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Priority to JP1984181751UpriorityCriticalpatent/JPS6196556U/ja
Publication of JPS6196556UpublicationCriticalpatent/JPS6196556U/ja
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W90/00—Package configurations
H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
Die Bonding
(AREA)
Lead Frames For Integrated Circuits
(AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)