JPS6176965U - - Google Patents
Info
- Publication number
- JPS6176965U JPS6176965U JP16156484U JP16156484U JPS6176965U JP S6176965 U JPS6176965 U JP S6176965U JP 16156484 U JP16156484 U JP 16156484U JP 16156484 U JP16156484 U JP 16156484U JP S6176965 U JPS6176965 U JP S6176965U
- Authority
- JP
- Japan
- Prior art keywords
- cooling plate
- cooling
- cooling device
- refrigerant
- circulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156484U JPH0311894Y2 (fi) | 1984-10-25 | 1984-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156484U JPH0311894Y2 (fi) | 1984-10-25 | 1984-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6176965U true JPS6176965U (fi) | 1986-05-23 |
| JPH0311894Y2 JPH0311894Y2 (fi) | 1991-03-20 |
Family
ID=30719468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16156484U Expired JPH0311894Y2 (fi) | 1984-10-25 | 1984-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311894Y2 (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344748A (ja) * | 1986-08-11 | 1988-02-25 | Fujitsu Ltd | 半導体素子の冷却構造 |
-
1984
- 1984-10-25 JP JP16156484U patent/JPH0311894Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344748A (ja) * | 1986-08-11 | 1988-02-25 | Fujitsu Ltd | 半導体素子の冷却構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311894Y2 (fi) | 1991-03-20 |