JPS62118266U - - Google Patents

Info

Publication number
JPS62118266U
JPS62118266U JP1986006698U JP669886U JPS62118266U JP S62118266 U JPS62118266 U JP S62118266U JP 1986006698 U JP1986006698 U JP 1986006698U JP 669886 U JP669886 U JP 669886U JP S62118266 U JPS62118266 U JP S62118266U
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
protruding electrode
drive
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986006698U
Other languages
English (en)
Other versions
JPH0447739Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986006698U priority Critical patent/JPH0447739Y2/ja
Publication of JPS62118266U publication Critical patent/JPS62118266U/ja
Application granted granted Critical
Publication of JPH0447739Y2 publication Critical patent/JPH0447739Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す平面図、第２図
は第１図の要部断面図、第３図は第１図の要部平
面図、第４図は他の実施例の要部平面図である。 １……液晶表示体、２……ガラス基板、４……
パターン電極群、５……駆動ＩＣ、６……駆動Ｉ
Ｃの突起電極、７……導電接着剤、８……エポキ
シ樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 突起電極を有する駆動ＩＣチツプが、該突起電
    極を介して導電接着剤にて液晶表示体のガラス基
    板上にフエイスダウンボンデイングされている液
    晶表示装置において、該導電接着剤と該ガラス基
    板の接着面積Ｓ２が、前記突起電極の外形面積Ｓ
    １の約１．５倍以上に形成されている事を特徴と
    する液晶表示装置の駆動ＩＣ実装構造。
JP1986006698U 1986-01-21 1986-01-21 Expired JPH0447739Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986006698U JPH0447739Y2 (ja) 1986-01-21 1986-01-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986006698U JPH0447739Y2 (ja) 1986-01-21 1986-01-21

Publications (2)

Publication Number Publication Date
JPS62118266U true JPS62118266U (ja) 1987-07-27
JPH0447739Y2 JPH0447739Y2 (ja) 1992-11-11

Family

ID=30789455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986006698U Expired JPH0447739Y2 (ja) 1986-01-21 1986-01-21

Country Status (1)

Country Link
JP (1) JPH0447739Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01226161A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 半導体チップの接続方法
JPH06224259A (ja) * 1992-11-18 1994-08-12 Matsushita Electron Corp 半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189626U (ja) * 1984-03-15 1984-12-15 セイコーエプソン株式会社 腕時計用液晶表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189626U (ja) * 1984-03-15 1984-12-15 セイコーエプソン株式会社 腕時計用液晶表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01226161A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 半導体チップの接続方法
JPH06224259A (ja) * 1992-11-18 1994-08-12 Matsushita Electron Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPH0447739Y2 (ja) 1992-11-11

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