JPH0247055U - - Google Patents
Info
- Publication number
- JPH0247055U JPH0247055U JP12641988U JP12641988U JPH0247055U JP H0247055 U JPH0247055 U JP H0247055U JP 12641988 U JP12641988 U JP 12641988U JP 12641988 U JP12641988 U JP 12641988U JP H0247055 U JPH0247055 U JP H0247055U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor device
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12641988U JPH0247055U (fi) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12641988U JPH0247055U (fi) | 1988-09-27 | 1988-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0247055U true JPH0247055U (fi) | 1990-03-30 |
Family
ID=31377926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12641988U Pending JPH0247055U (fi) | 1988-09-27 | 1988-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0247055U (fi) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273860A (ja) * | 2006-03-31 | 2007-10-18 | Icom Inc | 半導体素子固定用クリップ |
-
1988
- 1988-09-27 JP JP12641988U patent/JPH0247055U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273860A (ja) * | 2006-03-31 | 2007-10-18 | Icom Inc | 半導体素子固定用クリップ |