JPS63186843A - Alloy for metallizing - Google Patents
Alloy for metallizingInfo
- Publication number
- JPS63186843A JPS63186843A JP1663587A JP1663587A JPS63186843A JP S63186843 A JPS63186843 A JP S63186843A JP 1663587 A JP1663587 A JP 1663587A JP 1663587 A JP1663587 A JP 1663587A JP S63186843 A JPS63186843 A JP S63186843A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- metallizing
- ceramics
- bonding
- ultrasonic oscillation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 29
- 239000000956 alloy Substances 0.000 title claims abstract description 29
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000010355 oscillation Effects 0.000 abstract 2
- 229910007570 Zn-Al Inorganic materials 0.000 abstract 1
- 239000000155 melt Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000001465 metallisation Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 3
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（Ａ） 〔産業上の利用分野〕
本発明は、超音波振動によるセラミックスのメタライズ
用の合金に関するものであり、セラミックスとセラミッ
クス、あるいはセラミックスと金属を接合する場合、セ
ラミックスの接合面をメタライジングするが、そのメタ
ライソングに於て、超音波振動により比較的低温で、セ
ラミックス面にメタライソングできるメタライズ用合金
を提供するものである。Detailed Description of the Invention (A) [Field of Industrial Application] The present invention relates to an alloy for metallizing ceramics using ultrasonic vibration. The present invention provides an alloy for metallization that can be metallised onto a ceramic surface at a relatively low temperature by ultrasonic vibration.
（Ｂ） 〔従来の技術〕
従来セラミックスのメタライソング法としては、金属ソ
ルダー法、高融点金属法、耐熱法、等が用いられている
が、何れも高温度で処理され、例えばＭｏ−Ｍｎ法は水
素雰囲気の高温炉でセラミックスの接合面に金属膜を形
成し、これにＮｉメ、、キを施した後、銀ろう付けして
、金属と接合するという、高温のガス雰囲気処理や、繁
雑な操作等を必要とし、接合設備的にも高温炉やガス雰
囲気あるいは真空設備等を必要とし、作業の複雑性やコ
スト高となる等の点に於て、使用範囲も付加価値の高い
製品に限られる等の不都合があった。(B) [Prior Art] Conventionally, the metal solder method, high melting point metal method, heat resistant method, etc. have been used as the metallization method for ceramics, but all of them are processed at high temperatures.For example, the Mo-Mn method is A metal film is formed on the bonding surface of ceramics in a high-temperature furnace in a hydrogen atmosphere, and then a Ni coating is applied to it, followed by silver brazing to join it to the metal. The range of use is limited to high value-added products because of the complexity of the work and high cost, which requires high-temperature furnaces, gas atmospheres, or vacuum equipment for bonding equipment. There were some inconveniences such as getting caught.
（Ｃ） 〔発明が解決しようとする問題点〕本発明は、
従来のメタライソングの複雑困難性の簡易化や、設備の
簡略化、ならびに製造コストの低廉化を計るべく、用途
としては４００°Ｃ程度以下の条件下で使用されるもの
であるが、メタライソングを容易に、設備も簡単な設備
で、しかも比較的大型のセラミックスの複合体の製作を
容易にし、しかも経済的にメタライズできるメタライズ
用合金を開発したものである。(C) [Problems to be solved by the invention] The present invention:
In order to simplify the complexity and difficulty of conventional metal lysongs, simplify equipment, and reduce manufacturing costs, it is intended to be used under conditions of about 400°C or less. In addition, we have developed a metallizing alloy that allows relatively large ceramic composites to be easily produced and economically metallized using simple equipment.
（Ｄ） 〔問題点を解決するための手段〕本発明は、セ
ラミックスとセラミックス、あるいはセラミックスと金
属間を容易高強度に接合できるメタライズ用の合金であ
り、
重量比でＺｎ３０〜９９．５％を含有し、残部がＡｌ及
び不可避的不純物からなることを特徴とする超音波振動
によるセラミックスのメタライズ用合金である。(D) [Means for solving the problem] The present invention is an alloy for metallization that can easily bond ceramics to ceramics or ceramics to metals with high strength, and contains 30 to 99.5% Zn by weight. This is an alloy for metallizing ceramics using ultrasonic vibration, characterized in that the remainder consists of Al and inevitable impurities.
即ち、重量比で３０〜９９．５％のＺｎと残部がｌ及び
不可避的不純物からなる合金で、融点はＡ１の混合比率
により、例えばＺｎｌ Ｏ０％で４１９°Ｃ１重量比で
Ａ［５％の場合３８２℃、Ａｌｌ’ｌＯ％で４３０°Ｃ
，１１５％で４５５℃と幅広い温度選定ができるととも
に、ぬれ性よく作業性も良いメタライズ用の合金である
。That is, it is an alloy consisting of 30 to 99.5% Zn by weight and the balance is 1 and unavoidable impurities, and the melting point depends on the mixing ratio of A1, for example, 419°C at 0% ZnlO, 382°C in case, 430°C in All'lO%
, 115% and 455°C, making it an alloy for metallization that can be selected from a wide range of temperatures and has good wettability and workability.
（Ｅ） 〔作用〕
本発明のメタライズ用合金を使用してメタライジングす
るには、例えば第１図に示すように重量比で９５Ｚｎ−
５Ａｆｆｉからなるメタライズ用合金１の溶融槽に、セ
ラミックス２例えばＡｈＯｓを超音波振動子４に接して
浸漬し、超音波振動子４に１ＫＷ、１８ＫＨｚの超音波
を印加時開６０Ｓｅｃ加振して、メタライズ３を施した
後、そのメタライズ３の溶融状態に於て、第２図に示す
ように、別途に同じ９５Ｚｎ−５ＡＩの溶融槽中で、接
合面にＺ ｎ −Ａ Ｉ！金合金被覆された金属基板５
例えばＣＵの接合面６とを溶融状態に於て無加圧で接合
する。(E) [Function] For metallizing using the metallizing alloy of the present invention, for example, as shown in FIG.
A ceramic 2, for example, AhOs, is immersed in a melting tank of a metallizing alloy 1 made of 5Affi in contact with an ultrasonic vibrator 4, and the ultrasonic vibrator 4 is excited with an ultrasonic wave of 1 KW and 18 KHz for 60 sec when applied. After applying the metallization 3, in the molten state of the metallization 3, as shown in FIG. 2, Z n -A I! Gold alloy coated metal substrate 5
For example, the bonding surface 6 of the CU is bonded in a molten state without pressure.
この外、この金属基板５は第３図に示すようにメタライ
ズ用合金１の溶融温度近く１こ予熱しておき、これに前
記したＡｌ２Ｏ，の溶融状態のメタライズ３を７ラツク
スを併用するなどして載置接合することもできる。In addition, the metal substrate 5 is preheated to near the melting temperature of the metallizing alloy 1, as shown in FIG. It is also possible to place and join.
（Ｅ） 〔発明の効果〕
このようにして接合したセラミックス２例えばＡｌ２Ｏ
，とＣｕ５とのせん断破壊強度は、第・を図に示すよう
に、超音波印加時間を増すとともに接合強度は増加し、
接合温度５００℃の場合、印加時間１０Ｓｅｃのとき４
Ｋｇ／＋ｍ＋２．３０８ｅｃのとき５Ｋｇ／ｍｍ２．６
０Ｓｅｃのとき６Ｋｇ／ｍｍ２弱と、ＣｕとＣｕの金属
間を半田付けした場合の強度以上の接合強度を示した。(E) [Effect of the invention] Ceramics 2 bonded in this way, for example, Al2O
, and Cu5, the bonding strength increases as the ultrasonic application time increases, as shown in the figure.
When the bonding temperature is 500°C and the application time is 10 sec, 4
Kg/+m+2.308ec when 5Kg/mm2.6
At 0 Sec, the bonding strength was a little less than 6 kg/mm2, which was higher than the strength when soldering Cu and Cu metals.
接合温度と接合強度の関係は、第５図に示すように、超
音波印加時開６０Ｓｅｃの場合において、接合温度４０
０°Ｃでは２Ｋｇ／ｍｍ２以上、４５０°Ｃのとき３Ｋ
ｇ／ｍｍ２以上、５００℃のとき５Ｋｇ／＋ｎｍ２以上
のせん断破壊強度を示し、接合温度の上昇とともに接合
強度は増加する。The relationship between bonding temperature and bonding strength is as shown in FIG.
2Kg/mm2 or more at 0°C, 3K at 450°C
g/mm2 or more, and exhibits a shear fracture strength of 5 Kg/+nm2 or more at 500°C, and the bonding strength increases as the bonding temperature rises.
次にメタライズ用合金中のＡ１の混入量と接合強度との
関係は、第６図に示すように、接合温度４５０℃で超音
波印加時間６０３ｅｃの場合に於て、全量Ｚｎのときの
せん断破壊力１．２Ｋｇ／ｌｌＩｎ”からＡ１を増加す
るに従って接合強度も増加し、重量比で１５％のとき接
合強度は最も高＜３．５Ｋｇ／ｍｍ２で、以後ｉの増量
とともに次第に減少し、重量比でＡ１１５％のときは２
Ｋｇ／＋ａｍ２強となっている。Next, as shown in Fig. 6, the relationship between the amount of A1 mixed in the metallizing alloy and the bonding strength is as follows. As A1 increases from a force of 1.2 Kg/llIn'', the bonding strength also increases, and when the weight ratio is 15%, the bonding strength is the highest, <3.5 Kg/mm2, and then gradually decreases as i increases, and the weight ratio increases. and when A115% is 2
It is a little over Kg/+am2.
以上のように、本発明のメタライズ用合金は、比較的低
温で超音波振動により、セラミックスにメタライズでき
る合金であり、その合金比率をかえることにより、所要
の接合強度や融点のメタライズ用合金を得ることができ
るとともに、機械的強度や耐熱温度面からも耐摩耗部材
の接合用として、充分使用できるものである。As described above, the metallizing alloy of the present invention is an alloy that can be metallized into ceramics by ultrasonic vibration at relatively low temperatures, and by changing the alloy ratio, a metallizing alloy with the desired bonding strength and melting point can be obtained. In addition, it can be used satisfactorily for joining wear-resistant members in terms of mechanical strength and temperature resistance.
例えば摩耗の激しいホッパー等の内壁面に、本発明のメ
タライズ用合金により超音波接合した複合材を取り付け
て使用する場合は、使用中の鉱石等の衝撃や摩擦により
、メタライズ接合部が剥離することなく、セラミックス
が摩耗するまで、長期間の使用に良く耐えるものである
。For example, when a composite material ultrasonically bonded using the metallizing alloy of the present invention is attached to the inner wall surface of a hopper, etc., which is subject to severe wear, the metallized joint may peel off due to the impact or friction of the ore during use. It can withstand long-term use well until the ceramic wears out.
また、超音波により比較的低温でメタライズできるため
、メタライズ用の高温炉やガス雰囲気炉等を必要とせず
、設備も簡易なものでよく、経済的であるとともに、低
温でメタライズできるため、セラミックスと金属間の熱
膨張差によるセラミックスの熱応力割れを生じ難い等、
多くの優れた特徴を有するものである。In addition, since metallization can be performed at a relatively low temperature using ultrasonic waves, there is no need for a high-temperature furnace or gas atmosphere furnace for metallization, and the equipment can be simple, making it economical. Less likely to cause thermal stress cracking in ceramics due to thermal expansion differences between metals, etc.
It has many excellent features.
第１図、第２図、第３図は本発明のメタライズ用合金の
説明用例示図、第４図は本発明のメタライズ用合金１こ
よる超音波振動接合における超音波印加時間と接合強度
の関係説明図、第５図は同じく接合温度と接合強度の関
係説明図、第６図は同じくメタライズ用合金に混入され
たＡ、 Ｎ量と接合強度の関係説明図。
１はメタライズ用合金、２はセラミックス、３はセラミ
ックス２のメタライズ層、４は超音波振動子、５は金属
基板、６は金属基板５の接合面。Figures 1, 2, and 3 are explanatory illustrations of the metallizing alloy of the present invention, and Figure 4 shows the relationship between ultrasonic application time and bonding strength in ultrasonic vibration bonding using the metallizing alloy 1 of the present invention. FIG. 5 is a diagram explaining the relationship between bonding temperature and bonding strength, and FIG. 6 is a diagram explaining the relationship between the amount of A and N mixed in the metallizing alloy and bonding strength. 1 is an alloy for metallization, 2 is a ceramic, 3 is a metallized layer of the ceramic 2, 4 is an ultrasonic vibrator, 5 is a metal substrate, and 6 is a joint surface of the metal substrate 5.
Claims (1)
び不可避的不純物からなることを特徴とする超音波振動
によるセラミックスのメタライズ用合金。An alloy for metallizing ceramics using ultrasonic vibration, characterized by containing 30 to 99.5% Zn by weight, and the remainder consisting of Al and inevitable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1663587A JPS63186843A (en) | 1987-01-27 | 1987-01-27 | Alloy for metallizing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1663587A JPS63186843A (en) | 1987-01-27 | 1987-01-27 | Alloy for metallizing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63186843A true JPS63186843A (en) | 1988-08-02 |
Family
ID=11921818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1663587A Pending JPS63186843A (en) | 1987-01-27 | 1987-01-27 | Alloy for metallizing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63186843A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8795445B2 (en) | 2008-03-25 | 2014-08-05 | Nippon Steel & Sumitomo Metal Corporation | Titanium plate and method of producing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145751A (en) * | 1983-02-07 | 1984-08-21 | Ikuo Okamoto | Alloy for metallizing ceramic |
-
1987
- 1987-01-27 JP JP1663587A patent/JPS63186843A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145751A (en) * | 1983-02-07 | 1984-08-21 | Ikuo Okamoto | Alloy for metallizing ceramic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8795445B2 (en) | 2008-03-25 | 2014-08-05 | Nippon Steel & Sumitomo Metal Corporation | Titanium plate and method of producing the same |
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