JPS6197894A - Manufacture of strap board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is fixed to the pattern wiring surface of a printed board by soldering or the like, and prevents the pattern wiring from coming into conductive contact with each other when the pattern wiring crosses. This invention relates to a method of manufacturing a crossed strap plate.

In recent years, printed boards, which are widely used in the construction of electronic devices, have become more multi-layered due to the promotion of high-density packaging, but multi-layered printed boards are difficult to manufacture simply on a WJ and require advanced technology. 1 west.

Therefore, in electronic devices constructed at low cost, single-layer printed boards manufactured at low cost are often used.

In such a single-layer printed circuit board, independent pattern wirings that are not connected or branched are generally arranged so that they do not cross each other, but due to the 8 circuit configuration, line resistance increases when detour pattern wiring is formed. In some cases, this may be undesirable due to an increase in the space due to the increase or detour pattern wiring. In such cases, a strap plate is used to perform crossover of pattern wiring.

Therefore, it is desirable that such a strap plate occupy as little space as possible and be suitable for high-density packaging.

[Conventional technology]

Conventionally, it has been formed as shown in the perspective views of FIGS. 2(d), 2(e), and 2(f).

(d) In the figure, pattern wiring 1 and 2 are crossed over to pattern wiring 3 by wire 5 with insulation coating.
It is designed to connect.

This connection is made by soldering the core wire 5A of the wire 5 to the respective pattern wirings 1 and 2 using solder 8.

Similarly, the figure (e) shows a chip resistor 6 formed by an insulating layer 6A and a conductive layer 6B, and further provided with an electrode 6C on the end face, and the electrode 6C is connected to the pattern wirings 1 and 2 by solder 8. Figure (f) shows a mini-flat 7 in which a conductive material 7A is provided on an insulating material 7B, and the conductive material 7A is soldered to pattern wirings 1 and 2 using solder 8. be.

By forming in this way, the pattern wiring 1.2 was crossed over with respect to the pattern wiring 3.

[Problem that the invention seeks to solve]

In such a configuration, when a plurality of pattern wirings 1.2 are installed together, the wire rods 5. Chip resistance6. No matter which one of the Mini Flat 7 is used, each has its own thickness, and each one must be soldered one by one.

A space is required for installation, and the attached pins require a certain amount of space.

Therefore, when the number of pattern wirings 1.2 increases, there is a problem in that the packaging density decreases.

[Means for solving problems]

The problem mentioned above is that the first step is to form a pattern wiring on one side of the insulating sheet, the second step is to form through holes at predetermined locations on the insulating sheet by etching, and the second step is to form the pattern wiring on one side of the insulating sheet. The problem is solved by the method of manufacturing a strap plate according to the present invention, which is manufactured by a third step of protruding the patterned wiring.

[Effect]

That is, by forming pattern wiring on an insulating sheet, the above-mentioned interval can be narrowed even when a large number of pattern wirings are to be connected.

Therefore, it is possible to improve the packaging density compared to the conventional case.

〔Example〕

The present invention will be explained in detail below with reference to an embodiment shown in FIG. (a) The figure is a perspective view, (b) The figure is a sectional view (cl) (C
2) (C3) (C4) Figures are explanatory views of the manufacturing process. It should be noted that the same reference numerals refer to the same objects throughout the design.

(a) As shown in the figure, it is constructed by forming a protruding part 11A from which a pattern wiring 11 protrudes in a penetrating part 10A of an insulating sheet 10.

With this configuration, as shown in Figure (b), the cross-over connection of the pattern wiring 3 is achieved by fixing the protrusion 11A to the pattern wiring 1 and 2 to be crossed over with the solder 8 to the printed board 4. I can do it.

Further, such a configuration can be manufactured by the following steps.

First, as shown in Figure (cl), a film-like insulating sheet 10 cut into a predetermined size is used.

(C2) As shown in the figure, a plurality of pattern wirings 11 are formed on one side of the insulating sheet 10. This pattern wiring 11
2 may be formed, for example, by pasting copper foil and etching.

Next, after forming the pattern wiring 11, as shown in FIG.

Furthermore, the patterned wiring 11 stretched across the 9-penetrating portion 10A is manufactured by extruding it in the direction of the arrow A by press working to form the protruding portion 11A so that it protrudes from the other surface of the insulating sheet 10 (C4) as shown in the figure. Ru.

When manufactured in this way, each Bakun wiring 110
The spacing can be made as narrow as possible, compared to conventional wire rods 5. Chip resistance6. It is clear that the occupied space can be reduced more than the mini-flat 7.

Further, by providing the first through-hole 10A, there is an advantage that the joint can be visually observed during soldering through the second through-hole 10A.

〔Effect of the invention〕

As explained above, one aspect of the present invention is to form a patterned wiring on a film-like insulating sheet, and to make the patterned wiring protrude.

This allows for higher density than before.

The cost can be reduced and the practical effects are great.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of the present invention, (a) is a perspective view, (b) is a sectional view, (C1) (C2) (c
3) (c4) Figure is an explanatory diagram of the manufacturing process. FIG. 2 shows a conventional device (d), (e), and (f) are perspective views. In fig. 1.2.3.11 is pattern wiring. 4 is a printed board. 8 is solder. 10 indicates an insulating sheet.

Claims (1)

[Claims] A strap board that is fixed to a patterned wiring surface of a printed board, that is crossed without conductive contact with one of the first patterned wirings to be crossed, and connected to the other second patterned wiring so as to have conductivity, , a first step of forming a pattern wiring on one surface of the insulating sheet, a second step of forming a through part by etching at a predetermined location of the insulating sheet, and protruding the pattern wiring exposed in the through part. A method for manufacturing a strap plate, characterized in that the strap plate is manufactured by a third step of: