JPS62114457U - - Google Patents

Info

Publication number
JPS62114457U
JPS62114457U JP1986001468U JP146886U JPS62114457U JP S62114457 U JPS62114457 U JP S62114457U JP 1986001468 U JP1986001468 U JP 1986001468U JP 146886 U JP146886 U JP 146886U JP S62114457 U JPS62114457 U JP S62114457U
Authority
JP
Japan
Prior art keywords
resin
lead frame
connecting piece
molded semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986001468U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986001468U priority Critical patent/JPS62114457U/ja
Publication of JPS62114457U publication Critical patent/JPS62114457U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/753
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986001468U 1986-01-09 1986-01-09 Pending JPS62114457U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986001468U JPS62114457U (enExample) 1986-01-09 1986-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986001468U JPS62114457U (enExample) 1986-01-09 1986-01-09

Publications (1)

Publication Number Publication Date
JPS62114457U true JPS62114457U (enExample) 1987-07-21

Family

ID=30779405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986001468U Pending JPS62114457U (enExample) 1986-01-09 1986-01-09

Country Status (1)

Country Link
JP (1) JPS62114457U (enExample)

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