JPS6176977U - - Google Patents
Info
- Publication number
- JPS6176977U JPS6176977U JP16156084U JP16156084U JPS6176977U JP S6176977 U JPS6176977 U JP S6176977U JP 16156084 U JP16156084 U JP 16156084U JP 16156084 U JP16156084 U JP 16156084U JP S6176977 U JPS6176977 U JP S6176977U
- Authority
- JP
- Japan
- Prior art keywords
- element part
- light emitting
- light receiving
- receiving element
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 4
Description
第１図Ａ，Ｂは本考案の一実施例になる透過光
型光結合半導体装置を示す説明図、第２図Ａは従
来の透過光型光結合半導体装置を示す正面図であ
り、同図Ｂはその側面図、また同図Ｃはその平面
図、第３図は第２図Ａ〜Ｃの従来の透過光型光結
合半導体装置の一使用例を示す説明図、第４図Ａ
，Ｂは本考案の他の実施例になる透過光型光結合
半導体装置を示す説明図、第５図は本考案の更に
別の実施例を示す説明図である。
２１……発光素子部、２２……受光素子部、２
１′，２２′……連結部、２３，２４……リード
、２５，２５′，２５″……連結部材、２６……
ネジ孔。
1A and 1B are explanatory diagrams showing a transmitted light type optically coupled semiconductor device according to an embodiment of the present invention, and FIG. 2A is a front view showing a conventional transmitted light type optically coupled semiconductor device. B is a side view thereof, C is a plan view thereof, FIG. 3 is an explanatory diagram showing an example of use of the conventional transmitted light type optically coupled semiconductor device of FIGS. 2A to C, and FIG. 4A
, B are explanatory diagrams showing a transmitted light type optically coupled semiconductor device according to another embodiment of the present invention, and FIG. 5 is an explanatory diagram showing still another embodiment of the present invention. 21... Light emitting element section, 22... Light receiving element section, 2
1', 22'... Connection portion, 23, 24... Lead, 25, 25', 25''... Connection member, 26...
screw hole.
Claims (1)
子部と、ホルダー中に半導体受光素子を封止した
受光素子部と、該受光素子部および前記発光素子
部とを連結するジヨイント部材とを具備し、この
ジヨイント部材により前記両素子部間距離を変化
するようにしたことを特徴とする透過光型光結合
半導体装置。 comprising a light emitting element part in which a light emitting semiconductor element is sealed in a holder, a light receiving element part in which a semiconductor light receiving element is sealed in a holder, and a joint member connecting the light receiving element part and the light emitting element part; A transmitted light type optically coupled semiconductor device, characterized in that the distance between the two element parts is changed by the joint member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156084U JPS6176977U (en) | 1984-10-25 | 1984-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156084U JPS6176977U (en) | 1984-10-25 | 1984-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6176977U true JPS6176977U (en) | 1986-05-23 |
Family
ID=30719464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16156084U Pending JPS6176977U (en) | 1984-10-25 | 1984-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176977U (en) |
-
1984
- 1984-10-25 JP JP16156084U patent/JPS6176977U/ja active Pending