JPS62109418A - Chip-shaped delay element - Google Patents

Abstract

PURPOSE:To obtain a miniature chip-shaped delay element having the variable delay time by forming an inductance pattern on the surface of a thin dielectric substrate and an interdigital electrode that can be easily cut by a laser on the back surface of the dielectric substrate respectively. CONSTITUTION:An inductance pattern 10 is formed on the surface of a dielectric substrate 1 together with an interdigital electrode 11 of a thin or thick film formed on the back surface of the substrate 1. An electrostatic capacity is provided between the pattern 10 and the electrode 11. The electrode 11 formed on the side opposite to the pattern 10 decides the electrostatic capacity. For such an interdigital electrode, the tooth parts can be easily separated by a laser machining with variable electrostatic capacity. In other words, the delay time proportional to the square root of the product of L and C can be controlled with variation of the electrostatic capacity.

Description

[Detailed Description of the Invention] [Summary] By forming an inductance pattern on the front surface of a thin dielectric substrate and forming a desired comb-shaped electrode that can be easily laser cut on the back surface, a small chip type with variable delay time is created. A delay element is provided.

[Industrial application field]

The present invention relates to a chip-type delay element in which inductance and capacitance are provided in separate circuits.

In recent years, small delay elements have been used in which an inductance is formed by a film circuit on the front surface of a dielectric substrate with a high dielectric constant, and a ground electrode is formed on the back surface to provide capacitance.

At this time, there is a demand for a delay element whose delay time can be adjusted.

[Conventional technology]

FIG. 2 is a perspective view of a conventional delay element, in which 1 is a dielectric substrate made of a thin dielectric material with a high dielectric constant, such as alumina, and a bellows-shaped dielectric substrate 1 is formed on the surface of the dielectric substrate 1. The inductance pattern 2 is formed of a thick film or a thin film.

On the other hand, an earth electrode 3 is formed as a thick film or a thin film on the entire back surface of the dielectric substrate 1, and an inductance pattern 2 is formed.
A capacitance is provided between the

Further, a bottle-shaped external terminal 4. and external terminals 5 are glued.

In such a delay element, the external terminals 4 and 5 are inserted and soldered into, for example, through holes and mounted on a desired delay line portion of a printed circuit board, contributing to the miniaturization and cost reduction of electronic devices. are doing.

[Problem that the invention seeks to solve]

However, the conventional delay element described above has a problem in that the only way to adjust the delay time is to newly form an inductance pattern of a different shape, making the adjustment work extremely difficult.

? Means for Solving the Problems] In order to solve the above conventional problems, the present invention, as shown in FIG. A thin film or a thick film comb-shaped electrode 11 is formed on the inductance pattern 10, and a capacitance is provided between the inductance pattern 10 and the comb-shaped electrode 11.

[Effect]

According to the above means of the present invention, the inductance pattern l
On the opposite side of O, there is a comb-shaped electrode 11 that determines the capacitance.
It is formed. The comb-teeth portion of such a comb-shaped electrode can be easily separated by laser processing, and the capacitance is variable.

That is, the chip-type delay element of the present invention can adjust the delay time proportional to the square root of the product of L and C by changing the capacitance.

〔Example〕

The present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 1 is a perspective view of one embodiment of the present invention, in which (a) is a front view and fbl is a back view.

In FIG. 1, an inductance pattern 10 having a meandering conductor pattern is formed on the surface of a dielectric substrate 1 as a thick film.
It is formed by a film circuit such as a thin film.

The terminal portions of the inductance pattern 10 are provided on opposite end surfaces of the dielectric substrate 1, and serve as strip-shaped terminal electrodes 12 parallel to the side edges.

The terminal electrode 12 is formed into a rectangular shape parallel to the side edge by extending from the front side of the dielectric substrate 1, through the side end face, and then to the back side.

On the back surface of the dielectric substrate 1, as shown in FIG. 1(b), a belt-shaped stem pattern is provided near the side edges orthogonal to the pair of terminal electrodes 12, and a large number of strips are connected to the stem pattern and arranged at right angles. The comb teeth are provided, and the comb-shaped electrode 11 is formed by a film circuit such as a thick film or a thin film.

A portion of the stem pattern of the comb-shaped electrode 11 extends toward the end surface of the dielectric substrate 1 to form a terminal bottle 14 .

The terminal electrodes 14 extend from the back side of the dielectric substrate 1 to the front side through the side end faces. Therefore, it is also possible to connect the lead terminal connected to the comb-shaped electrode 11 on the front side.

As described above, the chip-type delay element of this embodiment has an inductance pattern 1° formed on the front surface of the dielectric substrate 1, and a capacitance 1 formed between the dielectric substrate 1 and the comb-shaped electrode 11 on the back surface, thereby achieving delay. It is a chip-shaped part that has a function.

This chip type delay element has an inductance pattern 10
The terminal electrodes 12 and 14 are placed on a printed board with the side facing downward, each terminal electrode 12° is aligned with a predetermined pattern on the printed board, and the terminal electrodes 14 are connected by soldering and mounted on the printed board.

Note that it is also easy to mount the comb-shaped electrode 11 side downward on the printer L-T&, and also connect lead terminals to each electrode and connect the lead terminals as desired, for example, through a through hole or other connection. It can also be implemented by connecting directly to the wire.

The delay time of this chip-type delay element is adjusted by using the comb-shaped electrode 1.
1 selected comb teeth, for example, the root part, that is, FIG. 1 (bl
An appropriate number of laser cuts are performed along the dotted line M-M shown in FIG. This changes the capacitance, making it easy to adjust the delay time.

〔Effect of the invention〕

As explained above, the present invention has a comb-shaped electrode on one side of a dielectric substrate, and has practical advantages in that the capacitance can be easily changed and the delay time can be easily adjusted. It has a positive effect.

[Brief explanation of drawings]

FIG. 1 is a perspective view of one embodiment of the present invention, (al is a front view, (b) is a back view, and FIG. 2 is a perspective view of a conventional delay element. In the figure, 1 is a dielectric substrate. , 2.10 is an inductance pattern, 3 is a ground electrode, 4.5 is an external terminal, 11 is a comb-shaped electrode, and 12 and 14 are terminal electrodes.

Claims (1)

[Claims] An inductance pattern (10) formed on the surface of a dielectric substrate (1), and a thin or thick comb-shaped electrode (11) formed on the back surface of the dielectric substrate (1). and the inductance pattern (10) and the comb-shaped electrode (11).
) A chip-type delay element characterized in that a capacitance is provided between the element and the element.