JPS62119947A - 集積回路素子の冷却装置 - Google Patents

集積回路素子の冷却装置

Info

Publication number
JPS62119947A
JPS62119947A JP25928485A JP25928485A JPS62119947A JP S62119947 A JPS62119947 A JP S62119947A JP 25928485 A JP25928485 A JP 25928485A JP 25928485 A JP25928485 A JP 25928485A JP S62119947 A JPS62119947 A JP S62119947A
Authority
JP
Japan
Prior art keywords
heat transfer
integrated circuit
protrusions
center
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25928485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334231B2 (enrdf_load_html_response
Inventor
Masahiro Suzuki
正博 鈴木
Haruhiko Yamamoto
治彦 山本
Yoshiaki Udagawa
宇田川　義明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP25928485A priority Critical patent/JPS62119947A/ja
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to US06/914,942 priority patent/US4879632A/en
Priority to DE19863650687 priority patent/DE3650687T2/de
Priority to EP92100517A priority patent/EP0484320B1/en
Priority to EP86307669A priority patent/EP0217676B1/en
Priority to EP92100518A priority patent/EP0483108B1/en
Priority to DE19863650719 priority patent/DE3650719T2/de
Publication of JPS62119947A publication Critical patent/JPS62119947A/ja
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/079,877 priority patent/US4783721A/en
Publication of JPH0334231B2 publication Critical patent/JPH0334231B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP25928485A 1985-10-04 1985-11-19 集積回路素子の冷却装置 Granted JPS62119947A (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP25928485A JPS62119947A (ja) 1985-11-19 1985-11-19 集積回路素子の冷却装置
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
DE19863650687 DE3650687T2 (de) 1985-10-04 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis
EP92100517A EP0484320B1 (en) 1985-11-19 1986-10-03 Cooling modules for electronic circuit devices
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP92100518A EP0483108B1 (en) 1985-10-04 1986-10-03 Cooling modules for electronic circuit components
DE19863650719 DE3650719T2 (de) 1985-11-19 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25928485A JPS62119947A (ja) 1985-11-19 1985-11-19 集積回路素子の冷却装置

Publications (2)

Publication Number Publication Date
JPS62119947A true JPS62119947A (ja) 1987-06-01
JPH0334231B2 JPH0334231B2 (enrdf_load_html_response) 1991-05-21

Family

ID=17331946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25928485A Granted JPS62119947A (ja) 1985-10-04 1985-11-19 集積回路素子の冷却装置

Country Status (1)

Country Link
JP (1) JPS62119947A (enrdf_load_html_response)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4220732A1 (de) * 1991-06-26 1993-01-14 Hitachi Ltd Halbleiterkuehleinrichtung
US5365400A (en) * 1988-09-09 1994-11-15 Hitachi, Ltd. Heat sinks and semiconductor cooling device using the heat sinks
WO2003063241A3 (en) * 2002-01-22 2004-04-01 Rini Technologies Inc Method and apparatus for high heat flux heat transfer
US6993926B2 (en) 2001-04-26 2006-02-07 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US7654100B2 (en) 2001-04-26 2010-02-02 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US8100169B2 (en) 2002-02-01 2012-01-24 Rini Technologies, Inc. Spray nozzle apparatus and method of use

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365400A (en) * 1988-09-09 1994-11-15 Hitachi, Ltd. Heat sinks and semiconductor cooling device using the heat sinks
DE4220732A1 (de) * 1991-06-26 1993-01-14 Hitachi Ltd Halbleiterkuehleinrichtung
US6993926B2 (en) 2001-04-26 2006-02-07 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US7654100B2 (en) 2001-04-26 2010-02-02 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US7921664B2 (en) 2001-04-26 2011-04-12 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
WO2003063241A3 (en) * 2002-01-22 2004-04-01 Rini Technologies Inc Method and apparatus for high heat flux heat transfer
US8100169B2 (en) 2002-02-01 2012-01-24 Rini Technologies, Inc. Spray nozzle apparatus and method of use
US8104533B2 (en) 2002-02-01 2012-01-31 Rini Technologies, Inc. Spray nozzle apparatus and method of use

Also Published As

Publication number Publication date
JPH0334231B2 (enrdf_load_html_response) 1991-05-21

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