JPS6211007Y2 - - Google Patents
Info
- Publication number
- JPS6211007Y2 JPS6211007Y2 JP1981065277U JP6527781U JPS6211007Y2 JP S6211007 Y2 JPS6211007 Y2 JP S6211007Y2 JP 1981065277 U JP1981065277 U JP 1981065277U JP 6527781 U JP6527781 U JP 6527781U JP S6211007 Y2 JPS6211007 Y2 JP S6211007Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- chip
- constant voltage
- constant
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Continuous-Control Power Sources That Use Transistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981065277U JPS6211007Y2 (enrdf_load_stackoverflow) | 1981-05-06 | 1981-05-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981065277U JPS6211007Y2 (enrdf_load_stackoverflow) | 1981-05-06 | 1981-05-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57178452U JPS57178452U (enrdf_load_stackoverflow) | 1982-11-11 |
JPS6211007Y2 true JPS6211007Y2 (enrdf_load_stackoverflow) | 1987-03-16 |
Family
ID=29861320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981065277U Expired JPS6211007Y2 (enrdf_load_stackoverflow) | 1981-05-06 | 1981-05-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6211007Y2 (enrdf_load_stackoverflow) |
-
1981
- 1981-05-06 JP JP1981065277U patent/JPS6211007Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57178452U (enrdf_load_stackoverflow) | 1982-11-11 |
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