JPS6170938U - - Google Patents

Info

Publication number
JPS6170938U
JPS6170938U JP1984156686U JP15668684U JPS6170938U JP S6170938 U JPS6170938 U JP S6170938U JP 1984156686 U JP1984156686 U JP 1984156686U JP 15668684 U JP15668684 U JP 15668684U JP S6170938 U JPS6170938 U JP S6170938U
Authority
JP
Japan
Prior art keywords
semiconductor element
resin board
circuit resin
circuit
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984156686U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984156686U priority Critical patent/JPS6170938U/ja
Publication of JPS6170938U publication Critical patent/JPS6170938U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1984156686U 1984-10-17 1984-10-17 Pending JPS6170938U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984156686U JPS6170938U (zh) 1984-10-17 1984-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984156686U JPS6170938U (zh) 1984-10-17 1984-10-17

Publications (1)

Publication Number Publication Date
JPS6170938U true JPS6170938U (zh) 1986-05-15

Family

ID=30714691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984156686U Pending JPS6170938U (zh) 1984-10-17 1984-10-17

Country Status (1)

Country Link
JP (1) JPS6170938U (zh)

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