JPS61153367U - - Google Patents
Info
- Publication number
- JPS61153367U JPS61153367U JP3559985U JP3559985U JPS61153367U JP S61153367 U JPS61153367 U JP S61153367U JP 3559985 U JP3559985 U JP 3559985U JP 3559985 U JP3559985 U JP 3559985U JP S61153367 U JPS61153367 U JP S61153367U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- oxygen
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3559985U JPS61153367U (xx) | 1985-03-13 | 1985-03-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3559985U JPS61153367U (xx) | 1985-03-13 | 1985-03-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61153367U true JPS61153367U (xx) | 1986-09-22 |
Family
ID=30540024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3559985U Pending JPS61153367U (xx) | 1985-03-13 | 1985-03-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61153367U (xx) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01251781A (ja) * | 1988-03-31 | 1989-10-06 | Narumi China Corp | セラミック回路基板およびセラミック回路基板の製造方法 |
-
1985
- 1985-03-13 JP JP3559985U patent/JPS61153367U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01251781A (ja) * | 1988-03-31 | 1989-10-06 | Narumi China Corp | セラミック回路基板およびセラミック回路基板の製造方法 |