JPS6170938U - - Google Patents
Info
- Publication number
- JPS6170938U JPS6170938U JP1984156686U JP15668684U JPS6170938U JP S6170938 U JPS6170938 U JP S6170938U JP 1984156686 U JP1984156686 U JP 1984156686U JP 15668684 U JP15668684 U JP 15668684U JP S6170938 U JPS6170938 U JP S6170938U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- resin board
- circuit resin
- circuit
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984156686U JPS6170938U (de) | 1984-10-17 | 1984-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984156686U JPS6170938U (de) | 1984-10-17 | 1984-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6170938U true JPS6170938U (de) | 1986-05-15 |
Family
ID=30714691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984156686U Pending JPS6170938U (de) | 1984-10-17 | 1984-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6170938U (de) |
-
1984
- 1984-10-17 JP JP1984156686U patent/JPS6170938U/ja active Pending
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