JPS62118435U - - Google Patents
Info
- Publication number
- JPS62118435U JPS62118435U JP1986004827U JP482786U JPS62118435U JP S62118435 U JPS62118435 U JP S62118435U JP 1986004827 U JP1986004827 U JP 1986004827U JP 482786 U JP482786 U JP 482786U JP S62118435 U JPS62118435 U JP S62118435U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- base
- bonding device
- adhered
- thermocompression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004827U JPS62118435U (enrdf_load_html_response) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986004827U JPS62118435U (enrdf_load_html_response) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118435U true JPS62118435U (enrdf_load_html_response) | 1987-07-28 |
Family
ID=30785851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986004827U Pending JPS62118435U (enrdf_load_html_response) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118435U (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262059A (ja) * | 1988-08-29 | 1990-03-01 | Hitachi Ltd | 半導体装置の製造方法及び装置 |
-
1986
- 1986-01-17 JP JP1986004827U patent/JPS62118435U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262059A (ja) * | 1988-08-29 | 1990-03-01 | Hitachi Ltd | 半導体装置の製造方法及び装置 |