JPS6170993U - - Google Patents
Info
- Publication number
- JPS6170993U JPS6170993U JP15557184U JP15557184U JPS6170993U JP S6170993 U JPS6170993 U JP S6170993U JP 15557184 U JP15557184 U JP 15557184U JP 15557184 U JP15557184 U JP 15557184U JP S6170993 U JPS6170993 U JP S6170993U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- electronic device
- printed circuit
- hole
- transfer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案による電子機器を示す図、第
２図は第１図の上面図、第３図は第１図の断面図
、第４図は従来の電子機器のカバーを取り外した
状態の上面図、第５図は第４図の側面図である。
図において、１は電子機器の箱体、２はカバー
、３は吸気孔、４は排気孔、５はブロワ、６はエ
アフイルタ、７はリテーナ、８はプリント基板、
９はクツシヨン材、１０は放熱体、１１はダクト
、１２は伝熱材である。尚、図中同一あるいは相
当部分には同一符号を付して示してある。
Fig. 1 is a diagram showing an electronic device according to this invention, Fig. 2 is a top view of Fig. 1, Fig. 3 is a sectional view of Fig. 1, and Fig. 4 shows a conventional electronic device with the cover removed. The top view, FIG. 5, is a side view of FIG. In the figure, 1 is a box of electronic equipment, 2 is a cover, 3 is an intake hole, 4 is an exhaust hole, 5 is a blower, 6 is an air filter, 7 is a retainer, 8 is a printed circuit board,
9 is a cushion material, 10 is a heat sink, 11 is a duct, and 12 is a heat transfer material. In the drawings, the same or corresponding parts are designated by the same reference numerals.
Claims (1)
ト基板と、そのプリント基板が複数枚装着されて
いる電子機器箱体と、この電子機器の上部を覆う
ように取り付けられ、かつ吸気孔と排気孔を有す
るカバーと、上記カバーの内面に位置し、その頂
部が上記プリント基板上の伝熱材に当接する波形
の放熱体と、この放熱体と上記カバーとの隙間で
形成されるダクト内に設けられたブロワとを備え
て構成したことを特徴とする電子機器。 A printed circuit board on which circuit components are mounted via a heat transfer material, an electronic device box to which multiple printed circuit boards are attached, and an air intake hole and an exhaust hole that are attached to cover the top of the electronic device. A cover having a hole, a corrugated heat radiator located on the inner surface of the cover, the top of which abuts the heat transfer material on the printed circuit board, and a duct formed in the gap between the heat radiator and the cover. An electronic device characterized in that it is configured to include a blower provided therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15557184U JPS6170993U (en) | 1984-10-15 | 1984-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15557184U JPS6170993U (en) | 1984-10-15 | 1984-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6170993U true JPS6170993U (en) | 1986-05-15 |
Family
ID=30713589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15557184U Pending JPS6170993U (en) | 1984-10-15 | 1984-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6170993U (en) |
-
1984
- 1984-10-15 JP JP15557184U patent/JPS6170993U/ja active Pending