JPS6187658U - - Google Patents
Info
- Publication number
- JPS6187658U JPS6187658U JP1984172365U JP17236584U JPS6187658U JP S6187658 U JPS6187658 U JP S6187658U JP 1984172365 U JP1984172365 U JP 1984172365U JP 17236584 U JP17236584 U JP 17236584U JP S6187658 U JPS6187658 U JP S6187658U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- tank
- solder
- port
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984172365U JPH0216858Y2 (US20110009641A1-20110113-C00116.png) | 1984-11-15 | 1984-11-15 | |
| KR2019850012303U KR910000567Y1 (ko) | 1984-11-15 | 1985-09-24 | 분출식 납땜탱크 |
| CN85108144A CN1003006B (zh) | 1984-11-15 | 1985-11-05 | 喷射式焊锡槽 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984172365U JPH0216858Y2 (US20110009641A1-20110113-C00116.png) | 1984-11-15 | 1984-11-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6187658U true JPS6187658U (US20110009641A1-20110113-C00116.png) | 1986-06-07 |
| JPH0216858Y2 JPH0216858Y2 (US20110009641A1-20110113-C00116.png) | 1990-05-10 |
Family
ID=15940551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984172365U Expired JPH0216858Y2 (US20110009641A1-20110113-C00116.png) | 1984-11-15 | 1984-11-15 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH0216858Y2 (US20110009641A1-20110113-C00116.png) |
| KR (1) | KR910000567Y1 (US20110009641A1-20110113-C00116.png) |
| CN (1) | CN1003006B (US20110009641A1-20110113-C00116.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267787A (ja) * | 1988-09-02 | 1990-03-07 | Kenji Kondo | プリント基板のはんだ付け方法およびその装置 |
| JPH0284264A (ja) * | 1988-09-20 | 1990-03-26 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
| JP2012019190A (ja) * | 2010-07-07 | 2012-01-26 | Samsung Electro-Mechanics Co Ltd | ハンダ付け噴射ノズル及びこれを含むハンダ付けマシン |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100425382C (zh) * | 2005-06-17 | 2008-10-15 | 杨国金 | 喷射流焊接方法及其装置 |
| CN102695372A (zh) * | 2011-03-24 | 2012-09-26 | 代芳 | 一种喷液态金属焊料微颗粒的喷锡技术 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858795A (ja) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | プリント基板のはんだ付け方法 |
| JPS59110458A (ja) * | 1982-12-17 | 1984-06-26 | Kondo Kenji | はんだ槽 |
-
1984
- 1984-11-15 JP JP1984172365U patent/JPH0216858Y2/ja not_active Expired
-
1985
- 1985-09-24 KR KR2019850012303U patent/KR910000567Y1/ko not_active IP Right Cessation
- 1985-11-05 CN CN85108144A patent/CN1003006B/zh not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858795A (ja) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | プリント基板のはんだ付け方法 |
| JPS59110458A (ja) * | 1982-12-17 | 1984-06-26 | Kondo Kenji | はんだ槽 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267787A (ja) * | 1988-09-02 | 1990-03-07 | Kenji Kondo | プリント基板のはんだ付け方法およびその装置 |
| JPH0284264A (ja) * | 1988-09-20 | 1990-03-26 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
| JP2012019190A (ja) * | 2010-07-07 | 2012-01-26 | Samsung Electro-Mechanics Co Ltd | ハンダ付け噴射ノズル及びこれを含むハンダ付けマシン |
Also Published As
| Publication number | Publication date |
|---|---|
| CN85108144A (zh) | 1986-05-10 |
| KR910000567Y1 (ko) | 1991-01-31 |
| KR860006636U (ko) | 1986-06-25 |
| JPH0216858Y2 (US20110009641A1-20110113-C00116.png) | 1990-05-10 |
| CN1003006B (zh) | 1989-01-04 |
