JPS62118435U - - Google Patents

Info

Publication number
JPS62118435U
JPS62118435U JP1986004827U JP482786U JPS62118435U JP S62118435 U JPS62118435 U JP S62118435U JP 1986004827 U JP1986004827 U JP 1986004827U JP 482786 U JP482786 U JP 482786U JP S62118435 U JPS62118435 U JP S62118435U
Authority
JP
Japan
Prior art keywords
thermocompression bonding
base
bonding device
adhered
thermocompression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986004827U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986004827U priority Critical patent/JPS62118435U/ja
Publication of JPS62118435U publication Critical patent/JPS62118435U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1986004827U 1986-01-17 1986-01-17 Pending JPS62118435U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986004827U JPS62118435U (cs) 1986-01-17 1986-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986004827U JPS62118435U (cs) 1986-01-17 1986-01-17

Publications (1)

Publication Number Publication Date
JPS62118435U true JPS62118435U (cs) 1987-07-28

Family

ID=30785851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986004827U Pending JPS62118435U (cs) 1986-01-17 1986-01-17

Country Status (1)

Country Link
JP (1) JPS62118435U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262059A (ja) * 1988-08-29 1990-03-01 Hitachi Ltd 半導体装置の製造方法及び装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262059A (ja) * 1988-08-29 1990-03-01 Hitachi Ltd 半導体装置の製造方法及び装置

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