JPS617026B2 - - Google Patents

Info

Publication number
JPS617026B2
JPS617026B2 JP54055865A JP5586579A JPS617026B2 JP S617026 B2 JPS617026 B2 JP S617026B2 JP 54055865 A JP54055865 A JP 54055865A JP 5586579 A JP5586579 A JP 5586579A JP S617026 B2 JPS617026 B2 JP S617026B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54055865A
Other languages
Japanese (ja)
Other versions
JPS55148449A (en
Inventor
Takashi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP5586579A priority Critical patent/JPS55148449A/ja
Publication of JPS55148449A publication Critical patent/JPS55148449A/ja
Publication of JPS617026B2 publication Critical patent/JPS617026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
JP5586579A 1979-05-08 1979-05-08 Semiconductor device Granted JPS55148449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5586579A JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5586579A JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55148449A JPS55148449A (en) 1980-11-19
JPS617026B2 true JPS617026B2 (enrdf_load_stackoverflow) 1986-03-03

Family

ID=13010955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5586579A Granted JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55148449A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012095A (ja) * 1983-06-30 1985-01-22 株式会社高木化学研究所 クツシヨン部材
JPS6042115A (ja) * 1983-08-17 1985-03-06 Takagi Kagaku Kenkyusho:Kk 車両用座席の空調装置
JPS6048781A (ja) * 1983-08-30 1985-03-16 株式会社高木化学研究所 自動車用座席

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056301B2 (ja) * 1976-06-03 1985-12-09 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
JPS55148449A (en) 1980-11-19

Similar Documents

Publication Publication Date Title
FR2447709B3 (enrdf_load_stackoverflow)
BR8002583A (enrdf_load_stackoverflow)
BR8006808A (enrdf_load_stackoverflow)
FR2449293B1 (enrdf_load_stackoverflow)
FR2449701B1 (enrdf_load_stackoverflow)
FR2449689B1 (enrdf_load_stackoverflow)
FR2448601B1 (enrdf_load_stackoverflow)
FR2447495B3 (enrdf_load_stackoverflow)
FR2448582B1 (enrdf_load_stackoverflow)
FR2449328B1 (enrdf_load_stackoverflow)
FR2447502B1 (enrdf_load_stackoverflow)
FR2450237B1 (enrdf_load_stackoverflow)
FR2447037B1 (enrdf_load_stackoverflow)
FR2450157B1 (enrdf_load_stackoverflow)
FR2450209B3 (enrdf_load_stackoverflow)
FR2450090B2 (enrdf_load_stackoverflow)
AU79559S (enrdf_load_stackoverflow)
AU79826S (enrdf_load_stackoverflow)
AU79918S (enrdf_load_stackoverflow)
AU79950S (enrdf_load_stackoverflow)
AU80228S (enrdf_load_stackoverflow)
AU79558S (enrdf_load_stackoverflow)
AU78385S (enrdf_load_stackoverflow)
AU78386S (enrdf_load_stackoverflow)
BR5901094U (enrdf_load_stackoverflow)