JPS6169846U - - Google Patents
Info
- Publication number
- JPS6169846U JPS6169846U JP15479284U JP15479284U JPS6169846U JP S6169846 U JPS6169846 U JP S6169846U JP 15479284 U JP15479284 U JP 15479284U JP 15479284 U JP15479284 U JP 15479284U JP S6169846 U JPS6169846 U JP S6169846U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- out electrodes
- frequency
- electrodes
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Channel Selection Circuits, Automatic Tuning Circuits (AREA)
Description
第１図は本考案に係る高周波パツケージ部品の
正面図、第２図はダイオード並列使用を示すチユ
ーナの局部発振段の回路図、及び第３図は従来の
ダイオードパツケージ部品の正面図である。
３０……高周波パツケージ部品、３１，３２…
…ダイオードペレツト、３３〜３６……導出電極
、３７……パツケージ（樹脂モールド）体、３８
〜４１……接続用リードワイヤ。
FIG. 1 is a front view of a high frequency package component according to the present invention, FIG. 2 is a circuit diagram of a local oscillation stage of a tuner showing the use of diodes in parallel, and FIG. 3 is a front view of a conventional diode package component. 30...High frequency package parts, 31, 32...
... Diode pellet, 33-36 ... Leading electrode, 37 ... Package (resin mold) body, 38
~41...Lead wire for connection.
Claims (1)
させ独立して設けた導出電極を有するパツケージ
体に収納すると共に、前記ペレツト電極と前記導
出電極をパツケージ体内部の最矩距離でリードワ
イヤにより接続してリードインダクタンスを小さ
くしたことを特徴とする高周波パツケージ部品。 (2) 前記電気素子が高周波同調回路で並列接続
するダイオード素子であり、前記並列接続を前記
導出電極間の外部回路で構成した実用新案登録請
求の範囲第１項に記載の高周波パツケージ部品。[Claims for Utility Model Registration] (1) A pair of electric elements is housed in a package body having lead-out electrodes provided independently corresponding to each pellet electrode, and the pellet electrodes and the lead-out electrodes are placed inside the package body. A high-frequency package component characterized in that lead inductance is reduced by connecting with a lead wire at the minimum rectangular distance. (2) The high-frequency package component according to claim 1, wherein the electric element is a diode element connected in parallel in a high-frequency tuning circuit, and the parallel connection is constituted by an external circuit between the lead-out electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15479284U JPS6169846U (en) | 1984-10-12 | 1984-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15479284U JPS6169846U (en) | 1984-10-12 | 1984-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169846U true JPS6169846U (en) | 1986-05-13 |
Family
ID=30712785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15479284U Pending JPS6169846U (en) | 1984-10-12 | 1984-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169846U (en) |
-
1984
- 1984-10-12 JP JP15479284U patent/JPS6169846U/ja active Pending
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