JPS6210782B2 - - Google Patents
Info
- Publication number
- JPS6210782B2 JPS6210782B2 JP367778A JP367778A JPS6210782B2 JP S6210782 B2 JPS6210782 B2 JP S6210782B2 JP 367778 A JP367778 A JP 367778A JP 367778 A JP367778 A JP 367778A JP S6210782 B2 JPS6210782 B2 JP S6210782B2
- Authority
- JP
- Japan
- Prior art keywords
- head
- abrasive
- polishing
- tape
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 24
- 229910000859 α-Fe Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- -1 etc.) Polymers 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 13
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 239000003082 abrasive agent Substances 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000008199 coating composition Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 229920001747 Cellulose diacetate Polymers 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 235000010980 cellulose Nutrition 0.000 description 2
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001220 nitrocellulos Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- JLPULHDHAOZNQI-ZTIMHPMXSA-N 1-hexadecanoyl-2-(9Z,12Z-octadecadienoyl)-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCCCCCC\C=C/C\C=C/CCCCC JLPULHDHAOZNQI-ZTIMHPMXSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- APXYQFWNKAYRFS-UHFFFAOYSA-N C(C=C)(=O)O.ClC=COC=CCl Chemical compound C(C=C)(=O)O.ClC=COC=CCl APXYQFWNKAYRFS-UHFFFAOYSA-N 0.000 description 1
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- DQEFEBPAPFSJLV-UHFFFAOYSA-N Cellulose propionate Chemical compound CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 DQEFEBPAPFSJLV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910001864 baryta Inorganic materials 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920006218 cellulose propionate Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- MOQRZWSWPNIGMP-UHFFFAOYSA-N pentyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCC MOQRZWSWPNIGMP-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229940083466 soybean lecithin Drugs 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/1871—Shaping or contouring of the transducing or guiding surface
Description
本発明は高精度の研磨テープに関する。
従来、研磨テープとしては研磨材を含んだも
の、軟い粒子と硬い粒子を混合して含むものが用
いられてきたが、ヘツドの研削量がばらついた
り、研削後のヘツドの表面粗さがよくなかつた
り、またヘツドの端面よりチツピングが発生し易
くヘツドを傷つけ易いというような問題点があつ
た。
従来の研磨テープの主な目的としては、1.ヘツ
ド面を仕上げる、2.ヘツドの先端形状をつくりだ
す、3.ヘツドのチツピングをなくすことであつ
た。これらはいずれも最短記録波長でせいぜい2
μの場合には有効であつた。
これに対し最近のビデオテープ(例えばβ−
Max、β−Format、VHS systemなどの1/2イン
チビデオカセツト方式)では記録波長が1μと記
録波長が従来の1/2となり、それに伴つてヘツド
に要求される性能も大巾に高くなつた。そのた
め、磁気ヘツドは従来の研磨テープを用いた仕上
げ法では品質上、満足できなくなつた。本発明は
λ=1μ程度の高密度記録用ヘツドをつくるのに
必要な研磨テープの製法に関する。このヘツドと
しては、仕上げ面が従来は500Å程度までであつ
たのが100Å以下、できれば50Å以下であるこ
と、先端形状がバリ、スリキズのないこと、チツ
ピング(ヘツド巾方向で5μの長さ以上のもの)
が2ケ程度まであつたのを0とするなど、精度を
上げることが必要となり、そのためには極めて高
精度な研磨テープが必要となつてくる。
これに対処する方法として、ヘツドの組成や材
質の変更も一応考えられるが、ヘツド巾が小さく
なり、かつ記録密度も上つたので、磁気特性より
みてこれ以上ヘツド自体を変えることは難かし
い。
用いられるヘツドとしては単結晶:Fe2O3/
MnO/ZnO(53/32/15)、ホツトプレス:
Fe2O3/MnO/ZnO(53/25/22)等があり、こ
れらのヘツドは以前は、その研磨特性がホツトプ
レスの研磨量が少ないため、大巾に異なり、かつ
チツピングも発生し易かつたが、最近この差は縮
まつており、ホツトプレスの研磨がうまくいけ
ば、単結晶ヘツドも研磨することができる。した
がつてホツトプレスフエライトの研磨について以
下、述べていく。
このような最近のヘツドを研磨するに適した研
磨テープについて本発明者等は研究を重ねた結
果、研磨材としてはAl2O3、SiO2、Cr2O3、α−
Fe2O3、ダイヤモンド、ZnO2、TiO2等、多数あ
る中で仕上げ表面がよく安価なものはα−
Fe2O3/Cr2O3の組み合せであること、研磨テー
プの全厚が10〜100μであること、研磨テープの
表面の凹凸が0.1mm以下であることが必要である
ことが判明し、本発明に到達したものである。
研磨材については、Cr2O3は研磨量を多くする
ものであり、α−Fe2O3は研磨テープの表面性を
よくし、ヘツドの仕上げ面をよくする効果を有
し、混合比(α−Fe2O3/Cr2O3)は1/9〜9/
1、好ましくは1/2〜2/1である。厚さにつ
いては、薄いと研磨量が小となるし、厚いとヘツ
ドにチツピングが発生するので10〜100μ、好ま
しくは20〜40μである。研磨材のサイズはあまり
大きいと研磨テープの凹凸が大きくなり仕上りヘ
ツド面が悪化するので、100μ以下、好ましくは
5μ以下である。研磨テープ表面の凹凸は、大き
いとヘツドにチツピングが入り易いので、0.1mm
以下、好ましくは10μ以下、更に好ましくは1μ
以下である。
本発明の研磨テープは、支持体上にバインダー
と研磨材、更に他の添加剤を加えたものを有機溶
媒に溶解して塗布することによつて製造される。
本発明に使用されるバインダーとしては従来公
知の熱可塑性樹脂、熱硬化性樹脂又は反応型樹脂
やこれらの混合物が使用される。
熱可塑性樹脂としては軟化温度が150℃以下、
平均分子量が10000〜200000、重合度が約200〜
500程度のもので、例えば塩化ビニル酢酸ビニル
共重合体、塩化ビニル塩化ビニリデン共重合体、
塩化ビニルアクリロニトリル共重合体、アクリル
酸エステルアクリロニトリル共重合体、アクリル
酸エステル塩化ビニリデン共重合体、アクリル酸
エステルスチレン共重合体、メタクリル酸エステ
ルアクリロニトリル共重合体、メタクリル酸エス
テル塩化ビニリデン共重合体、メタクリル酸エス
テルスチレン共重合体、ウレタンエラストマー、
ポリ弗化ビニル、塩化ビニリデンアクリロニトリ
ル共重合体、ブタジエンアクリロニトリル共重合
体、ポリアミド樹脂、ポリビニルブチラール、セ
ルロース誘導体(セルロースアセテートブチレー
ト、セルロースダイアセテート、セルローストリ
アセテート、セルロースプロピオネート、ニトロ
セルロース等)、スチレンブタジエン共重合体、
ポリエステル樹脂、クロロビニルエーテルアクリ
ル酸エステル共重合体、アミノ樹脂、各種の合成
ゴム系の熱可塑性樹脂及びこれらの混合物等が使
用される。
これらの樹脂の例示は特公昭37−6877号、同39
−12528号、同39−19282号、同40−5349号、同40
−20907号、同41−9463号、同41−14059号、同41
−16985号、同42−6428号、同42−11621号、同43
−4623号、同43−15206号、同44−2889号、同44
−17947号、同44−18232号、同45−14020号、同
45−14500号、同47−18573号、同47−22063号、
同47−22064号、同47−22068号、同47−22069
号、同47−22070号、同47−27886号等の公報に記
載されている。
熱硬化性樹脂又は反応型樹脂は、塗布液の状態
では2×105以下の分子量であり、塗布、乾燥後
に加熱することにより、縮合、付加等の反応によ
り分子量は無限大のものとなる。又これらの樹脂
のなかで、樹脂が熱分解するまでの間に軟化又は
溶融しないものが好ましい。具体的には例えば、
フエノール樹脂、エポキシ樹脂、ポリウレタン硬
化型樹脂、尿素樹脂、メラミン樹脂、アルキツド
樹脂、シリコン樹脂、アクリル系反応樹脂、エポ
キシ−ポリアミド樹脂、ニトロセルロースメラミ
ン樹脂、高分子ポリエステル樹脂とイソシアネー
トプレポリマーの混合物、メタクリル酸塩共重合
体とジイソシアネートプレポリマーの混合物、ポ
リエステルポリオールとポリイソシアネートの混
合物、尿素ホルムアルデヒド樹脂、低分子量グリ
コール/高分子ジオール/トリフエニルメタント
リイソシアネートの混合物、ポリアミン樹脂及び
これらの混合物等である。
これらの樹脂の例示は特公昭39−8103号、同40
−9779号、同41−7192号、同41−8016号、同41−
14275号、同42−18179号、同43−12081号、同44
−28023号、同45−14501号、同45−24902号、同
46−13103号、同47−22065号、同47−22066号、
同47−22067号、同47−22072号、同47−22073
号、同47−28045号、同47−28048号、同47−
28922号等の公報に記載されている。
これらの結合剤の単独又は組合わされたものが
使われ、他に添加剤が加えられる。研磨材粉末と
結合剤との混合割合は重量比で研磨材粉末100重
量部に対して結合剤10〜200重量部の範囲で使用
される。添加剤は分散剤、潤滑剤等が加えられ
る。
支持体の素材としてはポリエチレンテレフタレ
ート、ポリエチレン−2・6−ナフタレート等の
ポリエステル類、ポリエチレン、ポリプロピレン
等のポリオレフイン類、セルロース・ダイアセテ
ート、セルローストリアセテート、セルロースア
セテート・ブチレート、セルロースアセテートプ
ロピオネート等のセルロース誘導体、ポリ塩化ビ
ニル、ポリ塩化ビニリデン等のビニル系樹脂、ポ
リカーボネート、ポリイミド、ポリアミドイミド
等のプラスチツクの他に用途に応じてアルミニウ
ム、銅等の非磁性金属類、ガラス、陶器、磁器等
のセラミツク類、紙、バライタまたはポリエチレ
ン、ポリプロピレン、エチレンブテン共重合体等
の炭素数2〜10のα−ポリオレフインを塗布また
はラミネートした紙等の紙類も使用できる。これ
らの支持体は研磨テープの使用目的に応じて透明
あるいは不透明であつてもよい。
支持体上へ前記の研磨層を塗布する方法として
はエアードクターコート、ブレードコート、エ
ア・ナイフコート、スクイズコート、デイツプコ
ート、リバースロールコート、トランスフアー・
ロール・コート、グラビヤコート、キスコート、
キヤスト・コート、スプレー・コート法等が利用
でき、その他の方法も可能であり、これらの具体
的説明は朝倉書店発行の「コーテイング工学」
253頁〜277頁(昭和46・3・20発行)に詳細に記
載されている。
実施例 1
塗布組成()を用いて15μのポリエチレンテ
レフタレートベース上に7μの研磨層を塗布し
た。しかる後、1/2インチにテープをスリツト
し、VHS、VTR用のテープ・カセツトのテープ
の代りにこの研磨テープを巻きこみ、VTRにセ
ツトしたヘツドを1分間研磨してヘツド摩耗
量、ヘツドの仕上り時の凹凸、ヘツドの端面
のチツピングを調べた。結果を第1表に、1001〜
1006として示す。なお、ヘツドは前述のホツトプ
レスフエライトである。
塗布組成()
研磨材(A)/研磨材(B) 第1表中に示す。
合 計 300g
塩化ビニル−酢酸ビニル共重合体
(共重合比87:13、重合度350) ………22.5g
ポリエステル・ポリオール(*) ………12g
大豆レシチン ………3g
シリコーン油(ジメチル・ポリシロキサン)
………2g
ポリイソシアネート(3モルの2・4−ト
リレンジイソシアネート化合物と1モル
のトリメチロールプロパンの反応生成物
の75重量%酢酸エチル溶液) ………4.5g
メチルエチルケトン ………400g
トルエン ………900g
* アジピン酸1モルとジエチレングリコール1
モルとトリメチロールプロパン0.06モルの反応
生成物
粘度(75℃):1000cp、比重1.18、
OH価:60、酸価:2以下
実施例 2
塗布組成()を用いて、ポリエチレンテレフ
タレートのベース厚を変え、研磨テープの全厚の
効果をみた。その結果を第1表に2001〜2006とし
て示す。ヘツドの研磨条件は実施例1と同じであ
る。
塗布液組成()
研磨材(A)/(B)(第1表参照) A+B=300g
塩化ビニル−酢酸ビニル共重合体
(共重合比87:13、重合度380) ………28.4g
ポリエステル・ポリウレタン(ブタン・ジ
オールとアジピン酸からなる末端水酸基
を有したポリエステルと2・4−ジフエ
ニルメタン・ジイソシアネートとの反応
生成物、分子量約4万) ………13g
カーボン・ブラツク(平均粒子サイズ2μ)
………22.5g
アミルステアレート ………1.2g
オレイン酸 ………3g
イソシアネート化合物(3モルの2・4−
トリレンジイソシアネート化合物と1モ
ルのトリメチロールプロパンの反応生成
物の75重量%酢酸エチル溶液) ………17g
ニトリルブタジエンラバー(NBR) ………7.1g
酢酸ブチル ………900g
実施例 3
塗布組成()を用いて研磨材の粒子サイズを
変えて研磨テープをつくり、研磨条件は実施例1
と同じくし、サイズの効果を調べた。結果を第1
表の3001〜3005に示した。
塗布液組成()
研磨材(第1表参照) (A)+(B)=300g
塩化ビニル塩化ビニリデン共重合体
(共重合比=7:3、重合度=400)
………22g
エポキシ樹脂(ビスフエノールAとエピク
ロルヒドリンの反応生成物、分子量=
900、エポキシ当量=460〜520、水酸基
含有量=0.29%、Shell Oil Coエピコー
ト1001) ………16g
シリコーン油(ジメチルポリシロキサン)
………3.0g
イソシアネート化合物(3モルの2・4−
トリレンジイソシアネート化合物と1モ
ルのトリメチロールプロパンの反応生成
物の75重量%酢酸エチル溶液、Bayerz
A.G.製のDesmodur L−75) ………21g
酢酸ブチル ………900g
The present invention relates to high precision abrasive tapes. Conventionally, polishing tapes containing abrasives or containing a mixture of soft particles and hard particles have been used, but the amount of grinding of the head varies, and the surface roughness of the head after grinding is poor. There were also problems in that chipping was more likely to occur on the end surface of the head, and the head was more likely to be damaged. The main purposes of conventional abrasive tapes were: 1. Finishing the head surface, 2. Creating the shape of the tip of the head, and 3. Eliminating chipping of the head. In both of these cases, the shortest recording wavelength is at most 2
It was effective in the case of μ. In contrast, recent videotapes (e.g. β-
In 1/2-inch video cassette formats such as Max, β-Format, and VHS systems, the recording wavelength is 1μ, which is half of the conventional recording wavelength, and the performance required of the head has accordingly increased significantly. . For this reason, the quality of magnetic heads is no longer satisfactory with the conventional finishing method using abrasive tape. The present invention relates to a method for manufacturing an abrasive tape necessary for manufacturing a high-density recording head of about λ=1 μ. For this head, the finished surface should be 100 Å or less, preferably 50 Å or less, whereas conventionally it was about 500 Å, the tip shape should be free of burrs and scratches, and there should be no chipping (more than 5 μ in length in the width direction of the head). thing)
It is necessary to increase the precision, such as by setting a value of about 2 to 0, and for this purpose, an extremely high-precision abrasive tape is required. As a way to deal with this, it may be possible to change the composition or material of the head, but since the head width has become smaller and the recording density has increased, it is difficult to change the head itself any further in terms of magnetic properties. The head used is single crystal: Fe 2 O 3 /
MnO/ZnO (53/32/15), hot pressed:
There are Fe 2 O 3 /MnO/ZnO (53/25/22), etc., and these heads used to have very different polishing characteristics due to the small amount of hot press polishing, and were also prone to chipping. However, this difference has recently narrowed, and if hot press polishing is successful, single crystal heads can also be polished. Therefore, the polishing of hot-pressed ferrite will be described below. As a result of repeated research by the present inventors on abrasive tapes suitable for polishing such recent heads, we found that abrasives such as Al 2 O 3 , SiO 2 , Cr 2 O 3 , and α-
Among the many materials such as Fe 2 O 3 , diamond, ZnO 2 , TiO 2 , etc., the ones with a good surface finish and low price are α-
It was found that the combination of Fe 2 O 3 / Cr 2 O 3 was required, the total thickness of the polishing tape was 10 to 100 μ, and the unevenness of the surface of the polishing tape was 0.1 mm or less. This has led to the present invention. Regarding abrasives, Cr 2 O 3 increases the amount of polishing, α-Fe 2 O 3 has the effect of improving the surface properties of the polishing tape and the finished surface of the head, and the mixing ratio ( α−Fe 2 O 3 /Cr 2 O 3 ) is 1/9 to 9/
1, preferably 1/2 to 2/1. The thickness should be 10 to 100 microns, preferably 20 to 40 microns, because the thinner the polishing amount will be, and the thicker the head will be chipping. If the size of the abrasive is too large, the unevenness of the abrasive tape will become large and the finished head surface will deteriorate, so the size of the abrasive is 100 μm or less, preferably 5 μm or less. If the irregularities on the surface of the polishing tape are large, chips may easily occur in the head, so
Below, preferably 10μ or less, more preferably 1μ
It is as follows. The polishing tape of the present invention is produced by coating a binder, an abrasive, and other additives dissolved in an organic solvent on a support. As the binder used in the present invention, conventionally known thermoplastic resins, thermosetting resins, reactive resins, and mixtures thereof are used. As a thermoplastic resin, the softening temperature is 150℃ or less,
Average molecular weight is 10000~200000, degree of polymerization is about 200~
500, such as vinyl chloride vinyl acetate copolymer, vinyl chloride vinylidene chloride copolymer,
Vinyl chloride acrylonitrile copolymer, acrylic acid ester acrylonitrile copolymer, acrylic acid ester vinylidene chloride copolymer, acrylic acid ester styrene copolymer, methacrylic acid ester acrylonitrile copolymer, methacrylic acid ester vinylidene chloride copolymer, methacrylic Acid ester styrene copolymer, urethane elastomer,
Polyvinyl fluoride, vinylidene chloride acrylonitrile copolymer, butadiene acrylonitrile copolymer, polyamide resin, polyvinyl butyral, cellulose derivatives (cellulose acetate butyrate, cellulose diacetate, cellulose triacetate, cellulose propionate, nitrocellulose, etc.), styrene butadiene copolymer,
Polyester resins, chlorovinyl ether acrylic acid ester copolymers, amino resins, various synthetic rubber-based thermoplastic resins, and mixtures thereof are used. Examples of these resins are given in Japanese Patent Publication Nos. 37-6877 and 39.
−12528, No. 39-19282, No. 40-5349, No. 40
−20907, No. 41-9463, No. 41-14059, No. 41
−16985, No. 42-6428, No. 42-11621, No. 43
−4623, No. 43-15206, No. 44-2889, No. 44
−17947, No. 44-18232, No. 45-14020, No.
No. 45-14500, No. 47-18573, No. 47-22063,
No. 47-22064, No. 47-22068, No. 47-22069
No. 47-22070, No. 47-27886, etc. The thermosetting resin or reactive resin has a molecular weight of 2×10 5 or less in the state of a coating solution, and when heated after coating and drying, the molecular weight becomes infinite due to reactions such as condensation and addition. Also, among these resins, those that do not soften or melt before the resin is thermally decomposed are preferred. Specifically, for example,
Phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, alkyd resin, silicone resin, acrylic reaction resin, epoxy-polyamide resin, nitrocellulose melamine resin, mixture of high molecular weight polyester resin and isocyanate prepolymer, methacrylate These include mixtures of acid salt copolymers and diisocyanate prepolymers, mixtures of polyester polyols and polyisocyanates, urea formaldehyde resins, mixtures of low molecular weight glycols/high molecular weight diols/triphenylmethane triisocyanates, polyamine resins, and mixtures thereof. Examples of these resins are given in Japanese Patent Publication Nos. 39-8103 and 40.
-9779, 41-7192, 41-8016, 41-
No. 14275, No. 42-18179, No. 43-12081, No. 44
-28023, 45-14501, 45-24902, 45-24902,
No. 46-13103, No. 47-22065, No. 47-22066,
No. 47-22067, No. 47-22072, No. 47-22073
No. 47-28045, No. 47-28048, No. 47-
It is described in publications such as No. 28922. These binders may be used alone or in combination, and other additives may be added. The mixing ratio of the abrasive powder and the binder is in the range of 10 to 200 parts by weight based on 100 parts by weight of the abrasive powder. Additives include dispersants, lubricants, and the like. Support materials include polyesters such as polyethylene terephthalate and polyethylene-2,6-naphthalate, polyolefins such as polyethylene and polypropylene, and celluloses such as cellulose diacetate, cellulose triacetate, cellulose acetate butyrate, and cellulose acetate propionate. Derivatives, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, plastics such as polycarbonate, polyimide and polyamideimide, as well as non-magnetic metals such as aluminum and copper, and ceramics such as glass, pottery and porcelain, depending on the application. , paper, baryta, or paper coated or laminated with α-polyolefin having 2 to 10 carbon atoms, such as polyethylene, polypropylene, or ethylene-butene copolymer, can also be used. These supports may be transparent or opaque depending on the intended use of the abrasive tape. Methods for applying the abrasive layer onto the support include air doctor coating, blade coating, air knife coating, squeeze coating, dip coating, reverse roll coating, and transfer coating.
Roll coat, gravure coat, kiss coat,
Cast coating, spray coating, etc. can be used, and other methods are also possible, and detailed explanations of these can be found in "Coating Engineering" published by Asakura Shoten.
It is described in detail on pages 253 to 277 (published on March 20, 1972). Example 1 A 7μ abrasive layer was coated on a 15μ polyethylene terephthalate base using coating composition (). After that, slit the tape into 1/2 inch pieces, wrap this abrasive tape in place of the tape in a VHS/VTR tape/cassette, and polish the head set in the VTR for 1 minute to measure the amount of wear on the head and the finish of the head. We investigated the unevenness and chipping on the end face of the head. The results are shown in Table 1, 1001~
Shown as 1006. The head is made of the aforementioned hot-pressed ferrite. Coating composition () Abrasive material (A)/Abrasive material (B) Shown in Table 1. Total 300g Vinyl chloride-vinyl acetate copolymer (copolymerization ratio 87:13, degree of polymerization 350) 22.5g Polyester polyol (*) 12g Soybean lecithin 3g Silicone oil (dimethyl polyol) siloxane)
………2g Polyisocyanate (75% by weight ethyl acetate solution of the reaction product of 3 moles of 2,4-tolylene diisocyanate compound and 1 mole of trimethylolpropane) …4.5g Methyl ethyl ketone …400g Toluene … ...900g * 1 mol of adipic acid and 1 mol of diethylene glycol
Mol and 0.06 mole of trimethylolpropane reaction product Viscosity (75℃): 1000 cp, specific gravity 1.18, OH value: 60, acid value: 2 or less Example 2 Using coating composition (), the base thickness of polyethylene terephthalate was changed. , we looked at the effect of the total thickness of the abrasive tape. The results are shown in Table 1 as 2001-2006. The head polishing conditions were the same as in Example 1. Coating liquid composition () Abrasive material (A)/(B) (see Table 1) A+B=300g Vinyl chloride-vinyl acetate copolymer (copolymerization ratio 87:13, degree of polymerization 380) 28.4g Polyester Polyurethane (reaction product of polyester with terminal hydroxyl groups consisting of butane diol and adipic acid and 2,4-diphenylmethane diisocyanate, molecular weight approximately 40,000) 13g Carbon black (average particle size 2μ)
………22.5g Amyl stearate……1.2g Oleic acid……3g Isocyanate compound (3 moles of 2.4-
75% by weight ethyl acetate solution of reaction product of tolylene diisocyanate compound and 1 mol of trimethylolpropane) 17g Nitrile butadiene rubber (NBR) 7.1g Butyl acetate 900g Example 3 Coating composition ( ) was used to make polishing tapes by changing the particle size of the abrasive, and the polishing conditions were the same as in Example 1.
Similarly, we investigated the effect of size. Results first
Shown in 3001 to 3005 of the table. Coating liquid composition () Abrasive material (see Table 1) (A) + (B) = 300g Vinyl chloride vinylidene chloride copolymer (copolymerization ratio = 7:3, degree of polymerization = 400)
………22g Epoxy resin (reaction product of bisphenol A and epichlorohydrin, molecular weight =
900, epoxy equivalent = 460-520, hydroxyl group content = 0.29%, Shell Oil Co Epicote 1001) ......16g Silicone oil (dimethylpolysiloxane)
......3.0g isocyanate compound (3 moles of 2,4-
75% by weight solution of the reaction product of tolylene diisocyanate compound and 1 mole of trimethylolpropane in ethyl acetate, Bayerz
AG Desmodur L-75) 21g Butyl acetate 900g
【表】【table】
【表】
第1表のデータから次のようなことが判る。
1 Cr2O3のみではヘツドの表面性およびチツピ
ングがよくない。
2 α−Fe2O3のみでは研磨量が少ない。
3 α−Fe2O3/Cr2O3が1/9〜9/1の範囲
で、ヘツドの表面性、チツピング、研磨量とも
すぐれたものが得られる。
4 研磨テープの全厚が10〜100μの場合に、す
ぐれた特性のヘツドとなる。
5 表面の凹凸が100μ以下であればチツピング
の発生防止が可能である。
本発明の研磨テープはカレンダリングして使用
するとまれに発生している100μ以上の凸部がな
くなり、研磨効果が向上し、ヘツドの仕上げ面の
精度が向上する。また、30℃以上の温度に1時間
加熱すると急な凸部がなくなり、粒子の脱落が少
ない研磨テープが得られる。更に本発明の範囲内
で研磨材のサイズを変えた研磨テープをつぎ合せ
て使用することによつて粗仕上げから仕上げまで
順次連絡して研磨仕上げを行なうことが可能とな
る。[Table] The following can be seen from the data in Table 1. 1 Cr 2 O 3 alone has poor surface properties and chipping of the head. 2. The amount of polishing is small when only α-Fe 2 O 3 is used. 3. When α-Fe 2 O 3 /Cr 2 O 3 is in the range of 1/9 to 9/1, a head with excellent surface properties, chipping, and polishing amount can be obtained. 4. When the total thickness of the abrasive tape is between 10 and 100 microns, the head has excellent properties. 5. If the surface irregularities are 100μ or less, chipping can be prevented. When the polishing tape of the present invention is calendered and used, the rarely occurring convex portions of 100μ or more are eliminated, the polishing effect is improved, and the precision of the finished surface of the head is improved. Furthermore, when heated to a temperature of 30° C. or higher for 1 hour, sharp protrusions disappear and an abrasive tape with fewer particles falling off is obtained. Further, within the scope of the present invention, by using abrasive tapes with different sizes of abrasive materials, it is possible to carry out polishing from rough finishing to finishing sequentially.
Claims (1)
いて、研磨材としてCr2O3およびα−Fe2O3を混
合比1:9〜9:1の範囲で組合せたものを用
い、全厚が10〜100μであり、研磨テープ表面の
凹凸が0.1mm以下であることを特徴とする研磨テ
ープ。1 In a polishing tape consisting of a support and a polishing layer, a combination of Cr 2 O 3 and α-Fe 2 O 3 in a mixing ratio of 1:9 to 9:1 is used as the polishing material, and the total thickness is 10 to 10. An abrasive tape having a diameter of 100μ and an unevenness on the surface of the abrasive tape of 0.1 mm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP367778A JPS5497408A (en) | 1978-01-19 | 1978-01-19 | Polishing tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP367778A JPS5497408A (en) | 1978-01-19 | 1978-01-19 | Polishing tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5497408A JPS5497408A (en) | 1979-08-01 |
JPS6210782B2 true JPS6210782B2 (en) | 1987-03-09 |
Family
ID=11564039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP367778A Granted JPS5497408A (en) | 1978-01-19 | 1978-01-19 | Polishing tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5497408A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6186169A (en) * | 1984-08-28 | 1986-05-01 | Fujitsu Ltd | Burnishing method |
JPH0357427Y2 (en) * | 1986-01-16 | 1991-12-27 | ||
JPH05305569A (en) * | 1992-11-25 | 1993-11-19 | Hitachi Ltd | Surface polishing method |
JPH05305570A (en) * | 1992-11-25 | 1993-11-19 | Hitachi Ltd | Abrasive member |
-
1978
- 1978-01-19 JP JP367778A patent/JPS5497408A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5497408A (en) | 1979-08-01 |
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