JP2567396B2 - Semiconductor device manufacturing equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a semiconductor device manufacturing apparatus,
More specifically, the present invention relates to an apparatus for dividing chips formed on a wafer into individual pieces on an adhesive tape and at the same time expanding the adhesive tape and attaching the expanded tape to the molecular chips.

2. Description of the Related Art A technique for individually dividing a large number of chips formed on one wafer is called dicing. As a method of dividing, a scribing (sc
There is a ribing) method and a dicing saw method in which a diamond is deeply cut by high-speed rotation of a thin diamond blade and can be mechanically divided or divided at the time of cutting.

The wafer half-cut by the scribing or dicing is divided into individual chips by mechanical means. FIG. 2 is a schematic diagram of a configuration of a conventional device for dividing the wafer.

The illustrated apparatus includes a base 11. A rubber mat 12 is laid on the base 11. The half-cut wafer 13 is placed upside down on the mat 12, that is, the chip 13-formed surface of the wafer 13 and the upper surface of the mat 12 face each other. A tape 15 is attached to the back surface of the wafer 13 in advance. Tape 15 is wafer 13
The chips are used so as to maintain the original positional relationship without being dispersed even when divided.

Next, the side surface of the cylindrical rod-shaped roller 14 is pressed against the back surface of the wafer 13 to rotate the wafer 13 to divide the wafer 13. Each chip of the divided wafer is completely separated by expanding the tape 15. In this way, the chips separated on the tape 15 are appropriately cut and used as needed.

As described above, in a conventional device for dividing a chip formed on a wafer having an overall circular shape, a wafer supported by a rubber mat having a high elasticity mounted on a base is supported by a cylindrical rod-shaped roller. I was pressing and splitting. The pressed wafer and mat are deformed into a downward convex curved surface. However, the pressing surface obtained by the rotational movement of the cylindrical rod-shaped roller is flat, and a larger pressing force is applied to the peripheral portion of the wafer than to the central portion.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described above, in the conventional semiconductor device manufacturing apparatus, excessive pressing force is applied to a part of a circular wafer, which may cause chips to be chipped or wiring to be damaged. There was a problem. In order to avoid such a problem, there is a problem that the pressing force needs to be adjusted and the device becomes expensive. Also,
There is a problem in that the tape is attached to the back surface of the wafer in advance, the tape is expanded and then the chip is separated to divide the chip, and the number of steps is large.

Therefore, the present invention is to provide a semiconductor device manufacturing apparatus that can be accurately divided and has a small number of steps without applying an excessive pressing force to a part of a wafer.

Means for Solving the Problems That is, according to the present invention, a mat having flexibility, a means for supporting the mat in a substantially horizontal direction, and a means for stretching and supporting the tape in a substantially horizontal direction above the mat. A pressing means supported above the tape and having a downwardly convex spherical surface portion, a means for heating the convex spherical surface portion, the mat supporting means, the tape tension supporting means, and the pressing means. Means for driving the tape to be stretched substantially horizontally above the mat, and then heated to a predetermined temperature of the pressing means through the tape on the back surface of the wafer placed on the mat. Provided is a semiconductor device manufacturing apparatus, characterized in that the convex spherical surface portion is pressed to divide the wafer into individual chips, at the same time, the tape is expanded and the completely separated chips are attached to the tape. You.

According to a preferred embodiment of the present invention, the mat is
It is circular, and more preferably made of rubber.

Further, according to a preferred embodiment of the present invention, the predetermined temperature is about 60 ° C.

Further, according to a preferred aspect of the present invention, the pressing means includes at least three rods vertically implanted in the supporting means of the mat, and a downwardly convex spherical portion laterally supported by the rods. The convex spherical surface portion is substantially larger than the wafer, and includes a pressing plate, a wafer ring supported vertically around the convex spherical surface portion, and means for driving the wafer ring up and down.

Operation As described above, in the semiconductor device manufacturing apparatus of the present invention, the convex spherical surface portion is pressed with a required pressure against the back surface of the wafer placed on the flexible mat. The pressed wafer deforms together with the mat into a concave spherical surface that matches the convex spherical surface, that is, a spherical surface convex downward. In this way, the wafer supported on the flexible mat is deformed so as to be aligned with the pressing surface, so that the wafer starts to be cracked from its central portion,
The crack spreads to the periphery. At that time, excessive force does not act on the cracked portion. Therefore, each chip formed on the wafer is subjected to the same required pressing force, and the wafer can be accurately divided without damaging the chips.

In addition, the semiconductor device manufacturing apparatus of the present invention includes a tape fixed and stretched substantially horizontally between the wafer placed on the mat and the convex spherical surface portion. Therefore, by lowering the convex spherical surface portion, the tape is brought into close contact with the convex spherical surface portion which has been heated to a predetermined temperature (about 60 ° C.) in advance so that the ductility of the tape is increased and the tape is expanded. Therefore, the convex spherical surface portion can be lowered to press the back surface of the wafer to divide it into individual chips, and the tape can be attached in close contact with each chip of the divided wafer. Next, the expanded tape can be automatically attached to the wafer ring by raising the convex spherical surface portion and lowering the wafer ring mounted around the convex spherical surface portion. That is, the steps of attaching the tape to the back surface of the wafer, dividing the wafer, and expanding the tape are automatically processed.

If a circular rubber mat that is supported on the periphery is used, the wafer to be pressed is also circular and the mat is highly flexible so that the deformation of the wafer can be easily followed. It becomes uniform, and the occurrence of damage due to division can be avoided.

Embodiment An embodiment of the semiconductor device manufacturing apparatus of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic configuration diagram of one embodiment of the semiconductor device manufacturing apparatus of the present invention.

The illustrated apparatus includes a rubber mat 2 in the shape of a circular plate. The mat 2 is peripherally supported by a ring-shaped base 1. At least three, for example, four rods 5 are vertically planted on the upper end surface of the base 1. A tape 8 is stretched over the middle of the rod 5 substantially horizontally. The member supporting the periphery of the tape 8 is configured to be vertically movable along the rod 5. Further, on the upper end of the rod 5, a circular plate-shaped pressing plate 6 is horizontally mounted substantially horizontally. The pressing plate 6 has a convex spherical surface portion 7 on its lower surface, and is configured to be vertically movable along the rod 5. Around the convex spherical surface portion 7, a wafer ring 9 is mounted so as to be vertically movable.

The semiconductor device manufacturing apparatus of the present invention configured as described above operates as follows.

The wafer 3 is placed upside down, that is, the half-cut wafer 3 is placed on the mat 2 so that the chip-formed surface of the wafer 3 faces the upper surface of the mat 2. Next, the pressing plate 6 is moved downward by a driving means (not shown), and the tape 8 is brought into close contact with the convex spherical surface portion 7 which has been heated to a predetermined temperature (about 60 ° C.) in advance to enhance the ductility of the tape 8. Further, after the convex spherical surface portion 7 is lowered and the tape 8 is pressure-bonded to the back surface of the wafer 3, the convex spherical surface portion 7 is pressed against the back surface of the wafer 3.

The wafer 3 pressed by the convex spherical surface portion 7 is a rubber mat 2
It deforms into a spherical surface that is convex upward while being in contact with. As a result, the wafer begins to crack from the central portion and the crack spreads to the peripheral portion. At that time, excessive force does not act on the cracked portion. Therefore, the same degree of pressure is applied to the individual chips formed on the wafer 3, and the chips can be accurately divided without damage.

Further, at that time, the tape 8 is attached to each chip of the divided wafer 3. Next, the wafer ring 9 mounted around the convex spherical surface portion 7 while raising the convex spherical surface portion 7.
When the tape is lowered, the expanded tape 8 can be automatically attached to the wafer ring 9.

EFFECTS OF THE INVENTION As described in detail above, in the semiconductor device manufacturing apparatus of the present invention, the convex spherical surface portion is pressed against the back surface of the wafer placed on the peripherally supported flexible mat to form it on the wafer. The divided large number of chips are individually divided. Therefore, it is possible to prevent the chips formed on the wafer from being damaged by the same pressure. As a result, the wafer can be accurately divided and the yield is improved.

Further, in the semiconductor device manufacturing apparatus of the present invention, the steps of attaching the tape to the back surface of the wafer, dividing the wafer, and expanding the tape are automatically processed, and the number of steps can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of one embodiment of a semiconductor device manufacturing apparatus of the present invention, and FIG. 2 is a schematic configuration diagram of a conventional semiconductor device manufacturing apparatus. (Main reference numbers) 1 ... Base, 2 ... Mat, 3 ... Wafer, 5 ... Rod, 6 ... Pressing plate, 7 ... Convex spherical portion, 8 ... Tape, 9
…… Wafer ring, 11 …… Base, 12 …… Matt, 13 ……
Wafer, 14 …… Roller, 15 …… Tape

Claims (5)

(57) [Claims] 1. A flexible mat, a means for supporting the mat substantially horizontally, a means for stretching and supporting the tape substantially horizontally above the mat, and a lower part supported above the tape. The tape comprises: a pressing means having a convex spherical surface portion, a means for heating the convex spherical surface portion, a means for relatively driving the mat supporting means, the tape tension supporting means, and the pressing means. After being stretched and supported almost horizontally above the mat, the convex spherical surface heated to a predetermined temperature of the pressing means is pressed against the back surface of the wafer placed on the mat via the tape, An apparatus for manufacturing a semiconductor device, characterized in that a wafer is divided into individual chips, at the same time, the tape is expanded and the completely separated chips are attached to the tape. 2. A device according to claim 1, characterized in that the mat is circular. 3. The apparatus according to claim 1, wherein the mat is made of rubber. 4. The apparatus according to any one of claims 1 to 3, wherein the predetermined temperature is about 60 ° C. 5. The pressing means comprises at least three rods vertically implanted in the supporting means of the mat, a pressing plate laterally supported by the rods and having a downward convex spherical surface portion, and the convex means. A wafer ring that is vertically movable around a spherical surface, and means for driving the wafer ring up and down.
The apparatus according to any one of claims 1 to 4, wherein the convex spherical surface portion is substantially larger than the wafer.