JPS6170942U - - Google Patents
Info
- Publication number
- JPS6170942U JPS6170942U JP15547684U JP15547684U JPS6170942U JP S6170942 U JPS6170942 U JP S6170942U JP 15547684 U JP15547684 U JP 15547684U JP 15547684 U JP15547684 U JP 15547684U JP S6170942 U JPS6170942 U JP S6170942U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- socket
- lead
- protrusion
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案のソケツトのＩＣ実装側断面図
、第２図は本考案のソケツトの部分拡大図で第２
図ａは通常の使用状態での突起部の状態を示し、
第２図ｂはチエツク治具使用時の突起部の状態を
示す図、第３図は従来のソケツトの側断面図、第
４図ａ〜ｃは従来のＩＣソケツトのＩＣ実装側断
面図である。
なお図において、１…絶縁性基体、２〜４…接
触子、２ａ〜４ａ…接触片部、２ｂ〜４ｂ…外部
接続端子部、５…試料、６…突起部、７…チエツ
ク治具である。
Figure 1 is a sectional view of the IC mounting side of the socket of the present invention, and Figure 2 is a partially enlarged view of the socket of the present invention.
Figure a shows the state of the protrusion in normal use,
Fig. 2b is a diagram showing the state of the protrusion when a check jig is used, Fig. 3 is a side sectional view of a conventional socket, and Figs. 4 a to c are sectional views of the IC mounting side of a conventional IC socket. . In the figure, 1... insulating base, 2-4... contactor, 2a-4a... contact piece part, 2b-4b... external connection terminal part, 5... sample, 6... projection part, 7... check jig .
Claims (1)
体装置のリードと接触し、他端は絶縁性基体を貫
通して外部と接続する半導体装置用ソケツトにお
いて、前記半導体装置の各リードに対して、２対
の独立した接触子を具備し、かつ該接触子の一方
は側面に突出するバネ性を有する突起部を併せて
具備したことを特徴とする半導体装置用ソケツト
。 In a socket for a semiconductor device, one end of which is in contact with each lead of the semiconductor device, and the other end of which is connected to the outside through an insulating base, for each lead of the semiconductor device, 1. A socket for a semiconductor device, comprising two pairs of independent contacts, one of which is also provided with a protrusion having spring properties protruding from a side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15547684U JPS6170942U (en) | 1984-10-15 | 1984-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15547684U JPS6170942U (en) | 1984-10-15 | 1984-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6170942U true JPS6170942U (en) | 1986-05-15 |
Family
ID=30713487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15547684U Pending JPS6170942U (en) | 1984-10-15 | 1984-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6170942U (en) |
-
1984
- 1984-10-15 JP JP15547684U patent/JPS6170942U/ja active Pending
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