JPS62116545U - - Google Patents

Info

Publication number
JPS62116545U
JPS62116545U JP438186U JP438186U JPS62116545U JP S62116545 U JPS62116545 U JP S62116545U JP 438186 U JP438186 U JP 438186U JP 438186 U JP438186 U JP 438186U JP S62116545 U JPS62116545 U JP S62116545U
Authority
JP
Japan
Prior art keywords
substrates
insulating film
conductive path
metal substrate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP438186U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423321Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP438186U priority Critical patent/JPH0423321Y2/ja
Publication of JPS62116545U publication Critical patent/JPS62116545U/ja
Application granted granted Critical
Publication of JPH0423321Y2 publication Critical patent/JPH0423321Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP438186U 1986-01-16 1986-01-16 Expired JPH0423321Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP438186U JPH0423321Y2 (https=) 1986-01-16 1986-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP438186U JPH0423321Y2 (https=) 1986-01-16 1986-01-16

Publications (2)

Publication Number Publication Date
JPS62116545U true JPS62116545U (https=) 1987-07-24
JPH0423321Y2 JPH0423321Y2 (https=) 1992-05-29

Family

ID=30784995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP438186U Expired JPH0423321Y2 (https=) 1986-01-16 1986-01-16

Country Status (1)

Country Link
JP (1) JPH0423321Y2 (https=)

Also Published As

Publication number Publication date
JPH0423321Y2 (https=) 1992-05-29

Similar Documents

Publication Publication Date Title
JPS62116545U (https=)
JPS61207041U (https=)
JPS6398653U (https=)
JPS62118439U (https=)
JPH02136301U (https=)
JPS6287449U (https=)
JPS6398647U (https=)
JPS62116544U (https=)
JPS62118438U (https=)
JPH0292950U (https=)
JPS62168677U (https=)
JPH0233426U (https=)
JPS63131194U (https=)
JPS6398652U (https=)
JPS6312840U (https=)
JPS62118440U (https=)
JPS62182576U (https=)
JPS6452260U (https=)
JPS6265863U (https=)
JPS60175486U (ja) プラスチツク製の面状発熱体
JPH01174940U (https=)
JPS62131448U (https=)
JPS6054342U (ja) 半導体装置
JPS6398651U (https=)
JPS6374802U (https=)