JPH0580010U - Chip strip line - Google Patents

Abstract

(57) [Summary] (Modified) [Objective] To provide a surface mounting type chip strip line capable of adjusting the characteristic impedance of the micro strip line formed on the circuit board on the circuit board. A dielectric 10, a strip conductor 12 formed inside the dielectric 10, and a ground conductor 18 facing the strip conductor 12 and formed inside the dielectric 10.
An external terminal electrode formed at the end of the dielectric 10 and electrically connected to the strip conductor 12, a through hole 20 led out of the ground conductor 18 to the outside of the dielectric 10, and a dielectric Formed on at least one side surface of 10,
The external ground electrode is electrically connected to the through hole 20 and electrically insulated from the external terminal electrode.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip strip line for adjusting the characteristic impedance of a microstrip line used as a transmission line of a high frequency circuit.

[0002]

[Prior Art]

 As a microstrip line, as shown in FIG. 6, a ground conductor 4 is formed over almost the entire surface of one surface (the back surface in the figure) of a thin plate-shaped dielectric 2, and the dielectric 2 An unbalanced type in which a narrow strip conductor 6 is formed on the other surface (upper surface in the same figure) in the longitudinal direction, or ground conductors are formed on almost the entire front and back surfaces of a plate-shaped dielectric. However, there is known a balanced type shield structure in which a narrow strip conductor is formed inside the dielectric in the longitudinal direction.

The characteristic impedance of such a microstrip line is mainly determined by the thickness and dielectric constant of the dielectric and the pattern width of the strip conductor. Moreover, the microstrip line has advantages that it is light and small and that printed wiring technology can be used, so that complicated circuits can be easily manufactured.

[0004]

[Problems to be solved by the device]

 By the way, since the microstrip line is fixedly formed on the circuit board, once the pattern of the strip conductor is formed, the pattern, mainly the line length and the line width, can be changed later. No, and therefore the characteristic impedance could not be adjusted. If the characteristic impedance is to be adjusted, the entire pattern of the strip conductor has to be recreated, and there is a problem that the trial production time and the trial production cost increase.

An object of the present invention is to provide a surface mount type chip strip line in which the characteristic impedance of a microstrip line formed on a circuit board can be adjusted on the circuit board.

[0006]

[Means for Solving the Problems]

 A chip strip line according to the present invention comprises a dielectric, a strip conductor formed inside the dielectric, a ground conductor facing the strip conductor and formed inside the dielectric, and the dielectric. An external terminal electrode formed at an end of the strip conductor and electrically connected to the strip conductor, a through hole led out from the ground conductor to the outside of the dielectric body, and formed on at least one side surface of the dielectric body. And an external ground electrode electrically connected to the through hole and electrically insulated from the external terminal electrode.

[0007]

[Action]

 When a chip strip line with a certain characteristic is attached to the micro strip line formed on the circuit board or it is replaced with a chip strip line with another characteristic, the characteristic impedance of the micro strip line is changed or adjusted. To be done.

[0008]

【Example】

 FIG. 1 is an exploded perspective view of an element body of a chip strip line according to an embodiment of the present invention. In the figure, 10 is a dielectric having a rectangular planar shape, and a ribbon-shaped strip conductor 12 is formed on the upper surface of the dielectric 10 along the longitudinal direction of the dielectric 10. Further, another dielectric 14 having the same shape is laminated on the dielectric 10 so as to cover the strip conductor 12. Further, another dielectric 16 having the same shape is laminated under the dielectric 10. A ground conductor 18 is formed over the entire surface between the upper surface of the dielectric 16, that is, the dielectric 10, and a through hole 20 is formed in the vicinity of the center of the dielectric 16 so as to penetrate therethrough. There is.

The chip strip line element body can be manufactured as follows. First, the pattern of the strip conductor 12 is printed on the ceramic green sheet by a screen printing method using a conductive paste, and the pattern of the ground conductor 18 is printed on another ceramic green sheet by a screen printing method using a conductive paste. Print. Then, these two types of ceramic green sheets and another ceramic green sheet on which nothing is printed are laminated in the laminating order as shown in FIG. 1, pressed and then cut into dice for each pattern, It is fired at a high temperature to obtain a chip strip line body.

FIG. 2 is a perspective view showing the appearance of the chip strip line. The element body of the chip strip line obtained by firing is baked with conductive paste on both ends to form external terminal electrodes 22, 22 as shown in the same figure, and conductive paste is burned on the periphery. To form the external ground electrode 24. As a result, the chip strip line according to the present invention is formed.

FIG. 3 is a sectional view taken along line AA of FIG. As shown in the figure, the external terminal electrodes 22 and 22 are connected to both ends of the strip conductor 12, and the external earth electrode 24 is connected to the earth conductor 18 through the through hole 20.

The shape of the strip conductor 12 is not limited to a linear shape as shown in FIGS. 1 and 4 (a), but a zigzag shape at a substantially right angle as shown in FIG. 4 (b). It may be a curved zigzag shape as shown in FIG. 4 (c), a triangular bent shape as shown in FIG. 4 (d), or a zigzag shape as shown in FIG. 4 (e). As shown in FIG. 4 (f), both ends may be wide and the central part may be narrow, or both ends may be narrow and the central part may be wide.

As the dielectric material, for example, alumina, glass epoxy, or glass fluorine can be used, but the material is not limited to this, and any other dielectric material can be used. Of course, it can be used. Further, as the material of the strip conductor and the ground conductor, for example, a conductive paste such as Cu or Ag-Pd can be used, but the material is not limited to this and any conductive paste can be used. Of course, anything other than can be used.

FIG. 5 is a sectional view showing another embodiment of the present invention. In the above embodiment, one strip conductor 12 and one earth conductor 18 are made to face each other. However, as shown in FIG. 5, one strip conductor 12 is sandwiched by dielectrics 10 and 14. The structure may be such that it is sandwiched between two ground conductors 18 and 18 and the outside thereof is covered with dielectrics 16 and 16.

[0015]

[Effect of the device]

 According to this invention, by adjusting the characteristic impedance of the strip line, the characteristics can be examined easily and the trial production time can be shortened. At the time of mass production, variations in active elements such as ICs and FETs (mainly in ICs). This has the effect of absorbing the variations in the bonding wire).

In addition, if the strip line is simply made into a chip, the strip conductor is exposed and is easily scratched, and the characteristics initially set are not correct, and the direction is directional and unsuitable for automatic mounting. However, according to the present invention, it is possible to provide a chip-shaped strip line that can be mechanically mounted without causing scratches on the strip conductor during mounting.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an element body of a chip strip line according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the appearance of a chip strip line according to the present invention.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an explanatory view showing an example of the shape of a strip conductor of a chip strip line according to the present invention.

FIG. 5 is a cross-sectional view of a chip strip line according to another embodiment of the present invention.

FIG. 6 is a perspective view showing an appearance of a conventional microstrip line.

[Explanation of symbols]

 10 Dielectric 12 Strip Conductor 14 Dielectric 16 Dielectric 18 Earth Conductor 20 Through Hole 22 External Terminal Electrode 24 External Earth Electrode

Claims (3)

[Scope of utility model registration request] 1. A dielectric, a strip conductor formed inside the dielectric, a ground conductor facing the strip conductor and formed inside the dielectric, and an end portion of the dielectric. An external terminal electrode formed and electrically connected to the strip conductor; a through hole extending from the ground conductor to the outside of the dielectric; and a through hole formed on at least one side surface of the dielectric. A chip strip line that is electrically connected to the hole and that also includes an external ground electrode that is electrically insulated from the external terminal electrode. 2. The chip strip line according to claim 1, wherein one strip conductor and one ground conductor are provided so as to face each other. 3. The chip strip line according to claim 1, wherein one strip conductor is provided between two ground conductors.