JPS6210463U - - Google Patents
Info
- Publication number
- JPS6210463U JPS6210463U JP10152085U JP10152085U JPS6210463U JP S6210463 U JPS6210463 U JP S6210463U JP 10152085 U JP10152085 U JP 10152085U JP 10152085 U JP10152085 U JP 10152085U JP S6210463 U JPS6210463 U JP S6210463U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- frame
- outer periphery
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10152085U JPS6210463U (xx) | 1985-07-02 | 1985-07-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10152085U JPS6210463U (xx) | 1985-07-02 | 1985-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6210463U true JPS6210463U (xx) | 1987-01-22 |
Family
ID=30972325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10152085U Pending JPS6210463U (xx) | 1985-07-02 | 1985-07-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6210463U (xx) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241993A (ja) * | 1987-03-30 | 1988-10-07 | 株式会社日立製作所 | 多層プリント板及びその製造方法 |
| JPH03185793A (ja) * | 1989-12-14 | 1991-08-13 | Nec Corp | 多層印刷配線板の製造方法 |
| JP2003021546A (ja) * | 2001-07-06 | 2003-01-24 | Denso Corp | メンブレン型センサおよびその製造方法 |
| JP2007180211A (ja) * | 2005-12-27 | 2007-07-12 | Ngk Spark Plug Co Ltd | 配線基板製造用コア基板、配線基板の製造方法 |
| JP2008085340A (ja) * | 2006-09-27 | 2008-04-10 | Samsung Electronics Co Ltd | 反り防止のための回路基板及びその製造方法 |
| JP2010165855A (ja) * | 2009-01-15 | 2010-07-29 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
-
1985
- 1985-07-02 JP JP10152085U patent/JPS6210463U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241993A (ja) * | 1987-03-30 | 1988-10-07 | 株式会社日立製作所 | 多層プリント板及びその製造方法 |
| JPH03185793A (ja) * | 1989-12-14 | 1991-08-13 | Nec Corp | 多層印刷配線板の製造方法 |
| JP2003021546A (ja) * | 2001-07-06 | 2003-01-24 | Denso Corp | メンブレン型センサおよびその製造方法 |
| JP2007180211A (ja) * | 2005-12-27 | 2007-07-12 | Ngk Spark Plug Co Ltd | 配線基板製造用コア基板、配線基板の製造方法 |
| JP2008085340A (ja) * | 2006-09-27 | 2008-04-10 | Samsung Electronics Co Ltd | 反り防止のための回路基板及びその製造方法 |
| JP2010165855A (ja) * | 2009-01-15 | 2010-07-29 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |