JPH02124692U - - Google Patents
Info
- Publication number
- JPH02124692U JPH02124692U JP3449689U JP3449689U JPH02124692U JP H02124692 U JPH02124692 U JP H02124692U JP 3449689 U JP3449689 U JP 3449689U JP 3449689 U JP3449689 U JP 3449689U JP H02124692 U JPH02124692 U JP H02124692U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- housing
- lead terminal
- lead
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は同要部断面図、第３図は本考案の実施例２を
示す斜視図、第４図は従来のＤＩＰ型半導体装置
用ソケツトを示す斜視図、第５図は従来のＤＩＰ
型半導体装置用ソケツトの要部断面図である。
１……ハウジング、２……板バネ、３……リー
ド端子、３ａ，３ｂ……分岐リード端子、７……
ＤＩＰ型半導体装置、８……半導体装置の外部リ
ード、９……溝。
Fig. 1 is a perspective view showing the first embodiment of the present invention; Fig. 2 is a perspective view showing the first embodiment of the present invention;
3 is a perspective view showing a second embodiment of the present invention, FIG. 4 is a perspective view showing a conventional DIP type semiconductor device socket, and FIG. 5 is a conventional DIP socket.
FIG. 2 is a cross-sectional view of a main part of a type semiconductor device socket. 1... Housing, 2... Leaf spring, 3... Lead terminal, 3a, 3b... Branch lead terminal, 7...
DIP type semiconductor device, 8...external lead of semiconductor device, 9...groove.
Claims (1)
ング内に実装され、半導体装置の外部リードに電
気的に接触するリード端子とを有し、該リード端
子の一部をハウジングの下面及び側面から張り出
して設けたことを特徴とするＤＩＰ型半導体装置
用ソケツト。 It has a housing into which a semiconductor device is loaded, and a lead terminal that is mounted in the housing and makes electrical contact with an external lead of the semiconductor device, with a part of the lead terminal protruding from the bottom and side surfaces of the housing. A DIP type semiconductor device socket characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3449689U JPH02124692U (en) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3449689U JPH02124692U (en) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02124692U true JPH02124692U (en) | 1990-10-15 |
Family
ID=31539013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3449689U Pending JPH02124692U (en) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02124692U (en) |
-
1989
- 1989-03-27 JP JP3449689U patent/JPH02124692U/ja active Pending