JPS62111240A - Production of liquid crystal display panel - Google Patents

Abstract

PURPOSE:To connect directly the wirings of LCD panels to one another and to facilitate forming a display panel by matching the relative positions of solder electrodes to join liquid crystal panels to one another. CONSTITUTION:A foundation metallic plating layer 16 is formed selectively on the pattern group of electrode terminals 2 of the LCD panels, where a liquid crystal 15 is sealed in picture element areas 5, and through holes 12 formed in the same parts. A solder foundation metallic layer is laminated on the foundation metallic plating layer 16 as short bar patterns 13, and solder foundation metallic electrodes 17 are formed on all of the inside wall face of the through holes 12. A solder is stuck to the surface of the pattern group of electrode terminals 2 on the solder foundation metallic electrodes and is packed in the through holes 12 to constitute solder electrodes 18 in the same parts. Excess and parts 19 are cut away from a main substrate glass 10, where the solder electrodes 18 are provided in through the holes 12, along the center lines of the through holes 12 to obtain a semicircular solder electrodes 18 on end wall faces 11. In case that a multipanel is constituted, the relative positions of respective semicircular solder electrodes 18 of the 4 LCD panels 1a-1d are matched to stick them to one another.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a display device using a liquid crystal display panel (hereinafter abbreviated as an LCD panel), and particularly to a large f display device constructed by bonding a plurality of LCD panels together. Regarding the IJG method of suitable LCD panels.

Displays using conventional technology LCD panels are thin, lightweight,
Although it is attracting attention as a low power consumption display, it is difficult to fabricate a large LCD panel due to manufacturing technology issues. Therefore, in order to construct a large display, a so-called multi-panel method, in which a plurality of LCD panels are arranged in a plane and bonded together, is employed.

In this method in which multiple LCD panels are bonded together, it is necessary to connect the pixel control wiring conductors, that is, the scanning lines and signal wiring, which control the pixels in each partially closed LCD panel, to external control circuits. . For example, as shown in Figure 5,
At the joint between the LCD panel 1a and the LCD panel 1b, a pixel control wiring conductor 4 made of a flexible wiring film 3 or the like is connected to each electrode terminal 2 formed at the end of each LCD panel la, lb. A method is used in which the flexible wiring film 3 is pulled out in a direction perpendicular to the main surface of the panel 1 and connected to the Gato@ control circuit board (not shown), and the electrodes, including the form of the connection part, are , the wiring structure becomes complicated, which is one of the factors that makes it difficult to manufacture multi-panel displays.

In FIG. 5, 5 indicates a pixel display area of the CD panel, 6 indicates a liquid crystal sealing resin layer, and 7 indicates a plurality of LCD panels la.
, 1b are shown as reinforcing transparent substrates when bonding them together.

Problems to be Solved by the Invention As mentioned above, when constructing a multi-panel display using a plurality of LCD panels, it is necessary to directly connect pixel control wiring for controlling and driving the pixels of each LCD panel to each LCD panel. By eliminating the complication of attaching the LCD panels and making it possible to directly connect the wiring between the LCD panels at the end faces of the panels, the manufacturing of the display panel can be facilitated.

Means for Solving the Problems In order to solve the above problems, the forming pitch of the electrode terminal patterns is preliminarily adjusted in the external connection electrode terminal pattern forming area of the main glass substrate forming the display panel of the liquid crystal display panel. a step of providing through holes with the same pitch; a step of configuring a liquid crystal panel using the main glass substrate;
selectively forming an electrode base metal layer on the electrode terminal pattern portion and the inner wall surface of the opening hole of the liquid crystal panel; forming a fi layer of solder metal on the base metal layer; After filling and forming a connecting solder metal electrode in the through hole, cut the excess edge of the main glass substrate along the center line of the through hole to form a semicircular solder electrode on the edge of the liquid crystal panel. The liquid crystal panels are bonded together by matching the relative positions of the solder electrodes and the solder electrodes.

Function When using the ψ body LCD panel formed according to the present invention and bonding a plurality of LCD panels, since the scanning lines and d signal lines of the pixel control wiring between the panels can be directly connected, the pixel control wiring conductor This eliminates the trouble of connecting the wiring conductors to individual LCD panels, and at the same time eliminates the space for laying the wiring conductors, which has the advantage of making the display panel thinner and simplifying the manufacturing of large display panels. .

EXAMPLE An example of the present invention will be described below based on the drawings. 1st
Figure (a) shows an LCD having interconnection electrode terminals of the present invention.
1(b) is a plan view of the panel; FIG. 1(b) is a side view of the shape of the electrode terminal as seen from the direction of the arrow in FIG. 1(a); FIG. 2 is a sectional view showing the manufacturing process of the present invention; FIG. is a diagram showing the concept of the planar shape corresponding to the manufacturing process in Figure 2, and Figure 4 (a) is the LC
FIG. 4(b) is a plan view showing the connection between the D panels, and a sectional view at FIG. Note that each of the drawings is enlarged to an arbitrary size for convenience of explanation, and FIG. 1 and FIG. 2 do not have the same size ratio.

1 and 2, 2 is an electrode terminal for scanning line and signal line wiring, 5 is a pixel area of the LCD panel, 6 is a liquid crystal sealing resin layer, 8 and 9 are scanning line and signal line wiring patterns, respectively; 10 is the main substrate glass, 11 is the end wall surface of the main substrate glass when the LCD panel is completed, 12 is the through hole, 16 is the base metal plating layer of the bonding electrode part, 17 is the solder base gold #l electrode,
18 is a solder electrode serving as a bonding electrode.

Next, a detailed explanation of the manufacturing method will be given according to the drawings.

FIG. 2 shows a vertical section of a portion of the scanning line wiring pattern 8 for pixel control. It should be noted that since the structure of the electrode terminal and the bonding electrode part is the same for the signal line wiring pattern 9, the manufacturing process will be explained below using the scanning line side as an example of the cross-sectional structure. As shown in FIGS. 2(a) and 3(a), electrode terminals 2 formed outside the pixel area 5 on the main substrate glass 10
, and at a pitch P that matches the pattern pitch P of the electrode terminals 2 of the scanning line and signal line wiring patterns 8 and 9 in advance at a portion that will become the end wall surface 11 of the main substrate glass 10 when the LCD panel is completed. , the through hole 12 is formed using a laser beam or the like. The opening diameter φ of this through hole 12 depends on the pitch P and width W of the electrode terminals 2, but
00μ1g or more is preferable in terms of the In process.

In this way, the main surface of the main substrate glass 10, in which the through holes 12 are provided in advance at the positions where the pattern group of the electrode terminals 2 is planned to be formed, is scanned as shown in FIGS. 2(b) and 3(b). Line and signal line wiring patterns 8 and 9, and a pixel control function section (not shown) such as a TPT element are formed. At this time, the ends of the pattern group of electrode terminals 2, which are the ends of the scanning line and signal line wiring patterns 8 and 9, are used as common electrodes for electrolytic plating that will be performed later, so they are separated as shown in Figure 3(b). A short bar pattern 13 is formed on the edge of the main substrate glass 10, and the electrode terminals are electrically coupled to each other.

Main substrate glass 10 on which scanning line and signal line wiring patterns 8 and 9 and pixel control function parts such as TPT elements are formed.
At a predetermined position 111 (pixel formation area) on the main surface of the
), the counter electrode glass substrate 14 is adhesively fixed with a sealing adhesive 16 with a gap of about 10 μm, and the liquid crystal 15 is injected and sealed into the gap. This process is manufactured using the same manufacturing method as that of a normal active matrix type CD display panel, except for connecting the ends of the pattern group of electrode terminals 2 with the short bar pattern 13, so a detailed explanation will be omitted. do.

Next, as shown in FIG. 2(C) and FIG. Then, a base metal plating layer 16 is selectively formed. For example, a plating layer of several μl is formed on the inner wall surface of the through hole 12 by electroless through-hole plating of Cu, and one end of the plating layer is deposited on the pattern surface of the pattern group of the electrode terminal 2 and the short bar pattern 13. The electrode terminals 2 are formed and electrically connected to the pattern groups of the respective electrode terminals 2.

Thereafter, as shown in FIG. 2(d), a soldering base metal layer of Cu, Ni, etc. is deposited on the base metal plating layer 16 with a thickness of 10 μm by electrolytic plating using the short bar pattern 13 as an electrode. A solder base metal electrode 17 is formed over the entire inner wall surface of the through hole 12.

Further, electrolytic plating of solder metal is applied to the 1% solder base metal electrode 17 in the same process as in the formation of the semi-Ell base metal, so that the solder adheres to the surface of the pattern group of the electrode terminal 2. By filling and forming the inside of the opening hole 12, the solder electrode 18 is formed at the same location (the second
Figure (e), Figure 3 (e)).

When plating the solder metal, instead of forming it on the solder base metal electrode 17 as in this embodiment, the solder metal 4fj18 can also be formed directly on the base metal plating layer 16 by electrolytic plating.

In addition, as another embodiment in which the solder electrode 18 is filled and formed inside the i-through hole 12, the solder base metal electrode 17 is formed on the entire inner wall surface of the through-hole 12 by electrolytic plating, and then the main board including the through-hole 12 is By immersing the peripheral area of the glass 10 in a molten solder tank for a few seconds or by contacting the jet surface of the molten solder jet tank, the solder adheres to the surface of the pattern group of the electrode terminal 2 and also forms the through holes. The solder base metal electrode 17 on the inner wall surface of No. 12 can also be selectively filled with a solder electrode 18.

Note that in the above rules, solder is also deposited on the surface of the pattern part of the electrode terminal 2, but if the same part is covered with a masking material such as a soldering resist and the above process is performed, A solder electrode 18 is selectively formed only on the inner wall surface of the through hole 12 .

In this way, the main substrate glass 10 with the solder electrode 18 provided inside the through hole 12 is assembled as shown in FIGS. 2(f) and 3(f).
If the excess end 19 is cut at the center line of the different through hole 12, that is, at the part that will become the end wall surface 11 of the main substrate glass 10 when the LCD panel is completed, the end wall surface 11 will have a hole as shown in the same figure and FIG. A semicircular solder electrode 18 is obtained.

When configuring a multi-panel by arranging a plurality of LCD panels on which solder metal electrodes 18 are formed on the end wall surface 11, for example, as shown in FIG. 4(a), four LCD panels 1
A, 1b, 1c, 1d (7) The relative positions of the semicircular solder electrodes 18 of each panel are aligned and the panels are bonded together.After that, the 18 portions of the semi-Ffl electrodes are heated! 2! ! l! I! Then, the halves u1 of the solder electrodes 18 of each LCD panel are melted, and the solder electrodes 18 that are closely arranged relative to each other are solidified, so that the scanning between the LCD panels connected to the electric bridge group is Connect lines and signal lines on the LC [) panel! @It is done on the wall.

Effects of the Invention By manufacturing an LCD panel based on the manufacturing method of the present invention, connection electrode terminals are formed on the end wall surface of the LCD panel, and a multi-panel can be constructed by using a plurality of these LCD panels. For example, the connection between the scanning lines and signal lines for control driving of the CD panel between the LCD panels is as follows.
Since this is done on the end wall surface of the LCD panel, there is no need for space for connecting the panels to each other, and it becomes possible to arrange adjacent LCD panels in close contact with each other.

This is by narrowing the width of the no-pixel area (area where no image can be displayed because there are no picture elements) that occurs at the connection part of the CD panel, and it is possible to reduce the width of the non-pixel area (area where no image can be displayed because there are no pixels). This will improve quality.

In addition, since image control wiring is not directly connected to each LCD panel, the manufacturing process during assembly is simplified, and the number of connection points is reduced, contributing to improved reliability. Since the connection is made between the end walls of the panel, a separate connection wiring space is omitted, and the overall thickness of the display panel can be reduced.

[Brief explanation of drawings]

FIG. 1 is a plan view and a side view of an LCD panel having interconnecting electrode terminals showing one embodiment of the present invention, FIG. 2 is a sectional view showing the manufacturing process of the present invention, and FIG. 3 is similar to FIG. Figure 4 is a plan view and cross-sectional view showing the connection between panels according to the manufacturing method of the present invention, and Figure 5 is a cross-sectional view showing a conventional example. be. 1a to 1d...LCI) panel, 2...Electric #A terminal of scanning line and signal line wiring, 5...LCD pixel area,
6...Liquid crystal sealing resin layer, 8...Scanning line wiring pattern, 9...Signal line wiring pattern, 10...Main board glass, 11...Edge of main board glass when LCD panel is completed Wall surface, 12... Through hole, 14... Counter electrode glass substrate, 15... Liquid crystal, 16... Base metal plating layer, 17
...Solder base metal electrode, 18...Solder electrode, 19.
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Claims (1)

[Claims] 1. A step of providing in advance through holes with the same pitch as the formation pitch of the electrode terminal patterns in the external connection electrode terminal pattern formation area of the main glass substrate forming the display panel of the liquid crystal display panel. , a step of forming a liquid crystal panel using the main glass substrate, a step of selectively forming an electrode base metal layer on the electrode terminal pattern portion and the inner wall surface of the through hole of the liquid crystal panel, and a step of forming an electrode base metal layer on the base metal layer. After the step of laminating metal and filling and forming a connecting solder metal electrode in the through hole in which the solder metal is laminated, cutting the excess edge portion of the main glass substrate along the center line of the through hole, A method for manufacturing a liquid crystal display panel, which includes forming semicircular solder electrodes on end surfaces of liquid crystal panels, and joining the liquid crystal panels together by aligning the relative positions of the solder electrodes. 2. The connection solder metal electrode to be filled in the inner wall surface of the through hole is deposited by electrolytic solder plating using a base metal layer formed on the inner wall surface as an electrode. A manufacturing method for liquid crystal display panels. 3. For connection solder metal electrodes to be filled in the inner wall surface of the through hole, the through hole forming area of the liquid crystal display panel is immersed in a solder bath, and a solder metal layer is laminated on the base metal layer of the inner wall surface of the through hole. A method for manufacturing a liquid crystal display panel according to claim 1, characterized in that: