JPS6196749A - Splitting device for semiconductor wafer - Google Patents

Splitting device for semiconductor wafer

Info

Publication number
JPS6196749A
JPS6196749A JP59217705A JP21770584A JPS6196749A JP S6196749 A JPS6196749 A JP S6196749A JP 59217705 A JP59217705 A JP 59217705A JP 21770584 A JP21770584 A JP 21770584A JP S6196749 A JPS6196749 A JP S6196749A
Authority
JP
Japan
Prior art keywords
wafer
resin sheet
semiconductor wafer
sheet
split
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59217705A
Other languages
Japanese (ja)
Inventor
Takumi Matsukura
松倉　巧
Satoshi Takabayashi
高林　聡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP59217705A priority Critical patent/JPS6196749A/en
Publication of JPS6196749A publication Critical patent/JPS6196749A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To eliminate the interposition of bubbles between the resin sheet and a semiconductor wafer, which is the cause of such split failure as break and crack to generate at the time of split of the wafer, by a method wherein two processes of the contact-bonding process of the wafer and the resin sheet and the wafer splitting process are incorporated into one process. CONSTITUTION:When a braking roller 5 is made to shift on a semiconductor wafer 1, a resin sheet 2 is heated, the semiconductor wafer 1 is contact-bonded by heat to the resin sheet 2, and at the same time, the wafer 1 is splitted along its scribed line on one side of its scribed lines. After the thermal contact-bonding of the resin sheet to the wafer and the split of the wafer 1 are performed, the resin sheet 2, which is unwound from the roll, is cut by a cutter 7 and when the wafer 1 is made to rotate by a rotating table 8 at 90 degrees along with a braking pad 3 and the braking roller 5 is made to return in its former direction, the wafer 1 is splitted in individual chips along its scribed line on another side.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置の製造工程のうち、半導体素子が
形成された多数のチップ領域を含む半導体ウェーハを、
個々のチップに分割するために用いる分割装置に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a process for manufacturing a semiconductor device, in which a semiconductor wafer including a large number of chip regions on which semiconductor elements are formed is processed.
This invention relates to a dividing device used to divide into individual chips.

〔従来の技術〕[Conventional technology]

従来、多数のチップが形成された半導体ウェーハを個々
のチップに分割するにはつぎのようにして行なわれてき
た。すなわち、ダイシングソー等によって所望の寸法に
スクライブされた半導体ウェーハ（以下単にウェーハと
いう。）は、まず、一枚ずつに分割した樹脂シートに圧
着され、次工程である分割工程で、ローラによりスクラ
イブラインに沿って分割される。Conventionally, a semiconductor wafer on which a large number of chips have been formed has been divided into individual chips in the following manner. In other words, a semiconductor wafer (hereinafter simply referred to as a wafer) that has been scribed into desired dimensions using a dicing saw or the like is first pressure-bonded to a resin sheet that has been divided into individual pieces. divided along.

このように、樹脂シートの圧着と、ローラによる分割と
に工程が分けられていた理由として、シートとウェーハ
の密着性があげられる。このシートの密着不良により、
シートとウェーハ間に気胞が生じると、との気胞は周囲
のシートの密着力により脱胞は非常に困離となる。そし
て、気胞が介在したままシートに圧着されたウェーハを
ローラで分割すると、前記気胞はローラの荷重を分散し
てしまい分割残りの発生原因となる。また、分割できた
場合でも、分割されたチップが気胞によシシートに固着
されていない為、隣接チップと接触をおこし、カケの発
生原因となる。しかも、シートとの密着が倫い場合はそ
の後の組立工程で突然チップが離脱することが起こり、
歩留低下の一因ともなっていた。The reason why the process was divided into the pressure bonding of the resin sheet and the division by rollers is the adhesion between the sheet and the wafer. Due to poor adhesion of this sheet,
When air pores are formed between the sheet and the wafer, it becomes very difficult to remove the air pores due to the adhesion of the surrounding sheets. If a wafer that has been pressure-bonded to a sheet with air bubbles present is divided by a roller, the air bubbles will disperse the load of the roller and cause undivided wafers to remain. Furthermore, even if the chip is divided, since the chip is not fixed to the sheet through the air cells, it may come into contact with adjacent chips, causing chipping. Moreover, if the contact with the sheet is not good, the chip may suddenly come off during the subsequent assembly process.
This was also a cause of a decrease in yield.

〔発明が解決しようとする間魂点〕[The problem that the invention is trying to solve]

上述のとおり、従来の半導体ウェーハ分割手段では、半
導体ウェーハと圧着した樹脂シートとの間に気胞が介入
する恐れがあり、また、工数的にも問題があった。As described above, in the conventional semiconductor wafer dividing means, there is a risk that air bubbles may intervene between the semiconductor wafer and the pressed resin sheet, and there is also a problem in terms of man-hours.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点罠対し、本発明では、表面にスクライブを施
した半導体ウェーハの裏面を上にして載置するブレーキ
ングパッドと、一端側を固定し他ヶ　　　　　　端側を
引張った状態で樹脂シートを前記半導体つ工−ハの上に
展張する手段と、前記樹脂シートの固定端側から他端側
にかけて前記樹脂シートを前記半導体ウェーハに押圧し
ながら加熱ローラを移動させ、前記半導体ウェーハを前
記スクライブの線に沿って分割する手段とを備えている
。In order to solve the above-mentioned problems, the present invention uses a breaking pad on which a semiconductor wafer with a scribe on its surface is placed with its back side facing up, and a resin sheet with one end fixed and the other end stretched. A heating roller is moved while pressing the resin sheet against the semiconductor wafer from the fixed end side of the resin sheet to the other end side of the resin sheet, and the semiconductor wafer is stretched over the scribe line. and means for dividing along.

〔実施例〕〔Example〕

つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.

第１図ないし第３図は本発明の一実施例を、その動作に
ついて説明するだめの側面図である。まず第１図におい
て、１はスクライブの施されたウェーハであり、弾力性
金有するブレーキングパッド３の上に、カバーシート４
を介して置かれている。半導体ウェーハ１の上方には、
ロールに巻かれた樹脂シート２の一端は固定台６に固定
され、他端側はロールと共に斜め上方に引張られている
。1 to 3 are side views of an embodiment of the present invention for explaining its operation. First, in FIG. 1, numeral 1 is a scribed wafer, and a cover sheet 4 is placed on a braking pad 3 made of elastic gold.
is placed through. Above the semiconductor wafer 1,
One end of the resin sheet 2 wound into a roll is fixed to a fixed base 6, and the other end side is pulled diagonally upward together with the roll.

つぎに、第２図に示すように、ブレーキングローラ５が
樹脂シート２の固定端側からロール側に樹脂シート２を
半導体ウエーノ・１上に押圧しながら移動させる。この
際、ブレーキングローラ５Ｆｉ内蔵されたヒータ（図示
せず）により予じめ加熱されている。よって、ブレーキ
ングローラ５か゛、ウェーハ１上を移動するときに、シ
ート２が加熱され、ウェーハ１はシート２に熱圧着され
ると同時に、ウェーハ１けスクライブラインに沿って分
割される。シートの熱圧着および分割が行われた後、第
３図のように、ロールから巻きほどかれた樹脂シート２
は、カッタ７により切断され、それから、ウェーハ１は
ブレーキングパッド３と共に回転テーブル８により９０
度回転されて、ブレーキングロー２５が元の方向に戻る
ときに、もう一方のスクライブツインに沿って個々のチ
ップに分割される。Next, as shown in FIG. 2, the breaking roller 5 moves the resin sheet 2 from the fixed end side of the resin sheet 2 to the roll side while pressing it onto the semiconductor wafer 1. At this time, the braking roller 5Fi is preheated by a built-in heater (not shown). Therefore, when the breaking roller 5 moves over the wafer 1, the sheet 2 is heated, and the wafer 1 is bonded to the sheet 2 by thermocompression, and at the same time, the wafer 1 is divided along the wafer 1 scribe line. After the sheet is thermocompressed and divided, the resin sheet 2 is unwound from the roll as shown in FIG.
The wafer 1 is cut by a cutter 7, and then the wafer 1 is cut by a rotating table 8 along with a breaking pad 3.
degree and as the breaking row 25 returns to its original direction, it is split into individual chips along the other scribe twin.

第４図は、ブレーキングローラの加熱手段の他の利を示
す側面図で、本例では、前述の内蔵ヒータの代わりに、
ブレーキングローラ１５に熱風装置９から熱風を吹きつ
けて加熱する。FIG. 4 is a side view showing another advantage of the heating means for the braking roller; in this example, instead of the above-mentioned built-in heater,
The braking roller 15 is heated by blowing hot air from the hot air device 9.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、従来側々の工程として独立していたウ
ェーハと樹脂シートの圧着およびウェー・・分割の２工
程を−〒程にすることにより自動化でき、しかも、ウェ
ーハ分割時の欠け、割れなどの分割不良の原因である樹
脂シートとウェーハ間の気胞の介在を、シートをウェー
ハに対して角度を保つようにテンションを加えながら圧
着することにより、チップとシートとの接着力も増大し
、この後の組立工程でのハンドリングも容易となって、
工数削減、歩留り向上に寄与する。According to the present invention, it is possible to automate the two processes of crimping the wafer and resin sheet and dividing the wafer, which were conventionally independent processes, by reducing the number of steps. By applying tension while maintaining the angle of the sheet to the wafer, the adhesive strength between the chip and the sheet is increased, and this It also becomes easier to handle during the subsequent assembly process.
Contributes to reducing man-hours and improving yield.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図は本発明の一実施例をその動作につ
いて説明するだめの側面図、第４図はブレーキングロー
ラの加熱手段の他の例を示す側面図である。 １−・・・・・半導体ウェーハ、２・・・・・・樹脂シ
ート、３・・・・・・ブレーキングパッド、４・・・・
・・カバーシート、５．１５・・・・・・ブレーキング
ローラ、６・・・・・・固定台、７・・・・・・カッタ
、８・・・・・・回転テーブル、９・・・・・・熱風装
置。1 to 3 are side views for explaining the operation of an embodiment of the present invention, and FIG. 4 is a side view showing another example of heating means for a braking roller. 1-... Semiconductor wafer, 2... Resin sheet, 3... Braking pad, 4...
...Cover sheet, 5.15...Breaking roller, 6...Fixed base, 7...Cutter, 8...Rotary table, 9...・・・Hot air device.

Claims (1)

【特許請求の範囲】[Claims] 表面にスクライブを施した半導体ウェーハの前記スクラ
イブ面を下にして載置するブレーキングパッドと、一端
側を固定し他端側を引張った状態で前記半導体ウェーハ
上に樹脂シートを展張する手段と、前記樹脂シートの固
定端側から他端側にかけて前記樹脂シートを前記半導体
ウェーハに押圧しながら加熱ローラを移動させ前記半導
体ウェーハを前記スクライブ線に沿って分割する手段と
を備えたことを特徴とする半導体ウェーハ分割装置。a breaking pad for placing a semiconductor wafer with the scribed surface facing down; a means for stretching a resin sheet over the semiconductor wafer with one end fixed and the other end pulled; The method is characterized by comprising means for dividing the semiconductor wafer along the scribe line by moving a heating roller while pressing the resin sheet against the semiconductor wafer from the fixed end side of the resin sheet to the other end side. Semiconductor wafer dividing equipment.
JP59217705A 1984-10-17 1984-10-17 Splitting device for semiconductor wafer Pending JPS6196749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59217705A JPS6196749A (en) 1984-10-17 1984-10-17 Splitting device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59217705A JPS6196749A (en) 1984-10-17 1984-10-17 Splitting device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS6196749A true JPS6196749A (en) 1986-05-15

Family

ID=16708441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59217705A Pending JPS6196749A (en) 1984-10-17 1984-10-17 Splitting device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS6196749A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07186272A (en) * 1993-12-28 1995-07-25 Stanley Electric Co Ltd Welding of plastic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07186272A (en) * 1993-12-28 1995-07-25 Stanley Electric Co Ltd Welding of plastic parts

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