JPS62101835U - - Google Patents
Info
- Publication number
- JPS62101835U JPS62101835U JP1985190304U JP19030485U JPS62101835U JP S62101835 U JPS62101835 U JP S62101835U JP 1985190304 U JP1985190304 U JP 1985190304U JP 19030485 U JP19030485 U JP 19030485U JP S62101835 U JPS62101835 U JP S62101835U
- Authority
- JP
- Japan
- Prior art keywords
- container
- adhesive
- light
- thin plate
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims 1
- 229910052753 mercury Inorganic materials 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985190304U JPH0643143Y2 (ja) | 1985-12-12 | 1985-12-12 | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 |
| PH34571A PH25206A (en) | 1985-12-12 | 1986-12-09 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| DE8686117185T DE3686314T2 (de) | 1985-12-12 | 1986-12-10 | Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat. |
| EP86117185A EP0226949B1 (en) | 1985-12-12 | 1986-12-10 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| US06/940,328 US4718967A (en) | 1985-12-12 | 1986-12-11 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| KR1019860010635A KR900004688B1 (ko) | 1985-12-12 | 1986-12-12 | 반도체 웨이퍼와 박판을 접착하는 접착제의 접착력 제어장치 |
| SG1063/92A SG106392G (en) | 1985-12-12 | 1992-10-13 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985190304U JPH0643143Y2 (ja) | 1985-12-12 | 1985-12-12 | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62101835U true JPS62101835U (enrdf_load_stackoverflow) | 1987-06-29 |
| JPH0643143Y2 JPH0643143Y2 (ja) | 1994-11-09 |
Family
ID=31143400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985190304U Expired - Lifetime JPH0643143Y2 (ja) | 1985-12-12 | 1985-12-12 | 半導体ウエハと薄板を接着する接着剤の接着力制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0643143Y2 (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121832A (en) * | 1977-04-01 | 1978-10-24 | Hitachi Chem Co Ltd | Method of protecting surface |
-
1985
- 1985-12-12 JP JP1985190304U patent/JPH0643143Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121832A (en) * | 1977-04-01 | 1978-10-24 | Hitachi Chem Co Ltd | Method of protecting surface |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0643143Y2 (ja) | 1994-11-09 |