JPS6177680A - Method of bonding ceramic and metal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to an improvement in a method of joining ceramics and metal by brazing, and can be used for manufacturing ceramic products.

(Prior art) Ceramics generally have excellent wear resistance, heat resistance, corrosion resistance, etc., and are often used for mechanical parts, electronic parts, etc.; Disadvantages include being difficult to prepare and being very expensive compared to metals. And the aforementioned molding,
In response to the difficulty of processing, desired parts are obtained by bonding ceramics to parts obtained by molding and processing metals that are easy to mold and process. For this reason, various joining methods exist.

(Problems to be solved) Among the methods for joining ceramics and metal, joining by brazing has the advantage of being easy to work with, but
Since it has the disadvantage that a strong bond cannot be obtained, it has not been put into practical use.Therefore, it has been desired to develop a brazing method that can provide a strong bond.

(Means for Solving Problems) This invention uses hard solder containing Te/v/I/ and applies ultrasonic waves when joining ceramics and metal by brazing. .

(Function) By shaking the tellurium, the molten solder flows along the joint surface and exhibits good wettability, resulting in a strong joint.

(Example) A metal piece 1 made of 5US304 with an outer diameter of 14 fl and a thickness of 5 gItM and a ceramic piece 2 made of silicon carbide (8iC) with an outer diameter of 20 g and a thickness of 10 were ultrasonically cleaned in acetone. Next, BAp-9 silver solder was applied.

After the temperature dropped to room temperature, a tensile test was performed and the result was 291g.
It was confirmed that it had a tensile strength of 7m2. This is B
Although the strength of Ap-9 silver solder is 38.4 kg, which is lower than 4+2, it is practically sufficient for bonding strength between ceramics and metal.

(Other Examples) (1) Phosphorous copper solder BOuP3 (88.26% by weight Cu
.

6.07% by weight P, 5.17% by weight iy, 0.5% by weight
After heating and bath-melting the same metal piece 1 and ceramic piece 2 as in the first example using Te alloy) at 780°C, a tensile test was conducted.
A tensile strength of Q kg 7 kg” was confirmed. In this case, the strength of BOuP phosphor copper solder is 46.1 kq / mH
Although it was lower than z, it is practically sufficient as a bonding strength between ceramic and metal.

(2) Yellow M mouth BOuZn-1 (61.5% by weight C
After heating and melting at 910 ° C., the same metal piece 1 and ceramic piece 2 as in the first example were joined in the same manner as in the first example. , when a tensile test was conducted, 28 kq/Iff”
The tensile strength was confirmed. In this case as well, B Cu Z
Strength of n-1 brass solder 47,5 kq/ynyg
Although it was less than 2, it is practically sufficient for bonding strength between ceramic and metal.

(3) Other examples include nickel solder, gold solder,
A hard solder such as palladium solder can be used.

The ceramic to be bonded is not limited to silicon carbide-based ceramics, but may be oxide-based, carbide-based, or nitride-based ceramics.

The metal to be joined is not limited to sU8304 stainless steel, and may be other stainless steels, other iron-based metals, or non-iron-based metals.

Tellurium contained in hard solder % or 0.7% by weight, but not limited to 0.

If the amount is less than 0.05% by weight, no bonding will occur even if ultrasonic vibration is applied. Moreover, when it becomes 4% by weight or more, Cu.

Since a large amount of Te is formed, the joint becomes brittle and cannot be put to practical use. From these facts, tellurium is 0.0% to 4%
% is desired.

The frequency of the ultrasonic waves to be excited is not limited to 7QkHz, but can range from around 2QkHz to 10kHz, which is often used in ultrasonic welding.
, OKH or so. Alternatively, the temperature can be selected as follows depending on the relationship between the solidus temperature and the liquidus temperature.

That is, for example, with phosphorous copper solder BOuP3 where the solidus temperature and liquidus temperature are far apart, it is possible to bond even at a temperature higher than the solidus temperature of about 640°C and lower than the liquidus temperature of about 805°C; It is preferable to braze at a temperature of 840°C to 840°C.

In addition, silver solder B whose solidus temperature and liquidus temperature are close to each other
In Ay-8, both temperatures are approximately 780°C, and brazing is possible at 780°C to 900°C, which is higher than the liquidus temperature. Furthermore, with brass brazing whose solidus temperature and liquidus temperature are close to each other, brazing can be performed at 905°C to 955°C.

However, when containing 0.5% or more of Chill/I/wo and brazing by applying ultrasonic waves, better bonding can be achieved by setting the temperature to a slightly lower temperature than the above temperature range, as shown below. can get.

Near 0 in case of BCuP3+0.5wt%T e (i')
0℃~810℃B In case of Al-8+0.5wt% Te, near 80℃~830℃BOuZn-1+0-5wt%T
-905°C to 930°C (Effect) In the case of e, the wettability of ceramics and metals is improved, and brazing has the remarkable effect of providing a bond between ceramics and metals that has sufficient strength for practical use. Demonstrated.

[Brief explanation of drawings]

The drawings show an embodiment of the invention, with FIG. 1 being a plan view and FIG. 2 being a side view. In the drawings, 1 is a metal piece, 2 is a ceramic piece, 3 is a hard solder, 4 is an ultrasonic vibrator/heater, 4a is an excitation direction, and 5 is a heater.

Claims (1)

[Claims] A method for joining ceramics and metal, the method comprising melting a tellurium-containing hard solder on the surface of the ceramic and then brazing the metal while uniformly applying ultrasonic waves. joining method.