JPS63165624U - - Google Patents
Info
- Publication number
- JPS63165624U JPS63165624U JP1987057422U JP5742287U JPS63165624U JP S63165624 U JPS63165624 U JP S63165624U JP 1987057422 U JP1987057422 U JP 1987057422U JP 5742287 U JP5742287 U JP 5742287U JP S63165624 U JPS63165624 U JP S63165624U
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- core
- display device
- protruding electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
図はいずれも本考案の実施例を示し、第1図は
駆動ICの電極上に突起電極を形成した部分図、
第2図は液晶表示装置のガラス基板上に形成され
た電極上に、導電性接着剤を介して第1図に示し
た駆動ICを加圧フエイスダウンボンデイングし
、樹脂封止をした断面図。 1……駆動IC、2……突起電極、3……導電
性接着剤、4……電極群、5……ガラス基板、6
……封止樹脂、7……液晶物質、8……液晶封止
樹脂、21……核、22……導電層。
駆動ICの電極上に突起電極を形成した部分図、
第2図は液晶表示装置のガラス基板上に形成され
た電極上に、導電性接着剤を介して第1図に示し
た駆動ICを加圧フエイスダウンボンデイングし
、樹脂封止をした断面図。 1……駆動IC、2……突起電極、3……導電
性接着剤、4……電極群、5……ガラス基板、6
……封止樹脂、7……液晶物質、8……液晶封止
樹脂、21……核、22……導電層。
Claims (1)
- 突起電極を形成した駆動ICを有機系接着剤に
よつて液晶表示体のガラス基板上に直接フエイス
ダウンボンデイングして成る液晶表示装置におい
て、前駆動ICの突起電極が硬度Hv20以下の
軟質金属材料からなる核と、該核を覆う如く形成
したAuあるいはCuのような耐食性金属からな
る導電層とからなる層構造を持つことを特徴とす
る液晶表示装置のIC実装構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987057422U JPS63165624U (ja) | 1987-04-17 | 1987-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987057422U JPS63165624U (ja) | 1987-04-17 | 1987-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63165624U true JPS63165624U (ja) | 1988-10-28 |
Family
ID=30887107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987057422U Pending JPS63165624U (ja) | 1987-04-17 | 1987-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63165624U (ja) |
-
1987
- 1987-04-17 JP JP1987057422U patent/JPS63165624U/ja active Pending
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