JPS61125072U - - Google Patents

Info

Publication number
JPS61125072U
JPS61125072U JP842585U JP842585U JPS61125072U JP S61125072 U JPS61125072 U JP S61125072U JP 842585 U JP842585 U JP 842585U JP 842585 U JP842585 U JP 842585U JP S61125072 U JPS61125072 U JP S61125072U
Authority
JP
Japan
Prior art keywords
pattern
heat conduction
circuits
utility
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP842585U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP842585U priority Critical patent/JPS61125072U/ja
Publication of JPS61125072U publication Critical patent/JPS61125072U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP842585U 1985-01-23 1985-01-23 Pending JPS61125072U (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP842585U JPS61125072U (xx) 1985-01-23 1985-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP842585U JPS61125072U (xx) 1985-01-23 1985-01-23

Publications (1)

Publication Number Publication Date
JPS61125072U true JPS61125072U (xx) 1986-08-06

Family

ID=30487696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP842585U Pending JPS61125072U (xx) 1985-01-23 1985-01-23

Country Status (1)

Country Link
JP (1) JPS61125072U (xx)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100990597B1 (ko) 2008-05-23 2010-10-29 삼성전기주식회사 방열패턴을 갖는 인쇄회로기판 및 그 제조방법
JP2018515941A (ja) * 2015-05-08 2018-06-14 アジャイル・パワー・スイッチ・3・ディー−インテグレイション・エイ・ピー・エス・アイ・3・ディー 半導体パワーデバイスおよび半導体パワーデバイスの組立て方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100990597B1 (ko) 2008-05-23 2010-10-29 삼성전기주식회사 방열패턴을 갖는 인쇄회로기판 및 그 제조방법
JP2018515941A (ja) * 2015-05-08 2018-06-14 アジャイル・パワー・スイッチ・3・ディー−インテグレイション・エイ・ピー・エス・アイ・3・ディー 半導体パワーデバイスおよび半導体パワーデバイスの組立て方法
US10714428B2 (en) 2015-05-08 2020-07-14 Agile Power Switch 3D—Integration Apsi3D Semiconductor power device and a method of assembling a semiconductor power device

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