JPS6179536U - - Google Patents

Info

Publication number

JPS6179536U

JPS6179536U JP16528584U JP16528584U JPS6179536U JP S6179536 U JPS6179536 U JP S6179536U JP 16528584 U JP16528584 U JP 16528584U JP 16528584 U JP16528584 U JP 16528584U JP S6179536 U JPS6179536 U JP S6179536U

Authority

JP

Japan

Prior art keywords

plating

semiconductor wafer

cylinder

electrode disposed

semiconductor

Prior art date

1984-10-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007747 plating Methods 0.000 claims description 11
• 239000004065 semiconductor Substances 0.000 claims description 9
• 239000007788 liquid Substances 0.000 claims description 2
• 238000004519 manufacturing process Methods 0.000 claims description 2
• 230000002093 peripheral effect Effects 0.000 claims 1
• 230000000630 rising effect Effects 0.000 claims 1
• 235000012431 wafers Nutrition 0.000 description 2
• 238000010586 diagram Methods 0.000 description 1

Cited By (1)