JPS6186948U - - Google Patents
Info
- Publication number
- JPS6186948U JPS6186948U JP1984171692U JP17169284U JPS6186948U JP S6186948 U JPS6186948 U JP S6186948U JP 1984171692 U JP1984171692 U JP 1984171692U JP 17169284 U JP17169284 U JP 17169284U JP S6186948 U JPS6186948 U JP S6186948U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- alloy
- coating layer
- semiconductor
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171692U JPS6186948U (enFirst) | 1984-11-14 | 1984-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171692U JPS6186948U (enFirst) | 1984-11-14 | 1984-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186948U true JPS6186948U (enFirst) | 1986-06-07 |
Family
ID=30729371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984171692U Pending JPS6186948U (enFirst) | 1984-11-14 | 1984-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186948U (enFirst) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59144160A (ja) * | 1983-02-07 | 1984-08-18 | Sumitomo Electric Ind Ltd | プラスチツク封止型ｉｃ |
| JPS59161850A (ja) * | 1983-03-07 | 1984-09-12 | Hitachi Ltd | 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム |
-
1984
- 1984-11-14 JP JP1984171692U patent/JPS6186948U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59144160A (ja) * | 1983-02-07 | 1984-08-18 | Sumitomo Electric Ind Ltd | プラスチツク封止型ｉｃ |
| JPS59161850A (ja) * | 1983-03-07 | 1984-09-12 | Hitachi Ltd | 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム |