JPS618937A - Heating device for bonder - Google Patents
Heating device for bonderInfo
- Publication number
- JPS618937A JPS618937A JP59130705A JP13070584A JPS618937A JP S618937 A JPS618937 A JP S618937A JP 59130705 A JP59130705 A JP 59130705A JP 13070584 A JP13070584 A JP 13070584A JP S618937 A JPS618937 A JP S618937A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- bonding
- pellet
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はワイヤボングーにおけるリードフレームの加熱
装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a heating device for a lead frame in a wire bongoo.
（従来技術）
ワ・イヤボンディングにおいては、ＩＣ，ＬＳＩ等のベ
レットが取付けられたリードフレームのリードとベレッ
トのパッドとにワイヤをボンディングする時に、リード
フレームに加熱体を当接させ、リードフレーム全体を加
熱している。(Prior art) In wire-ear bonding, when bonding a wire to the lead of a lead frame to which a pellet of IC, LSI, etc. is attached and the pad of the pellet, a heating element is brought into contact with the lead frame, and the entire lead frame is heated. is being heated.
（従来技術の問題点）
ところで、リード側は、メッキの種類、表面の状態、リ
ードの厚み、材質等によっても異なるが一般にボンダビ
リテイーが悪く、約２２０℃以上に加熱する必要がある
。(Problems with the Prior Art) By the way, the lead side generally has poor bondability, which varies depending on the type of plating, surface condition, lead thickness, material, etc., and requires heating to about 220° C. or higher.
一方、ベレットは２２０℃程度の高温にすると、性能が
大幅に劣化したり、ひどい場合着こは内部パターンが破
壊してしまうものが最近多くなっている。On the other hand, when the bellet is heated to a high temperature of about 220 degrees Celsius, its performance deteriorates significantly, and in severe cases, the internal pattern of the bellet is destroyed.
しかしながら、従来のボンダー用加熱装置は、加熱体で
リードフレームを一様に加熱しているので、チップに急
影響を及ぼさないようにするには、リードフレーム全体
を低温に加熱しなければならなく、リード側のボンタ′
ビリティ−が悪いという欠卓があった。However, conventional bonder heating devices uniformly heat the lead frame with a heating element, so the entire lead frame must be heated to a low temperature in order to avoid sudden effects on the chip. , lead side bonta′
The one thing that was missing was poor performance.
（発明の目的）
本発明の目的は、高温に加熱できないベレットのボンデ
ィングを良好に行うことができるボングー用加熱装置を
提供することにある。(Objective of the Invention) An object of the present invention is to provide a heating device for bongoos that can successfully bond pellets that cannot be heated to high temperatures.
（発明の実施例） 以下、本発明を図示の実施例により説明する。(Example of the invention) Hereinafter, the present invention will be explained with reference to illustrated embodiments.
第１図は本発明の一実施例を示す正面図、第２図は第１
図のＡ−Ａ線断面図、第３図は要部拡大断面図である。FIG. 1 is a front view showing one embodiment of the present invention, and FIG. 2 is a front view showing one embodiment of the present invention.
FIG. 3 is an enlarged sectional view of the main part.
アイランド部分１ａにベレット２が取付けられたリード
フレーム１は、相対向して配設されたガイドレール３．
３に沿って図示しないピッチ送り機構でベレット２のピ
ッチ分だけ間欠的に移送される。前記ガイドレール３．
３間にはカートリッジヒータ４を内蔵した加熱体５が図
示しない上下動機構によつ゛Ｃ上下動可能に配設されて
いる。前記ガイドレール３．３及び加熱体５の上方には
ボンディング作業に必要なボンディングＩ
作業窓６ａが形成されたリードフレーム押え板６が図
示しない上下動機構によって上下動可能に設けられてい
る。またリードフレーム押え板６のボンディング作業窓
６ａの上方にはワイヤ（図示せず）が挿通された牛ヤピ
ラリ７が図示しない上下動機構及びＸＹ方向駆動機構に
よ°つて上下動及びＸＹ方向に移動可能に設けられでい
る。以上は従来公知の構成である。A lead frame 1 with a bellet 2 attached to an island portion 1a has guide rails 3.
3 intermittently by the pitch of the pellet 2 by a pitch feeding mechanism (not shown). Said guide rail 3.
A heating element 5 having a built-in cartridge heater 4 is disposed between the heating elements 3 and 3 so as to be movable up and down by a vertical movement mechanism (not shown). Above the guide rail 3.3 and the heating element 5, there is a bonding I necessary for bonding work.
A lead frame holding plate 6 on which a working window 6a is formed is provided so as to be movable up and down by a vertical movement mechanism (not shown). Further, above the bonding work window 6a of the lead frame holding plate 6, a cow tip 7 through which a wire (not shown) is inserted is moved up and down and in the XY direction by a vertical movement mechanism and an XY direction drive mechanism (not shown). It is possible. The above is a conventionally known configuration.
前記加熱体５のリードフレーム当接面には、ベレット２
が取付けられたリードフレーム１のアイランド部分１８
＋こ対応した部分にアイランド部分１ａより大きな面積
を有するマイカレックス、シリコンゴム、フッ素ゴム等
の断熱材１０が埋設されている。この断熱材１０は必要
に応じでベレット２のピッチに合せＣ多数個設けてもよ
いが、本実施例は２個設けた場合を示した。A pellet 2 is provided on the lead frame abutting surface of the heating element 5.
Island portion 18 of lead frame 1 with attached
A heat insulating material 10 such as Micalex, silicone rubber, or fluororubber having a larger area than the island portion 1a is buried in a corresponding portion. If necessary, a large number of heat insulating materials 10 may be provided depending on the pitch of the pellets 2, but this embodiment shows a case where two heat insulating materials are provided.
次に作用に°ついて説明する。リードフレーム１を送る
時は、加熱体５は下降、リードフレーム押え板６は上昇
した状態にある。リードフレーム１が図示しないピッチ
送り機構で１ピッチ送られ、ボンディング部分がボンデ
インク作業窓６ａの真 −下に位置すると、
加熱体５が上昇、リードフレーム押え板６が下降し、リ
ードフレーム１を刀ａ熱体５とリードフレーム押え板６
とで挾持する。次番こキャピラリ７が図示しない上下動
機構及びＸＹ方向駆動機構によつ゛Ｃ動作し、リードフ
レームｌのリード１ｂとベレット２のパッドとにワイヤ
ボンディングを行う。Next, the action will be explained. When feeding the lead frame 1, the heating element 5 is lowered and the lead frame presser plate 6 is raised. When the lead frame 1 is fed one pitch by a pitch feeding mechanism (not shown) and the bonding portion is located directly below the bonding ink working window 6a,
The heating element 5 rises, the lead frame holding plate 6 descends, and the lead frame 1 is held between the heating element 5 and the lead frame holding plate 6.
Hold it with. Next, the capillary 7 is moved by a vertical movement mechanism and an XY direction drive mechanism (not shown), and wire bonding is performed between the lead 1b of the lead frame 1 and the pad of the pellet 2.
ここで、ベレット２が付いているアイランド部分１ａは
断熱材１０によって加熱されないため、リード１ｂ部分
より低温に抑えられる。例えばリードｌｂ側の部分をリ
ード１ｂのボンディングｔこ必要な温度（約２００〜２
３０℃）＃こ加熱しても、アイランド部分１ａ（チップ
２１１１）はそれよりも低い温度（リード１ｂの温度よ
り３０〜６０℃低い温度）に保持させることができる。Here, since the island portion 1a to which the bellet 2 is attached is not heated by the heat insulating material 10, it is kept at a lower temperature than the lead 1b portion. For example, the temperature required for bonding lead 1b (approximately 200 to 200
Even if the island portion 1a (chip 2111) is heated by 30° C., the island portion 1a (chip 2111) can be maintained at a lower temperature (30 to 60° C. lower than the temperature of the lead 1b).
勿論、この温度差は断熱材１０の種類、性能及び設置数
によって変えることができる。またアイランド部分１ａ
とリード１ｂとは同一材でつながっているが、通常のＩ
Ｃ用リードフレニム１は、アイランド部分１ａを支えて
いるリプ部ＩＣはアイランド部分１ａと比較すると極端
な面積の差があり、よほど長時間（３０分以上）リード
フレーム１を加熱体５上に放置しておかない限りリード
１ｂとアイランド部分１ａの温度差が等しくならないの
で、ワイヤボンディング作業においては問題は生じない
。Of course, this temperature difference can vary depending on the type, performance, and number of insulation materials 10 installed. Also, the island part 1a
and lead 1b are connected by the same material, but the normal I
In the C lead frame 1, the lip part IC supporting the island part 1a has an extreme difference in area compared to the island part 1a, so it is difficult to leave the lead frame 1 on the heating element 5 for a very long time (more than 30 minutes). Since the temperature difference between the lead 1b and the island portion 1a will not be equal unless the temperature is maintained, no problem will occur in the wire bonding work.
このように、リードｌｂ側は高温に加熱されるので、リ
ード１ｂとワイヤとのボンデビリテイーは向上する。ま
たペレット２側は低温に保持されるので、ベレット２に
悪影響を及ぼすことがない。In this way, since the lead lb side is heated to a high temperature, the bondability between the lead 1b and the wire is improved. Further, since the pellet 2 side is kept at a low temperature, there is no adverse effect on the pellet 2.
またベレット２は低温でもベレット２のパッドとワイヤ
の先端に形成された金ボールとのボンデビリテイーは良
好であり、何ら問題は生じない。Furthermore, even at low temperatures, the bondability between the pad of the pellet 2 and the gold ball formed at the tip of the wire is good, and no problem occurs.
なお、上記実施例においては、加熱体５のアイランド部
分１ａに対応する部分に断熱材１０を設けたが、ベレッ
ト２の種類によ゛つては必ずしも断熱材である必要はな
く、リード１ｂに対応した部分より熱伝導率の低い部材
であればよい。In the above embodiment, the heat insulating material 10 was provided in the part corresponding to the island part 1a of the heating element 5, but depending on the type of pellet 2, it is not necessarily necessary to provide a heat insulating material, and it is necessary to provide a heat insulating material 10 in the part corresponding to the lead 1b. Any member may be used as long as it has a lower thermal conductivity than the exposed portion.
（発明の効果）
以上の説明から明らかなように、本発明によれば、リー
ドフレームのアイランド部分番こ対応した加熱体の部分
ｌこ他の部分より熱伝導率の低い部材を設けてなるので
、前記リードフレームのアイランド部分に高温ζこ加熱
できないベレットが取付けられていても、ベレットに悪
影響を及ぼすことなく良好なボンディングを行うことが
できる。(Effects of the Invention) As is clear from the above description, according to the present invention, a member having a lower thermal conductivity than other parts is provided, such as the part L of the heating body corresponding to the island part of the lead frame. Even if a pellet that cannot be heated to a high temperature is attached to the island portion of the lead frame, good bonding can be performed without adversely affecting the pellet.
第１図は本発明の一実施例を示す一部断面正面図、第２
図は第１図のＡ−Ａ線断面図、第３図は要部拡大平面図
である。
１・・・リードフレーム、 ｌａ・・・アイランド
部分、１ｂ・・・リード、 ２・・・ベレ
ット、５・・・加熱体、 １０・・・断熱
材。
第１図
第２図
第３図FIG. 1 is a partially sectional front view showing one embodiment of the present invention, and FIG.
The figure is a sectional view taken along the line A--A in FIG. 1, and FIG. 3 is an enlarged plan view of the main part. DESCRIPTION OF SYMBOLS 1...Lead frame, la...Island part, 1b...Lead, 2...Bellet, 5...Heating body, 10...Insulating material. Figure 1 Figure 2 Figure 3
Claims (3)
する加熱体を備えたボンダーにおいて、前記加熱体の前
記リードフレームのアイランド部分に当接する当接面に
他の当接面の部分より熱伝導率の低い部材を設けたこと
を特徴とするボンダー用加熱装置。(1) In a bonder equipped with a heating element that heats the lead frame by contacting the lead frame, the contact surface of the heating member that contacts the island portion of the lead frame has a higher thermal conductivity than the other contact surface portions. A heating device for a bonder, characterized in that a member with a low temperature is provided.
ンド部分より大きいことを特徴とする特許請求の範囲第
１項記載のボンダー用加熱装置。(2) The heating device for a bonder according to claim 1, wherein the member having low thermal conductivity is larger than the island portion of the lead frame.
とする特許請求の範囲第１項記載のボンダー用加熱装置
。(3) The heating device for a bonder according to claim 1, wherein the member having low thermal conductivity is a heat insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59130705A JPS618937A (en) | 1984-06-25 | 1984-06-25 | Heating device for bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59130705A JPS618937A (en) | 1984-06-25 | 1984-06-25 | Heating device for bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS618937A true JPS618937A (en) | 1986-01-16 |
Family
ID=15040648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59130705A Pending JPS618937A (en) | 1984-06-25 | 1984-06-25 | Heating device for bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS618937A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014188768A1 (en) * | 2013-05-23 | 2014-11-27 | 株式会社新川 | Electronic component mounting device and method for producing electronic component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645040A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Wire bonding apparatus |
-
1984
- 1984-06-25 JP JP59130705A patent/JPS618937A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645040A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Wire bonding apparatus |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014188768A1 (en) * | 2013-05-23 | 2014-11-27 | 株式会社新川 | Electronic component mounting device and method for producing electronic component |
| KR20150042842A (en) * | 2013-05-23 | 2015-04-21 | 가부시키가이샤 신가와 | Electronic component mounting device and method for producing electronic component |
| CN104871300A (en) * | 2013-05-23 | 2015-08-26 | 株式会社新川 | Electronic component mounting device and method for producing electronic component |
| TWI514489B (en) * | 2013-05-23 | 2015-12-21 | Shinkawa Kk | Electronic part mounting apparatus and manufacturing method of electronic parts |
| JPWO2014188768A1 (en) * | 2013-05-23 | 2017-02-23 | 株式会社新川 | Electronic component mounting apparatus and method of manufacturing electronic component |
| CN104871300B (en) * | 2013-05-23 | 2017-11-21 | 株式会社新川 | The manufacture method of electronic component mounting equipment and electronic component |
| US9968020B2 (en) | 2013-05-23 | 2018-05-08 | Shinkawa Ltd. | Electronic-component mounting apparatus |
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