JPS6169842U - - Google Patents
Info
- Publication number
- JPS6169842U JPS6169842U JP1984153645U JP15364584U JPS6169842U JP S6169842 U JPS6169842 U JP S6169842U JP 1984153645 U JP1984153645 U JP 1984153645U JP 15364584 U JP15364584 U JP 15364584U JP S6169842 U JPS6169842 U JP S6169842U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- coating layer
- alloy
- semiconductor
- frame according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984153645U JPS6169842U (cg-RX-API-DMAC7.html) | 1984-10-13 | 1984-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984153645U JPS6169842U (cg-RX-API-DMAC7.html) | 1984-10-13 | 1984-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169842U true JPS6169842U (cg-RX-API-DMAC7.html) | 1986-05-13 |
Family
ID=30711655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984153645U Pending JPS6169842U (cg-RX-API-DMAC7.html) | 1984-10-13 | 1984-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169842U (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021120991A (ja) * | 2020-01-30 | 2021-08-19 | 大口マテリアル株式会社 | リードフレーム |
-
1984
- 1984-10-13 JP JP1984153645U patent/JPS6169842U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021120991A (ja) * | 2020-01-30 | 2021-08-19 | 大口マテリアル株式会社 | リードフレーム |