JPS6210451U - - Google Patents
Info
- Publication number
- JPS6210451U JPS6210451U JP10199185U JP10199185U JPS6210451U JP S6210451 U JPS6210451 U JP S6210451U JP 10199185 U JP10199185 U JP 10199185U JP 10199185 U JP10199185 U JP 10199185U JP S6210451 U JPS6210451 U JP S6210451U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- peripheral wall
- facing
- substrates
- element piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Bipolar Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10199185U JPS6210451U (it) | 1985-07-04 | 1985-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10199185U JPS6210451U (it) | 1985-07-04 | 1985-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6210451U true JPS6210451U (it) | 1987-01-22 |
Family
ID=30973231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10199185U Pending JPS6210451U (it) | 1985-07-04 | 1985-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6210451U (it) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0196438A (ja) * | 1987-10-09 | 1989-04-14 | Mitsubishi Motors Corp | ターボチャージャを備える内燃エンジンのｏ↓２センサ取付構造 |
| JP2002289774A (ja) * | 2001-03-27 | 2002-10-04 | Furukawa Electric Co Ltd:The | 多層構造半導体装置 |
-
1985
- 1985-07-04 JP JP10199185U patent/JPS6210451U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0196438A (ja) * | 1987-10-09 | 1989-04-14 | Mitsubishi Motors Corp | ターボチャージャを備える内燃エンジンのｏ↓２センサ取付構造 |
| JP2002289774A (ja) * | 2001-03-27 | 2002-10-04 | Furukawa Electric Co Ltd:The | 多層構造半導体装置 |