JPS6170939U - - Google Patents
Info
- Publication number
- JPS6170939U JPS6170939U JP1984155522U JP15552284U JPS6170939U JP S6170939 U JPS6170939 U JP S6170939U JP 1984155522 U JP1984155522 U JP 1984155522U JP 15552284 U JP15552284 U JP 15552284U JP S6170939 U JPS6170939 U JP S6170939U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- resin
- resin semiconductor
- pin
- quip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984155522U JPS6170939U (enExample) | 1984-10-15 | 1984-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984155522U JPS6170939U (enExample) | 1984-10-15 | 1984-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6170939U true JPS6170939U (enExample) | 1986-05-15 |
Family
ID=30713535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984155522U Pending JPS6170939U (enExample) | 1984-10-15 | 1984-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6170939U (enExample) |
-
1984
- 1984-10-15 JP JP1984155522U patent/JPS6170939U/ja active Pending