JPS6211780B2 - - Google Patents
Info
- Publication number
- JPS6211780B2 JPS6211780B2 JP56067911A JP6791181A JPS6211780B2 JP S6211780 B2 JPS6211780 B2 JP S6211780B2 JP 56067911 A JP56067911 A JP 56067911A JP 6791181 A JP6791181 A JP 6791181A JP S6211780 B2 JPS6211780 B2 JP S6211780B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- lens barrel
- marks
- mask
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 26
- 235000012431 wafers Nutrition 0.000 description 70
- 230000007246 mechanism Effects 0.000 description 14
- 230000008569 process Effects 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 238000001259 photo etching Methods 0.000 description 3
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000001393 microlithography Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56067911A JPS57183033A (en) | 1981-05-06 | 1981-05-06 | Method for wafer exposure and device thereof |
US06/373,629 US4613230A (en) | 1981-05-06 | 1982-04-30 | Wafer exposure apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56067911A JPS57183033A (en) | 1981-05-06 | 1981-05-06 | Method for wafer exposure and device thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57183033A JPS57183033A (en) | 1982-11-11 |
JPS6211780B2 true JPS6211780B2 (ko) | 1987-03-14 |
Family
ID=13358557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56067911A Granted JPS57183033A (en) | 1981-05-06 | 1981-05-06 | Method for wafer exposure and device thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57183033A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59143159A (ja) * | 1983-02-07 | 1984-08-16 | Mitsubishi Electric Corp | 写真製版技術におけるパタ−ン重ね合わせ方法 |
NL8600639A (nl) * | 1986-03-12 | 1987-10-01 | Asm Lithography Bv | Werkwijze voor het ten opzichte van elkaar uitrichten van een masker en een substraat en inrichting voor het uitvoeren van de werkwijze. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339175A (en) * | 1976-09-21 | 1978-04-10 | Smiths Industries Ltd | Optical apparatus |
JPS5347270A (en) * | 1976-10-12 | 1978-04-27 | Nec Home Electronics Ltd | Semiconductor waver protecting film |
JPS546816A (en) * | 1977-06-20 | 1979-01-19 | Kobe Steel Ltd | Prevention of pouriggnozzle blockade |
JPS55132039A (en) * | 1979-04-02 | 1980-10-14 | Mitsubishi Electric Corp | Forming method for repeated figure |
JPS566437A (en) * | 1979-06-26 | 1981-01-23 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Alignment |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4863046U (ko) * | 1971-11-16 | 1973-08-10 |
-
1981
- 1981-05-06 JP JP56067911A patent/JPS57183033A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339175A (en) * | 1976-09-21 | 1978-04-10 | Smiths Industries Ltd | Optical apparatus |
JPS5347270A (en) * | 1976-10-12 | 1978-04-27 | Nec Home Electronics Ltd | Semiconductor waver protecting film |
JPS546816A (en) * | 1977-06-20 | 1979-01-19 | Kobe Steel Ltd | Prevention of pouriggnozzle blockade |
JPS55132039A (en) * | 1979-04-02 | 1980-10-14 | Mitsubishi Electric Corp | Forming method for repeated figure |
JPS566437A (en) * | 1979-06-26 | 1981-01-23 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Alignment |
Also Published As
Publication number | Publication date |
---|---|
JPS57183033A (en) | 1982-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE36731E (en) | Method of forming pattern and projection aligner for carrying out the same | |
US5331371A (en) | Alignment and exposure method | |
US5905020A (en) | Method and apparatus for reducing the critical dimension difference of features printed on a substrate | |
US6218077B1 (en) | Method of manufacturing an integrated circuit using a scanning system and a scanning system | |
JPH06124872A (ja) | 像形成方法及び該方法を用いて半導体装置を製造する方法 | |
US4397543A (en) | Mask for imaging a pattern of a photoresist layer, method of making said mask, and use thereof in a photolithographic process | |
JPH0450730B2 (ko) | ||
US6163368A (en) | Method and apparatus for performing a double shift print on a substrate | |
JP3097620B2 (ja) | 走査型縮小投影露光装置 | |
US4613230A (en) | Wafer exposure apparatus | |
US4561773A (en) | Projection exposure apparatus | |
JPS6211780B2 (ko) | ||
Mayer et al. | A new step-by-step aligner for very large scale integration (VLSI) production | |
JP2756862B2 (ja) | 露光装置 | |
JP2904269B2 (ja) | アライメントマークおよびアライメント方法 | |
JPH11150054A (ja) | ミックスアンドマッチ露光方法 | |
US6278123B1 (en) | Reducing the critical dimension difference of features printed on a substrate | |
US6809800B2 (en) | Apparatus for patterning a semiconductor wafer | |
KR100596270B1 (ko) | 얼라인 마크 및 얼라인 방법 | |
JP7513823B1 (ja) | 露光装置、及び露光方法 | |
US20070072128A1 (en) | Method of manufacturing an integrated circuit to obtain uniform exposure in a photolithographic process | |
JPH09246144A (ja) | 半導体素子の製造方法と半導体素子用露光装置およびこれを用いて作製した半導体素子 | |
JPS6258139B2 (ko) | ||
JPH11145040A (ja) | 走査型露光装置及びアライメント方法 | |
JP2946637B2 (ja) | 投影露光方法 |