JPS6187351A - Handler for carrying wafer - Google Patents

Handler for carrying wafer

Info

Publication number
JPS6187351A
JPS6187351A JP19414184A JP19414184A JPS6187351A JP S6187351 A JPS6187351 A JP S6187351A JP 19414184 A JP19414184 A JP 19414184A JP 19414184 A JP19414184 A JP 19414184A JP S6187351 A JPS6187351 A JP S6187351A
Authority
JP
Japan
Prior art keywords
arms
hand
handler
wafer
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19414184A
Other languages
Japanese (ja)
Inventor
Teruya Sato
光弥 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP19414184A priority Critical patent/JPS6187351A/en
Publication of JPS6187351A publication Critical patent/JPS6187351A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

PURPOSE:To obtain a compact handler, the length of hand arms of which is shortened, by turning a first arm member centering around a connecting point with the revolution of a second arm member, overlapping the first arm member on the second arm member and bringing the first arm member to a movable state in the direction of the side reverse to a previous state. CONSTITUTION:Hand arms 12 are rotated so as to be bent centering around shafts 11 with the revolution of arms 10 using shafts 9 as centers while other ends of the hand arms 12 are also turned similarly to a finger 5 centering around shafts 13 at that time. The hand arms 12 are overlapped on their midways, and paired arms are moved up to positions where paired arms mutually face rectilinearly, and rotated centering around the shafts 11 in the direction separate from a wafer cassette 6. Finally, the hand arms 10 and the hand arms 12 are extended in a straight line in the direction opposite to an original state, and the finger 5 is positioned so as to be overlapped to the upper sections of the hand arms 10 and 12. Accordingly, the length of the hand arm may be one fourth of the predetermined distance of movement of a wafer as compared to conventional handlers, and the extremely compact handler is manufactured.

Description

【発明の詳細な説明】 本発明はウェハ搬送用ハンドラーに関し、特に複数枚の
ウェハを収納するキャリヤからウェハを出し入れする際
に都合良く使用されるウェハ搬送用ハンドラーに関する
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wafer transport handler, and more particularly to a wafer transport handler that is conveniently used when loading and unloading wafers from a carrier that stores a plurality of wafers.

一般にウェハに対して加工又は測定をおこなう装置本体
にはウェハを複数枚収納可能なキャリヤが設置されてい
る6ウエハはキャリヤから装置本体に供給され、ここで
加工又は測定を終了した後再びキャリヤに収納され、キ
ャリヤごと次の工程にまわされる。
Generally, the main body of the equipment that processes or measures wafers is equipped with a carrier that can store multiple wafers.6 The wafers are fed from the carrier to the main body of the equipment, and after processing or measurement is completed here, they are returned to the carrier. It is stored and sent along with the carrier to the next process.

従来キャリヤからウェハを搬出又は搬入するためにベル
トコンベア式の搬送装置およびハンド式の搬送装置が利
用されている。第1図は今までに知られているパンタグ
ラフ式のハンドラーを概略的に示した図である。このハ
ンドラーは、一端に設けられた輔3を中心として回動自
在なハンドアーム1と、ハンドアーム1の他端に軸4を
介して同じく回動自在に一端を連結されたハンドアーム
2と、ハンドアーム2の他端に同じく枢動自在にJ!&
!結されたウェハー支持用フィンガー5とから構成され
ている。なおハンドラーは、ハンドアームlおよびハン
ドアーム2をそれぞれ対をなすように2本ずつ有してい
る。
Conventionally, belt conveyor-type conveyance devices and hand-type conveyance devices have been used to carry wafers in and out of carriers. FIG. 1 is a diagram schematically showing a known pantograph handler. This handler includes a hand arm 1 which is rotatable around a support 3 provided at one end, a hand arm 2 whose one end is also rotatably connected to the other end of the hand arm 1 via a shaft 4, At the other end of hand arm 2, there is a J! &
! The wafer supporting fingers 5 are connected to each other. Note that the handler has two hand arms 1 and two hand arms 2, each in pairs.

第1図は、ハンドアーム1およびハンドアーム2を一直
線状に延ばし、ウェハーカセット6内に収納されたウェ
ハ7の裏側にフィンガー5を位置させた状態で示したも
のである。これに対し第2図は軸3の位置を固定点とし
て軸3に向ってフィンガー5を引込め、ウェハーカセッ
ト6からウェハー7を取り出した状態で示した図である
。ここでハンドアーム2は、軸3を中心としたアーム1
の回転に従って軸4を中心として折れ曲がるように回転
し、一方このときハンドアーム2の他端も同じく軸8を
中心としてフィンガー5に対して回転する。最終的にハ
ンドアームlとハンドアーム2とが重なり合い、対をな
すアーム同士が直線状に向かい合うような位置まで移動
する。
FIG. 1 shows a state in which the hand arm 1 and the hand arm 2 are extended in a straight line, and the finger 5 is positioned on the back side of a wafer 7 housed in a wafer cassette 6. On the other hand, FIG. 2 shows a state in which the finger 5 is retracted toward the shaft 3 with the position of the shaft 3 as a fixed point, and the wafer 7 is taken out from the wafer cassette 6. Here, hand arm 2 is arm 1 centered on axis 3.
According to the rotation of the hand arm 2, the hand arm 2 rotates so as to be bent about the axis 4, and at this time, the other end of the hand arm 2 also rotates about the axis 8 with respect to the finger 5. Eventually, hand arm 1 and hand arm 2 overlap and move to a position where the paired arms face each other in a straight line.

上述したハンドラーの構成に依れば、ハンドアームはウ
ェハーの所定の移動距離の半分の長さを有する必要があ
る。更にキャリヤから取り出したウェハを装置本体へ送
り込む等の理由によりウェハを回転させる場合、ハンド
アーム1とハンドアーム2とが重なり合い、対をなすア
ーム同士が直線状に向かい合った状態で回転し、フィン
ガー面上に載置されたウェハの位置を変える必要がある
。このためハンドラーの作動に必要とされる占有面積が
広くなってしまう。
According to the handler configuration described above, the hand arm needs to have a length that is half the predetermined travel distance of the wafer. Furthermore, when the wafer is rotated for reasons such as feeding the wafer taken out from the carrier to the main body of the apparatus, hand arm 1 and hand arm 2 overlap, and the paired arms rotate in a state facing each other in a straight line. It is necessary to change the position of the wafer placed on top. This increases the area required for the operation of the handler.

これに加えて従来のハンドラーにおいてはハンドアーム
lおよびハンドアーム2がフィンガーに対して同じ角度
で傾斜するような機構をす11えていなければならない
In addition, the conventional handler must have a mechanism 11 that allows the hand arm 1 and the hand arm 2 to tilt at the same angle with respect to the fingers.

それ数本発明の目的は、ハンドアームの長さを短くした
コンパクトなハンドラーを提供することにある。
An object of the present invention is to provide a compact handler with a shortened hand arm length.

更に本発明の他の目的は、ハンドアームの折れ曲がり形
式を工夫することによってハンドラーの回転等の作動に
必要とされる占有面積を極めて減少させることができる
ハンドラーを提供することにある。
Still another object of the present invention is to provide a handler in which the area required for operations such as rotation of the handler can be significantly reduced by devising the bending type of the hand arm.

次に第3図を参照して本発明の好ましい実施例について
説明する。本発明のハンドラーは、 −b:ijに設け
られた軸9を中心として回動自在なハンドアームlOと
、ハンドアーム10の他端に軸11を介して同じく回動
自在に一端を連結された/\ンドアーム12と、ハンド
アーム12の他端に同じ〈枢動自在に連結されたウェハ
ー支持用フィンガー5とから構成されている。なお/\
ンドラーは、ハンドアーム10およびハンドアーム12
をそれぞれ対をなすように2本ずつ有している。
A preferred embodiment of the invention will now be described with reference to FIG. The handler of the present invention includes a hand arm lO which is rotatable about a shaft 9 provided at -b:ij, and one end of which is rotatably connected to the other end of the hand arm 10 via a shaft 11. The hand arm 12 is composed of a hand arm 12 and a wafer supporting finger 5 pivotally connected to the other end of the hand arm 12. In addition/\
The handler has a hand arm 10 and a hand arm 12.
Each has two pairs of them.

第3図は、ハンドアーム10およびハンドアーム12を
一直線状に延ばし、ウェハーカセット6内に収容された
ウェハ7の裏側にフィンガー5を位置させた状態で示し
たものである。これに対し第4図は軸9の位置を固定点
として軸9に向かってフィンガー5を引込め、ウェハー
カセット6からウェハー7を取り出した状態で示した図
である。ここでハンドアーム12は、軸9を中心とした
アーム10の回転に従って軸11を中心として折れ曲が
るように回転し、一方このときノ\ンドアーム12の他
端も同じく軸13を中心としてフィンガー5に対して回
転する。途中アームlOとアーム12とが重なり合い、
対をなすアーム同士が直線状に向かい合うような位置(
第2図参照)才で移動する。
FIG. 3 shows a state in which the hand arm 10 and the hand arm 12 are extended in a straight line, and the fingers 5 are positioned on the back side of the wafer 7 housed in the wafer cassette 6. On the other hand, FIG. 4 shows a state in which the finger 5 is retracted toward the shaft 9 with the position of the shaft 9 as a fixed point, and the wafer 7 is taken out from the wafer cassette 6. Here, the hand arm 12 rotates so as to bend around the shaft 11 in accordance with the rotation of the arm 10 around the shaft 9, and at this time, the other end of the hand arm 12 also rotates around the shaft 13 with respect to the finger 5. and rotate. In the middle, arm lO and arm 12 overlap,
A position where the paired arms face each other in a straight line (
(See Figure 2) Move with ease.

本発明のハン・ドラ−においては、ハンドアーム12は
第2図に示されるような位置からウェハカセット6と1
憧れる方向へ軸11を中心として回動する。最終的にハ
ンドアーム10とハンドアーム・ 12は第3図の状態
と逆の方向に一直線状に延び、フィンガー5はハンドア
ーム10および12の上方に重なり合うように位置する
。従って本発明のハンドラーの場合、第1図に示された
従来のハンドラーと比べてハンドアームの長さはウェハ
の所定の移動距離の4分の1で良く極めてコンパクトな
ものとなる。又第4図に示されるようにアームlOおよ
び12はその大部分がフィンカー5面上に載置されたウ
ェハ7の真下に位置するため、ウェハ7を所望の方向に
移動させるためハンドラーを回転させるとき必要とされ
る占有面積は極めて少なくなる。
In the handler of the present invention, the hand arm 12 is moved from the position shown in FIG.
It rotates around the shaft 11 in the desired direction. Finally, hand arm 10 and hand arm 12 extend in a straight line in the opposite direction to the state shown in FIG. 3, and finger 5 is positioned above hand arms 10 and 12 so as to overlap. Therefore, in the case of the handler of the present invention, compared to the conventional handler shown in FIG. 1, the length of the hand arm is only one-fourth of the predetermined travel distance of the wafer, making the handler extremely compact. Furthermore, as shown in FIG. 4, most of the arms 10 and 12 are located directly below the wafer 7 placed on the surface of the fin car 5, so the handler is rotated to move the wafer 7 in a desired direction. The required footprint is then extremely small.

とこで上述したようなハンドアーム10および12の作
動を可能とする機構について第5図を参照して説明する
Now, a mechanism that enables the operation of the hand arms 10 and 12 as described above will be explained with reference to FIG. 5.

IklI9はアーム10と一体的に構成され、軸9の内
部にはプーリー14が組み込まれている。一方軸11は
アーム12と一体であるプーリーから構成され、プーリ
ー14とプーリー11との間にはタイミングベルト15
が掛は渡されている。従ってプーリー14を回転駆動さ
せるとタイミングベルト15を介してプーリー11に駆
動力が伝達されここでフィンガー5を軸9に向かう方向
へ引き寄せる際直線的に移動させるためには、アーム1
0の傾斜角度とアーム10とアーム12とのなる開き角
度とが1:2の関係を常に維持するようにプーリー14
の駆動力を定めなければならない。
The IklI9 is constructed integrally with the arm 10, and a pulley 14 is incorporated inside the shaft 9. On the other hand, the shaft 11 is composed of a pulley that is integrated with the arm 12, and a timing belt 15 is provided between the pulley 14 and the pulley 11.
The stake has been passed. Therefore, when the pulley 14 is rotationally driven, a driving force is transmitted to the pulley 11 via the timing belt 15, and in order to move the finger 5 linearly in the direction toward the shaft 9, the arm 1
The pulley 14 is arranged so that the inclination angle of 0 and the opening angle of the arms 10 and 12 always maintain a 1:2 relationship.
The driving force must be determined.

第6図および第7図はそれぞれ、本発明のウェハハンド
ラーにウェハ位置検知機構を組み込んだ実施例の側面図
および平面図である。前述のとおりカセット6内には複
数枚のウェハ7が収納されているが、フィンガー5を搬
出すべき所望のウェハ7と隣接するウェハ7との間に挿
入するためには、ウェハの位置を正確に検知する必要が
ある。
6 and 7 are a side view and a plan view, respectively, of an embodiment in which a wafer position detection mechanism is incorporated into a wafer handler of the present invention. As mentioned above, a plurality of wafers 7 are stored in the cassette 6, but in order to insert the finger 5 between the desired wafer 7 to be carried out and the adjacent wafer 7, it is necessary to accurately position the wafers. need to be detected.

そこでウェハハンドラーにウェハ位置検知機構を組み込
んで使用するのが奸才しい。このウェハ位置検知機構の
基本的な構成は、レーザー源16と、カセット6の表側
に配置されたミラー18と、レーザー源16から出たレ
ーザー20をミラー18に向けて反射させ、一方ミラー
18によって反射されたレーザーを透過させるハーフミ
ラ−17と、ハーフミラ−17を透過したレーザーを検
出するためのホトセンサ19を有している。フィンガー
5とレーザー光路とのレベルの差による位置補正の必要
をなくすために、フィンガー5とレーザー光路とのレベ
ルを極めて近接させるのが好ましい。レーザーは直進性
がすぐれているため直線形状の物体の位置検知に適して
いるからである。光源としてレーザー以外の例えばLE
D等を用いた場合には光源からの光はある程度の広がり
をもつため、この広がった光で位置を検知したい所望の
ウェハが光路を遮断することを検出することは極めて困
難である。
Therefore, it is ingenious to use a wafer position detection mechanism built into the wafer handler. The basic configuration of this wafer position detection mechanism includes a laser source 16, a mirror 18 placed on the front side of the cassette 6, and a laser 20 emitted from the laser source 16 that is reflected toward the mirror 18. It has a half mirror 17 that transmits the reflected laser and a photosensor 19 that detects the laser that has passed through the half mirror 17. In order to eliminate the need for positional correction due to the difference in level between the finger 5 and the laser optical path, it is preferable to make the levels of the finger 5 and the laser optical path very close to each other. This is because lasers have excellent straightness and are therefore suitable for detecting the position of linear objects. For example, LE other than laser as a light source
When D or the like is used, the light from the light source spreads to some extent, so it is extremely difficult to detect that the desired wafer whose position is to be detected blocks the optical path using this spread light.

これ以外にTVカメラ等でウェハの断面をみる方法も考
えられるが、TVカメラを用いる場合はカメラレンズの
焦点合わせが必要となる。ところかカセ−/ ト内に収
容されたウェハはウェハの出し入れ方向においてかなり
位置のバラツキが大きいため正しい焦点合わせができず
、精富な位置検知には適さない。加うるにTVカメラは
高価で犬きく複雑である。
Another method is to view the cross section of the wafer using a TV camera, but when using a TV camera, the camera lens must be focused. However, the position of the wafers housed in the cassette/cassette varies considerably in the direction in which the wafers are taken in and taken out, making it impossible to achieve correct focusing, making it unsuitable for precise position detection. Additionally, TV cameras are expensive and extremely complex.

要するにレーザーを用いたウェハの位置検知法は、光路
が直線的であるために上下の隣接するウェハによる影響
がないばかりか、焦点合わせも不要であるため収容され
たウェハの出し入れ方向に?P4つだ位置の/久うツキ
による検知精度の低下もない。
In short, the wafer position detection method using a laser not only has a linear optical path, so there is no influence from adjacent wafers above and below, but also does not require focusing, so it can be used in the direction of loading and unloading the stored wafers. There is no decrease in detection accuracy due to long-lasting problems at the P4 position.

ここで参照番号21は、フィンガー5をカセット6から
抜き出すためにハンドアーム10および12を折り曲げ
るためのハンドアーム伸縮用駆動部である。参照番号2
2はフィンガー5面上に載置されたウェハ7の向きを変
えるためにハンドチーを回転させるとき使用されるハン
ドラー回転用モータである。
Here, reference numeral 21 is a hand arm extension/contraction drive section for bending the hand arms 10 and 12 in order to extract the finger 5 from the cassette 6. Reference number 2
Reference numeral 2 denotes a handler rotation motor used when rotating the hand tool to change the direction of the wafer 7 placed on the surface of the finger 5.

更に参照番号23はハンドラー昇降機構であり、カセッ
ト6内に収容された任意の位置のウェハ7を取り出すた
めにフィンガー5の高さを所望のレベルに変えることが
できる。
Furthermore, reference numeral 23 is a handler lifting mechanism, which can change the height of the fingers 5 to a desired level in order to take out the wafer 7 stored in the cassette 6 at any position.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のハンドラーを延ばした状態で示した図、 第2図は第1図のハンドラーを折り曲げた状態で示した
図、 第3図は本発明のハンドラーを延ばした状jBで示した
図、 第4図は第3図のハンドラーを折り曲げた状態で示した
図、 第5図は第3図に示されたハンドラーのアームの駆動機
構を示した図、 第6図および第7図はそれぞれ1本発明のハンドラーに
ウェハ位置検知機構を組み込んだ実施例の側面図および
平面図である。 5−一一フィンガー 9−m−軸 10.12−m−ハンドアーム 11.14−−− プーリー 15−m−タイミングベルト
Fig. 1 shows the conventional handler in an extended state, Fig. 2 shows the handler in Fig. 1 in a folded state, and Fig. 3 shows the handler of the present invention in an extended state. Figure 4 is a diagram showing the handler in Figure 3 in a folded state, Figure 5 is a diagram showing the drive mechanism of the arm of the handler shown in Figure 3, Figures 6 and 7 are 1A and 1B are a side view and a plan view, respectively, of an embodiment in which a wafer position sensing mechanism is incorporated into a handler of the present invention. 5-11 fingers 9-m-axis 10.12-m-hand arm 11.14--pulley 15-m-timing belt

Claims (1)

【特許請求の範囲】[Claims] ウェハを面上に載置させるように構成されたウェハ支持
部材と、前記ウェハ支持部材に枢動可能に連結された対
をなす第1のアーム部材と、前記対をなす第1のアーム
部材に一端を回動自在に連結された対をなす第2のアー
ム部材とを有し、前記第1のアーム部材は、前記第2の
アーム部材の回動に従って前記第2のアーム部材との連
結点を中心として回動し、前記第2のアーム部材と重な
った後、前と反対側の方向へ移動可能であることを特徴
とするウェハ搬送用ハンドラ。
a wafer support member configured to place a wafer on a surface; a pair of first arm members pivotally connected to the wafer support member; and a pair of second arm members rotatably connected at one end, and the first arm member is connected to a connecting point with the second arm member according to the rotation of the second arm member. 1. A wafer transfer handler, wherein the handler rotates about the second arm member, and after overlapping with the second arm member, is movable in a direction opposite to the front.
JP19414184A 1984-09-17 1984-09-17 Handler for carrying wafer Pending JPS6187351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19414184A JPS6187351A (en) 1984-09-17 1984-09-17 Handler for carrying wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19414184A JPS6187351A (en) 1984-09-17 1984-09-17 Handler for carrying wafer

Publications (1)

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JPS6187351A true JPS6187351A (en) 1986-05-02

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049029A (en) * 1987-09-10 1991-09-17 Tokyo Electron Limited Handling apparatus for transferring a semiconductor wafer or LCD
US5178638A (en) * 1990-07-20 1993-01-12 Tokyo Electron Limited Pressure-reduced chamber system having a filter means
US5195866A (en) * 1990-11-29 1993-03-23 Tokyo Electron Limited Conveying apparatus
US5211795A (en) * 1990-11-29 1993-05-18 Tokyo Electron Limited Plasma etching apparatus and transporting device used in the same
US5971701A (en) * 1996-02-09 1999-10-26 Hitachi, Ltd. Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device
CN107887311A (en) * 2016-09-29 2018-04-06 株式会社斯库林集团 Substrate transfer apparatus and board carrying method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049029A (en) * 1987-09-10 1991-09-17 Tokyo Electron Limited Handling apparatus for transferring a semiconductor wafer or LCD
US5178638A (en) * 1990-07-20 1993-01-12 Tokyo Electron Limited Pressure-reduced chamber system having a filter means
US5195866A (en) * 1990-11-29 1993-03-23 Tokyo Electron Limited Conveying apparatus
US5211795A (en) * 1990-11-29 1993-05-18 Tokyo Electron Limited Plasma etching apparatus and transporting device used in the same
US5971701A (en) * 1996-02-09 1999-10-26 Hitachi, Ltd. Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device
US6077027A (en) * 1996-02-09 2000-06-20 Hitachi, Ltd. Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device
CN107887311A (en) * 2016-09-29 2018-04-06 株式会社斯库林集团 Substrate transfer apparatus and board carrying method
CN107887311B (en) * 2016-09-29 2021-07-13 株式会社斯库林集团 Substrate conveying device and substrate conveying method
US11276595B2 (en) 2016-09-29 2022-03-15 SCREEN Holdings Co., Ltd. Substrate transporter and substrate transport method

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