JPS62118446U - - Google Patents

Info

Publication number
JPS62118446U
JPS62118446U JP600886U JP600886U JPS62118446U JP S62118446 U JPS62118446 U JP S62118446U JP 600886 U JP600886 U JP 600886U JP 600886 U JP600886 U JP 600886U JP S62118446 U JPS62118446 U JP S62118446U
Authority
JP
Japan
Prior art keywords
layer wiring
contact hole
lower layer
wiring
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP600886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP600886U priority Critical patent/JPS62118446U/ja
Publication of JPS62118446U publication Critical patent/JPS62118446U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の多層配線の接続構造の一実施
例を示す断面図、第2図は本考案を採用し得る液
晶表示器の要部平面図、第3図は従来の多層配線
の接続構造を示す断面図である。 1…ドレイン、6…ドレイン外部取り出し端子
、7…絶縁層、H…コンタクトホール。
Fig. 1 is a cross-sectional view showing an embodiment of the multilayer wiring connection structure of the present invention, Fig. 2 is a plan view of the main part of a liquid crystal display to which the present invention can be applied, and Fig. 3 is a conventional multilayer wiring connection. FIG. 3 is a cross-sectional view showing the structure. 1...Drain, 6...Drain external extraction terminal, 7...Insulating layer, H...Contact hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁層を介して上下に位置する下層配線と上層
配線とを接続する構造に於いて、下層配線上の絶
縁層に上方に向つて開口が広がるコンタクトホー
ルが設けられており、該コンタクトホールから露
出した下層配線上に上層配線をコンタクトした事
を特徴とする多層配線の接続構造。
In a structure in which lower layer wiring and upper layer wiring located above and below are connected via an insulating layer, a contact hole whose opening widens upward is provided in the insulating layer on the lower layer wiring, and the contact hole is exposed through the contact hole. A multilayer wiring connection structure characterized by contacting an upper layer wiring onto a lower layer wiring.
JP600886U 1986-01-20 1986-01-20 Pending JPS62118446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP600886U JPS62118446U (en) 1986-01-20 1986-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP600886U JPS62118446U (en) 1986-01-20 1986-01-20

Publications (1)

Publication Number Publication Date
JPS62118446U true JPS62118446U (en) 1987-07-28

Family

ID=30788117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP600886U Pending JPS62118446U (en) 1986-01-20 1986-01-20

Country Status (1)

Country Link
JP (1) JPS62118446U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03251457A (en) * 1990-02-28 1991-11-08 Canon Inc Recorder and recording head

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025306A (en) * 1973-07-06 1975-03-18
JPS50114172A (en) * 1974-02-15 1975-09-06
JPS53105991A (en) * 1977-02-28 1978-09-14 Oki Electric Ind Co Ltd Mamufacture of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025306A (en) * 1973-07-06 1975-03-18
JPS50114172A (en) * 1974-02-15 1975-09-06
JPS53105991A (en) * 1977-02-28 1978-09-14 Oki Electric Ind Co Ltd Mamufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03251457A (en) * 1990-02-28 1991-11-08 Canon Inc Recorder and recording head

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