitrocellulose, and an isoamyl acetate solvent onto a ceramic substrate such as alumina, barium, etc. A method is used in which a glass paste is applied to a ceramic substrate through a drying and plasticizing process, and then bonded to a ceramic substrate.
最近は印刷工程の単純化と作業者への有害性を考慮し、
常温以上の温度で揮発、分解し、長期間保管しながら使
用できるような方法で、各種の樹鮨詰合剤と高沸点溶剤
が使用されている。その種類としてはアクリル系の樹脂
及びエステル系のアルコール、ブチルセロソルブ等があ
る。これらは150℃〜200℃で溶剤が揮発し、30
0℃以上の高温で結合剤の分解、飛散が、酸化雰囲気で
成り立つのである。Recently, considering the simplification of the printing process and the danger to workers,
Various wood stuffing agents and high boiling point solvents are used in a way that volatilizes and decomposes at temperatures above room temperature and can be stored and used for long periods of time. The types include acrylic resin, ester alcohol, butyl cellosolve, etc. These solvents evaporate at 150°C to 200°C, and
The decomposition and scattering of the binder occurs at high temperatures of 0°C or higher in an oxidizing atmosphere.
(発明が解決しようとする課題)
このような従来のセラくツク基板用接合ペーストは、作
業性と有害性を考慮して高温(200〜330℃)、酸
化雰囲気中で乾燥し、可塑性にして基板の表面に接着す
る場合、炭化水素系の溶剤と接着剤の分解温度がペース
ト製造用の主原料であるガラス組成物の転移点、軟化点
よりも高いか、又は同しで、一定の昇温速度が合わなけ
れば、使用する溶剤と接着剤が未分解となり、炭化し、
セラミック基板又は接合内容物の表面に炭素物質が残留
するため、表面色相の黒色化と、これによる接着力、機
密性の劣化等の問題点が指摘されてきた。(Problems to be Solved by the Invention) Such conventional bonding pastes for ceramic substrates are dried in an oxidizing atmosphere at high temperatures (200 to 330 degrees Celsius) to make them plastic, in consideration of workability and toxicity. When adhering to the surface of a substrate, the decomposition temperature of the hydrocarbon solvent and adhesive is higher than or equal to the transition point or softening point of the glass composition, which is the main raw material for paste production, and a certain increase in temperature is required. If the temperature speeds do not match, the solvent and adhesive used will not decompose and will carbonize.
Since carbon substances remain on the surface of the ceramic substrate or the bonded contents, problems such as blackening of the surface color and deterioration of adhesive strength and airtightness due to this have been pointed out.
本発明はこのような問題点を解決するために、研究努力
した結果、接合用低融点ガラス組成物より転移点と軟化
状態が低い温度で分解されることにより、セラミック基
板の表面に炭化物質が残留しないビヒクルの新しいm酸
比率を見出し、これにより基板表面と内部的効果、即ち
、印刷性、乾燥速度、塑性速度等が秀でたセラミンク基
板用ペーストを得ることができた。従って、本発明はこ
のようなセラミンク基板用ペーストを提供することを目
的とする。In order to solve these problems, the present invention was developed as a result of research efforts, and by decomposing the transition point and softening state at a lower temperature than the low melting point glass composition for bonding, carbonized substances are formed on the surface of the ceramic substrate. We found a new m-acid ratio in a vehicle that does not leave any residue, and as a result, we were able to obtain a paste for ceramic substrates that has excellent substrate surface and internal effects, such as printability, drying speed, plasticity speed, etc. Therefore, an object of the present invention is to provide such a paste for ceramic substrates.
(課題を解決するための手段)
本発明は、イ)軟化温度が400℃以下であるPbO−
B2O3−ZnO系非結晶ガラス粉末70〜95重量%
と、口)メタクリル酸イソブチル樹脂とニトロセルロー
スとの混合物又は、これら各々を包含する結合剤1〜2
0重量%と、エステル系アルコール、エチレングリコー
ルモノブチルエーテル(以下、商品名のブチルセロソル
ブに略記)及びテルピネオールの群から選ばれる1種以
上の溶剤80〜99重量%とから構成するビヒクル5〜
30重量%とからなることを特徴とするセラミック基板
製作用ガラスペーストである。(Means for Solving the Problems) The present invention provides a) PbO-
B2O3-ZnO-based amorphous glass powder 70-95% by weight
and) A mixture of isobutyl methacrylate resin and nitrocellulose, or binders 1 to 2 containing each of these.
0% by weight, and 80 to 99% by weight of one or more solvents selected from the group of ester alcohols, ethylene glycol monobutyl ether (hereinafter abbreviated to the trade name butyl cellosolve), and terpineol.
30% by weight of the glass paste for manufacturing ceramic substrates.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明によるガラスペーストは、400℃以下の軟化点
をもつ低融点ガラス粉末と、炭化水素でなるビヒクルか
らなるガラス成形体で、該ビヒクルは結合剤及び溶剤か
らなる。The glass paste according to the present invention is a glass molded body made of a low-melting glass powder having a softening point of 400° C. or less and a vehicle made of a hydrocarbon, and the vehicle is made of a binder and a solvent.
本発明で使用する低融点接合用ガラスは、400℃以下
の軟化温度を持つPbQ−BzO+−ZnO系の非晶質
ガラス粉末で、その組成含量は、PbO60〜85%、
B20,5〜lO%、ZnO2〜25%、5i(h 1
〜15%、A1□035〜15%の割合で構成され、そ
の粒子の大きさは、100メツシユ以下のものを使用す
る。The low melting point bonding glass used in the present invention is a PbQ-BzO+-ZnO-based amorphous glass powder with a softening temperature of 400°C or less, and its composition content is 60 to 85% PbO,
B20, 5~1O%, ZnO2~25%, 5i (h 1
~15%, A1□035~15%, and the particle size used is 100 mesh or less.
本発明で使用するビヒクルは、300℃以下で充分に蒸
発、分解し、残留分は、化学的エネルギー活性度が低い
ので、封着ガラス中にある状態で加熱しても、封着物質
に化学的、物理的変化を起こさずにガラス粉末の粒子を
結合する性質が強く、また固体状態である炭化水素から
構成される。The vehicle used in the present invention sufficiently evaporates and decomposes at temperatures below 300°C, and the residual content has low chemical energy activity, so even if heated while still in the sealing glass, it will not cause chemical damage to the sealing material. It has a strong property of binding glass powder particles together without causing physical or physical changes, and is composed of hydrocarbons that are in a solid state.
このような性質を持つ炭化水素の例としては、分子式C
nHzn+z (n=15〜30)又は、C−B211
−2 (n=15〜30) 、Cn)12,1(n=
6〜24)で表されるものを挙げることができるが、こ
こでC4IH2n*2、又はCnfhn−zの炭素数が
15未満であれば、常温で固体状態でも、炭素数が30
を越えると、加熱時に接着層中に炭素が残留して表面が
黒くなり、気泡が発生することがあり好ましくない。又
、C,In2.、の炭素数が6未満では常温で固体化が
起こり、24を越えると加熱時に接着層中で炭素が残留
し、気泡が残るようになる。An example of a hydrocarbon with such properties is the molecular formula C
nHzn+z (n=15-30) or C-B211
-2 (n=15~30), Cn)12,1(n=
6 to 24), but here, if the number of carbon atoms in C4IH2n*2 or Cnfhn-z is less than 15, even in a solid state at room temperature, the number of carbon atoms is 30.
If it exceeds this value, carbon may remain in the adhesive layer during heating, resulting in a black surface and generation of bubbles, which is undesirable. Also, C, In2. If the number of carbon atoms in , is less than 6, solidification will occur at room temperature, and if it exceeds 24, carbon will remain in the adhesive layer upon heating, and bubbles will remain.
このような条件を満足させる炭化水素の例を挙げてみる
と、結合剤として使用できるメタクリル酸イソブチル樹
脂、ニトロセルロース等と、溶剤として使用できるエス
テル系アルコール溶剤、ブチルセロソルブ、テルピネオ
ール等がある。Examples of hydrocarbons that satisfy these conditions include isobutyl methacrylate resin, nitrocellulose, etc., which can be used as a binder, and ester alcohol solvents, butyl cellosolve, terpineol, etc., which can be used as a solvent.
本発明における結合剤および溶剤を使用しないで、従来
の一般的樹脂系結合剤を使用する場合、耐久性、接着力
は大きいが、要求する分解飛散範囲が広く、残留炭化水
素が多いという欠点があって、高集積度が要求される用
途に使用するには制限を受ける。When a conventional general resin binder is used instead of the binder and solvent used in the present invention, the durability and adhesive strength are high, but there are drawbacks such as a wide range of required decomposition and scattering, and a large amount of residual hydrocarbons. Therefore, it is limited in its use in applications requiring a high degree of integration.
一方、本発明によるビヒクル溶液は1〜20%の結合剤
と80〜99%の溶剤とからなるが、接合剤の濃度が1
%より低ければ、低融点ガラス粉末の成形、結合力が落
ち、20%より高い場合には塑性後に残留分があり、こ
れが表面状態に遊離されて、封着する過程で封着力が落
ち、セラミック基板との界面に気泡を生成する主原因と
なる。On the other hand, the vehicle solution according to the present invention consists of 1-20% binder and 80-99% solvent;
If it is lower than 20%, the molding and bonding strength of the low melting point glass powder will be reduced, and if it is higher than 20%, there will be a residue after plasticity, which will be liberated on the surface and the sealing strength will drop during the sealing process. This is the main cause of bubble formation at the interface with the substrate.
本発明によるガラスペーストをセラミック基板に接合さ
せる際に、ガラスペーストに少量のエステル系又は、エ
ーテル系溶剤を添加した後、シルクスクリーン印刷法に
よって、組成物の成形棒を製造し、これを乾燥し、まず
溶剤を蒸発させて分解させた後、塑性にする方法で所定
の成形物体をセラミック基板に接着させる。When bonding the glass paste according to the present invention to a ceramic substrate, after adding a small amount of ester or ether solvent to the glass paste, a molded rod of the composition is manufactured by silk screen printing method, and this is dried. First, the solvent is evaporated and decomposed, and then the predetermined molded object is bonded to the ceramic substrate using a plasticizing method.
(発明の効果)
本発明によれば、特に低温で塑性可能であり、セラミッ
ク基板表面に炭化物質が残留しないので優れた基板表面
が得られ、印刷性、乾燥速度、塑性速度等に優れたセラ
ミック基板製作用ガラスペーストを提供することができ
る。(Effects of the Invention) According to the present invention, a ceramic substrate that can be plasticized particularly at low temperatures, has no carbonized substance remaining on the surface of the ceramic substrate, provides an excellent substrate surface, and has excellent printability, drying speed, plasticity speed, etc. A glass paste for manufacturing a substrate can be provided.
(実施例) 以下、本発明を実施例に基づき具体的に説明する。(Example) Hereinafter, the present invention will be specifically explained based on Examples.
実施例1
エステル系アルコール(商品名、TEXANOL: C
+zHz40*)溶剤200gに、アクリル系樹脂結合
剤(商品名、ELVACIT11! 2045 :メタ
クリル酸イソブチルCaHzO□)50gを溶かし、粘
度変化が起こらない時点まで熟成した後、さらに溶剤2
00gを加えた。Example 1 Ester alcohol (trade name, TEXANOL: C
+zHz40*) 50g of acrylic resin binder (trade name, ELVACIT11! 2045: isobutyl methacrylate CaHzO□) was dissolved in 200g of solvent, and after aging until no viscosity change occurred, further dissolved in solvent 2
00g was added.
続いて、PbO60〜85%、B、0.5〜20%、Z
n0z 25%、Sing 1〜15%、Al2O35
〜15%の重量比でなるPbO−BxQ*−ZnO系の
低融点ガラス(軟化点380℃)粉末400gを加え、
3時間混合し、生成物質の層分離が起こらないように、
回転速度が5〜20のローラーを用いて7日間充分に熟
成させた。Subsequently, PbO 60-85%, B, 0.5-20%, Z
n0z 25%, Sing 1-15%, Al2O35
Add 400 g of PbO-BxQ*-ZnO-based low melting point glass (softening point 380°C) powder with a weight ratio of ~15%,
Mix for 3 hours to avoid layer separation of the product.
It was fully aged for 7 days using a roller with a rotation speed of 5-20.
これをセラミック基板形体と同一形状のマスクの上に置
いて、下部に位置するセラくソク物体に印刷した後、酸
化雰囲気で100℃〜200℃の温度で5〜15分間乾
燥し、さらに塑性炉で接着剤を分解、飛散させた後、軟
化温度より約30℃高く保つことによって、セラミック
基板と結合させた。This was placed on a mask with the same shape as the ceramic substrate shape, printed on the ceramic material located below, and then dried in an oxidizing atmosphere at a temperature of 100°C to 200°C for 5 to 15 minutes, and further in a plastic furnace. After the adhesive was decomposed and scattered, it was bonded to a ceramic substrate by maintaining the adhesive at about 30° C. higher than the softening temperature.
上記の方法で接着剤と溶剤の熟成後の粘度は、25℃で
4000センチポアズであった。又、低融点ガラス粉末
を混合して十分に熟成した後の粘度は25℃で15万セ
ンチポアズであった。The viscosity of the adhesive and solvent after aging in the above method was 4000 centipoise at 25°C. Further, the viscosity after mixing the low melting point glass powder and sufficiently ripening was 150,000 centipoise at 25°C.
又、印刷成形後の乾燥温度は、100℃、130℃、1
50℃、170℃、190℃、200℃で各々5分、1
0分、15分、20分間乾燥した後、再び、380℃、
400℃、420℃、450℃まで昇温して、ガラス粉
末粒子を塑性にした。In addition, the drying temperature after printing molding is 100℃, 130℃, 1
5 minutes each at 50℃, 170℃, 190℃, 200℃, 1
After drying for 0 minutes, 15 minutes, and 20 minutes, dry at 380°C again.
The glass powder particles were made plastic by increasing the temperature to 400°C, 420°C, and 450°C.
実施例2〜7
結合剤及び溶剤の組成を、次の表1のように変化させた
以外は、上記実施例1と同様の方法で実施した。Examples 2 to 7 Examples were carried out in the same manner as in Example 1 above, except that the compositions of the binder and solvent were changed as shown in Table 1 below.
上記実施例1〜7によって製造したセラミック基板に対
して有機炭化水素の残留分による内部気泡(pore)
の程度を確認するため、各破断面を走査電子顕微鏡で分
析し、接着組成物の表面変色程度を肉眼で観察した。そ
の結果を次の表1に比較して示した。Internal pores due to residual organic hydrocarbons in the ceramic substrates manufactured according to Examples 1 to 7 above.
In order to confirm the degree of discoloration, each fracture surface was analyzed using a scanning electron microscope, and the degree of surface discoloration of the adhesive composition was observed with the naked eye. The results are shown in Table 1 below.
I:メタクリル酸イソブチル樹脂
N:ニトロセルロース
E:エステル系アルコール
Bニブチルセロソルブ
T:テルピネオール(TERPINBOL)表1から判
るように、本発明によるセラミック基板製作用ガラスペ
ーストは、従来の高い温度が要求された分解、飛散温度
を400℃程度に下げ、低エネルギーと残留量の減少に
よって、表面パターンが優秀であり、内部気孔が少なく
、接着強度を大いに向上させることができた。I: Isobutyl methacrylate resin N: Nitrocellulose E: Ester-based alcohol B Nibutyl cellosolve T: Terpineol (TERPINBOL) As can be seen from Table 1, the glass paste for manufacturing ceramic substrates according to the present invention requires a high temperature compared to the conventional one. The decomposition and scattering temperature was lowered to about 400°C, and the low energy and residual amount resulted in an excellent surface pattern, fewer internal pores, and greatly improved adhesive strength.
Claims (1)
3−ZnO系非結晶ガラス粉末70〜95重量%と、 ロ)メタクリル酸イソブチル樹脂とニトロセルロースと
の混合物又は、これら各々を包含する結合剤1〜20重
量%と、エステル系アルコール、エチレングリコールモ
ノブチルエーテル及びテルピネオールの群から選ばれる
1種以上の溶剤80〜99重量%とから構成するビヒク
ル5〜30重量%と からなることを特徴とするセラミック基板製作用ガラス
ペースト。[Claims] A) PbO-B_2O_ whose softening temperature is 400°C or less
3-70 to 95% by weight of ZnO-based amorphous glass powder, b) a mixture of isobutyl methacrylate resin and nitrocellulose, or 1 to 20% by weight of a binder containing each of these, and ester-based alcohol, ethylene glycol monomer. A glass paste for producing ceramic substrates, characterized in that it comprises 80-99% by weight of one or more solvents selected from the group of butyl ether and terpineol, and 5-30% by weight of a vehicle.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890008429A KR910000555A (en) | 1989-06-19 | 1989-06-19 | Glass Paste for Ceramic Substrate |
KR8429 | 1989-06-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0333027A true JPH0333027A (en) | 1991-02-13 |
Family
ID=19287222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2158894A Pending JPH0333027A (en) | 1989-06-19 | 1990-06-19 | Glass paste for manufacture of ceramic substrate |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0333027A (en) |
KR (1) | KR910000555A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374692A (en) * | 2011-09-29 | 2012-03-14 | 浙江工商大学 | Power-plant waste-heat recovering device |
CN102435015A (en) * | 2011-09-29 | 2012-05-02 | 浙江工商大学 | Condensation heat recovery device in power station |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102637914B1 (en) * | 2023-04-05 | 2024-02-20 | 염재호 | safety unit for milling machine |
-
1989
- 1989-06-19 KR KR1019890008429A patent/KR910000555A/en not_active Application Discontinuation
-
1990
- 1990-06-19 JP JP2158894A patent/JPH0333027A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374692A (en) * | 2011-09-29 | 2012-03-14 | 浙江工商大学 | Power-plant waste-heat recovering device |
CN102435015A (en) * | 2011-09-29 | 2012-05-02 | 浙江工商大学 | Condensation heat recovery device in power station |
Also Published As
Publication number | Publication date |
---|---|
KR910000555A (en) | 1991-01-29 |
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