JPS6189654A - Dual inline package type semiconductor manufacturing apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Industrial Application Field The present invention relates to a processing device for a dual in-line package (hereinafter referred to as DIR) type semiconductor, and more specifically to a processing device for a dual in-line package (hereinafter referred to as DIR) type semiconductor. A processing device that uses a laser beam to separate half-body bodies at the lead frame section? ff1.
: It is related to.

b. Conventional technology In recent years, plastic DIP type semiconductors have become suitable for mass production, inexpensive, and have significantly improved reliability.
IC along with in-line package (SIP) type semiconductors
It is the mainstream and is often used on TV etc. This type of semiconductor is manufactured by attaching chips to multiple lead frames, wire bonding, placing them in a mold, molding them with epoxy resin, etc., and cutting the lead frames into individual pieces. It is something that The separation of the lead frames has conventionally been carried out using mechanical methods such as a press or a grinder.

Problems to be Solved by the C0 InventionAs mentioned earlier, mechanical methods are used to cut and separate the lead frames of plastic DIP type semiconductors, so there was a problem of low yield and productivity. . It is an object of the present invention to provide a processing device for a DIP type semi-core body that has improved the above-mentioned problems.

Means for Solving the d0 Problem In order to achieve the above-mentioned object, the present invention provides a machine with a feeder for carrying multiple dual in-line batts (DIR) type semiconductor devices, and separates and processes the semiconductors. The gist of the configuration is that a plurality of laser heads are movably provided on a machine stand.

01 Effect Since the present invention is constructed as described above, a series of molded DIP type semiconductors are placed on a feeder for conveying semiconductors, and a predetermined position of a lead frame is placed.
From multiple movable laser heads installed on the machine,
By simultaneously irradiating the laser beams, the lead frame can be cut efficiently.

[Embodiment] Next, an embodiment of the present invention will be described based on the drawings. FIG. 1 shows the first embodiment, in which multiple DIs are installed on the machine 1.
A feeder 3 for P-type semiconductors is provided in the left-right direction (X direction), and two rails 5 are attached to the machine base 1 in the vertical direction (Z direction), and a flat plate member is mounted along the rails. 7 is installed at a position 11 that can be freely moved upwardly (in the Z direction) by a motor 9. A rail 11 is provided on the flat plate portion 47, along which a block 13 is provided movably in the right direction (X direction) by means 15.

A bending mirror block 17 is fixed to the machine base 1, and each block fixed to the flat plate member 7 includes a bending mirror block 21, a beam splitter block 23, and a bending mirror block 25.
is installed. The block 13 includes two beam splitter blocks 27 and two bending mirror blocks 29, and each block is provided with a laser head 31.

The distance and interval between the beam splitter block 27 and the two bending mirror blocks (Fig. 2)
) is provided in a position adjustable manner by a rod-shaped member 33 or the like.

In this configuration, the laser beam incident from the direction of the arrow passes through the beam splitter block 2 as shown in FIG.
3.27, its output is divided and output as a focused beam from four laser heads 31.

4 (I!il's laser head 31 has motors 9 and 15
Since it moves on the X7 plane, multiple DIP type semiconductors (not shown) placed on the feeder 3 can be processed. The part indicated by the thick line in the optical path in FIG. 2 is the part where the distance changes in order to scan the laser beam.

FIG. 3 shows the second embodiment, in which two feeders 37 for multiple DIP type semiconductors are attached to several machines 35, and three two-wooden rails are mounted on the machine base 35 in the left and right direction ( Along this rail, a flat plate member 41 is provided so as to be movable left and right (in the X direction) by a motor 43.

The flat member 41 is provided with two rails 45, along which a block 47 is moved in the front-back direction (
It is provided movably in the Y direction).

A block 51 is fixed to the flat member 41,
This block 51 includes a bending mirror block 53, a vibrator 55, and a beam splitter block 57.
is attached. Two beam splitters 59 and two bending mirror blocks 61 are attached to the block 47, and a laser head 63 is attached to each block. The beam splitter block 59 and the bending mirror
The distance and interval between the blocks 61 (FIG. 4, A3 and A4) are provided so that their positions can be adjusted freely by means of a rod-shaped member 65 and the like.

In this configuration, as shown in FIG. 4, the laser beam incident from the direction of the arrow has its output divided by y:lI each time it passes through the beam splitter 57, 59, and is focused from the four heads 63. It comes out as a beam. Since the four laser heads 63 are moved on the XY plane by the motors 43 and 49, the multiple DIPs mounted on the feeder 37
It is possible to process shaped semiconductors (not shown). The part indicated by the thick line in the optical path in FIG. 4 is the part where the distance changes in order to scan the laser beam.

In these embodiments, four laser heads are used, but a configuration with more heads is also possible. Also, if you create a module like this, C
Combination with lasers such as O2 laser, YAG laser, etc. is possible. Furthermore, although the embodiment shows a 4B4 optical path system using mirrors and beam splitters, it is also possible to use an optical path system using optical fibers.

9. Effects of the Invention As can be understood from the above explanation, the present invention has the structure set forth in the claims, and therefore can provide a DIP type semiconductor processing device with low stoppage and high productivity. can.

[Brief explanation of drawings]

FIG. 1 is a three-dimensional explanatory diagram of the first embodiment of the present invention, FIG. 2 is an optical path diagram of the laser beam of the first embodiment, FIG. 3 is a three-dimensional explanatory diagram of the second embodiment, and FIG. FIG. 2 is an optical path diagram of a laser beam in a second embodiment. Explanation of symbols representing main parts in drawings 1... Machine base
3... Feeder 17... Bending mirror block 21... Bending mirror block 2
3... Beam splitter block 25... Bending mirror block 27... Beam splinter block 2... Bending mirror block 31... Laser head 35... Nadadai 37...
・Feeder 53... Bending mirror block 57... Beam splitter block 59...
Beam splitter block 61... Bending mirror block 63... Laser head, - two knees @ 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] The machine is equipped with multiple dual inline packages (
1. A dual in-line package type semiconductor processing apparatus, characterized in that a feeder for placing DIP type semiconductors is provided, and a plurality of laser heads for separating and processing the semiconductors are movably provided on the machine stand.