JPS618930A - 半導体ウエーハの標準化処理方法 - Google Patents
半導体ウエーハの標準化処理方法Info
- Publication number
- JPS618930A JPS618930A JP4501985A JP4501985A JPS618930A JP S618930 A JPS618930 A JP S618930A JP 4501985 A JP4501985 A JP 4501985A JP 4501985 A JP4501985 A JP 4501985A JP S618930 A JPS618930 A JP S618930A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- wafer
- clusters
- oxygen
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 41
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 235000012431 wafers Nutrition 0.000 claims description 107
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000009833 condensation Methods 0.000 claims description 18
- 230000005494 condensation Effects 0.000 claims description 18
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000015271 coagulation Effects 0.000 claims description 3
- 238000005345 coagulation Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 47
- 229910052760 oxygen Inorganic materials 0.000 description 47
- 239000001301 oxygen Substances 0.000 description 47
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 101100137826 Streptococcus pneumoniae (strain ATCC BAA-255 / R6) prsA gene Proteins 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 238000009826 distribution Methods 0.000 description 10
- 230000006911 nucleation Effects 0.000 description 8
- 238000010899 nucleation Methods 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005247 gettering Methods 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000007669 thermal treatment Methods 0.000 description 4
- 238000004566 IR spectroscopy Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 206010027476 Metastases Diseases 0.000 description 1
- 241001372564 Piona Species 0.000 description 1
- 238000004854 X-ray topography Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000572 ellipsometry Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4501985A JPS618930A (ja) | 1984-06-20 | 1985-03-08 | 半導体ウエーハの標準化処理方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP84430020.2 | 1984-06-20 | ||
JP4501985A JPS618930A (ja) | 1984-06-20 | 1985-03-08 | 半導体ウエーハの標準化処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS618930A true JPS618930A (ja) | 1986-01-16 |
JPH0527974B2 JPH0527974B2 (enrdf_load_stackoverflow) | 1993-04-22 |
Family
ID=12707630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4501985A Granted JPS618930A (ja) | 1984-06-20 | 1985-03-08 | 半導体ウエーハの標準化処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS618930A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992005578A1 (en) * | 1990-09-14 | 1992-04-02 | Komatsu Electronic Metals Co., Ltd. | Semiconductor device manufacturing process |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57167637A (en) * | 1981-03-11 | 1982-10-15 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1985
- 1985-03-08 JP JP4501985A patent/JPS618930A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57167637A (en) * | 1981-03-11 | 1982-10-15 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992005578A1 (en) * | 1990-09-14 | 1992-04-02 | Komatsu Electronic Metals Co., Ltd. | Semiconductor device manufacturing process |
US5506154A (en) * | 1990-09-14 | 1996-04-09 | Komatsu Electronic Metals Co., Ltd. | Process for preheat treatment of semiconductor wafers |
Also Published As
Publication number | Publication date |
---|---|
JPH0527974B2 (enrdf_load_stackoverflow) | 1993-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4637123A (en) | Method of standardizing and stabilizing semiconductor wafers | |
CN100466200C (zh) | 减少硅晶片中的金属杂质的方法 | |
US20020189640A1 (en) | Sc-2 based pre-thermal treatment wafer cleaning process | |
JP2735772B2 (ja) | シリコンにおける汚染物除去および少数担体寿命の改良 | |
US5418172A (en) | Method for detecting sources of contamination in silicon using a contamination monitor wafer | |
JP6821809B2 (ja) | 単結晶シリコンから構成される半導体ウェハおよび単結晶シリコンから構成される半導体ウェハの製造方法 | |
CN112585734A (zh) | 用于评估晶片的有缺陷区域的方法 | |
JP2680482B2 (ja) | 半導体基板、半導体基板と半導体装置の製造方法、並びに半導体基板の検査・評価方法 | |
JP2936916B2 (ja) | シリコン単結晶の品質評価方法 | |
JPH05291097A (ja) | シリコン基板およびその製造方法 | |
JPS618930A (ja) | 半導体ウエーハの標準化処理方法 | |
JP3080501B2 (ja) | シリコンウェーハの製造方法 | |
KR100384680B1 (ko) | 반도체 웨이퍼 결함 검출 방법 | |
JP3933010B2 (ja) | シリコン単結晶インゴットの点欠陥分布を測定する方法 | |
US4954189A (en) | Silicon wafers for producing oxide layers of high breakdown strength and process for the production thereof | |
JP2002334886A (ja) | シリコンウェーハの酸素析出物密度の評価方法及びその評価方法に基づいて製造されたシリコンウェーハ | |
JP2004031845A (ja) | ゲッタリング能力の評価方法 | |
JPH1154579A (ja) | 半導体基板の評価方法 | |
JP2004020341A (ja) | シリコン単結晶インゴットの点欠陥分布を測定する方法 | |
US6013556A (en) | Method of integrated circuit fabrication | |
JP3238957B2 (ja) | シリコンウェーハ | |
JPH05326535A (ja) | シリコンウエーハの処理方法 | |
Iwasaki et al. | Influence of Cooling Condition during Crystal Growth of CZ‐Si on Oxide Breakdown Property | |
JPH0469422B2 (enrdf_load_stackoverflow) | ||
JP2025075668A (ja) | 金属汚染評価方法 |