JPS6168877A - Method of producing slip ring assembly - Google Patents
Method of producing slip ring assemblyInfo
- Publication number
- JPS6168877A JPS6168877A JP8586284A JP8586284A JPS6168877A JP S6168877 A JPS6168877 A JP S6168877A JP 8586284 A JP8586284 A JP 8586284A JP 8586284 A JP8586284 A JP 8586284A JP S6168877 A JPS6168877 A JP S6168877A
- Authority
- JP
- Japan
- Prior art keywords
- slip ring
- mold
- ring assembly
- core rod
- slip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、回転体ジャイロを利用した各種機器に用いる
スリップリングアセンブリの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a slip ring assembly used in various devices using a rotating gyro.
(従来技術)
回転体ジャイロを利用した機器に用いるスリップリング
アセンブリは、円筒周囲を摺動する縦型スリップリング
アセンブリである。(Prior Art) A slip ring assembly used in a device using a rotating gyro is a vertical slip ring assembly that slides around a cylinder.
縦型スリップリングアセンブリは、第1図に示す如く樹
脂製の支持軸1の下部にフランジ2を有し、それより上
方の外周に複数のスリップリング3が一体間隔に一体に
設けられ、中心に補強用絶縁被覆の芯棒4が埋込まれ、
その周りにスリップリング3の内周面に溶接された絶縁
被覆のリード線5が配されて、該リード線5が支持軸l
の下端より導出せしめられて成るものである。As shown in FIG. 1, the vertical slip ring assembly has a flange 2 at the bottom of a support shaft 1 made of resin, and a plurality of slip rings 3 are integrally provided on the outer periphery above the flange 2 at uniform intervals, A reinforcing insulation coating core rod 4 is embedded,
An insulated lead wire 5 welded to the inner peripheral surface of the slip ring 3 is arranged around it, and the lead wire 5 is attached to the support shaft l.
It is derived from the lower end of .
(発明が解決しようとする問題点)
斯かる構造のスリップリングアセンブリ6を製造する際
には、絶縁被覆のリード線5を束ねる為に、金型内で第
2図に示す如く絶縁被覆の芯棒4の外周面に絶縁被覆の
リード線5を接触させて整束した上で、樹脂を充填する
のであるが、芯棒4の絶縁被覆材がリード線5の整束時
剥れることがあり、これが為絶縁不良が発生した。また
芯棒4の外周面におけるリード線5の位置が決まらなく
、樹脂を充填した際、支持軸1の下端より導出せしめら
れるリード線5が乱れるものである。(Problems to be Solved by the Invention) When manufacturing the slip ring assembly 6 having such a structure, in order to bundle the insulated lead wires 5, the core of the insulated coating is formed in the mold as shown in FIG. The insulated lead wires 5 are brought into contact with the outer circumferential surface of the rod 4 to bundle them, and then filled with resin, but the insulation coating material on the core rod 4 may peel off when the lead wires 5 are bundled. This caused an insulation failure. Further, the position of the lead wire 5 on the outer peripheral surface of the core rod 4 is not determined, and when the resin is filled, the lead wire 5 led out from the lower end of the support shaft 1 is disturbed.
(発明の目的)
本発明は、斯かる問題を解消すべくなされたものであり
、補強用の芯棒の絶縁不良の発生が無く、芯棒の外周面
でのリード線の位置決めを確実にできるスリップリング
アセンブリの製造方法を提供せんとするものである。(Object of the Invention) The present invention was made to solve such problems, and there is no occurrence of insulation failure of the reinforcing core rod, and the positioning of the lead wire on the outer peripheral surface of the core rod can be ensured. It is an object of the present invention to provide a method for manufacturing a slip ring assembly.
(実施例)
以下本発明のスリップリングアセンブリの製造方法の一
実施例を第3図a乃至fによって説明すると、先ず第3
図aに示す如く外周面に半円形の凹部7を多数1本例で
は5本長手方向に並設して断面スプロケット形になした
エポキシ、ジアリルフタレート、ジュラコン、ポリイミ
ド、アクリル等のいずれかの絶縁樹脂製芯棒8の外周面
の半円形の凹部7に、第3図すに示す如く導電材2本例
ではA u −Cu 10重量%より成る5個のスリッ
プリング10の各内周面に端部裸線を溶接した絶縁被覆
の純フロン電線のリード線11を、1本づつ第3図Cに
示す如く嵌合位置決めして、該リード線11の他端を第
3図dに示す如く金型9外に導出せしめると共に各スリ
ップリング10を一定間隔に金型9内に配列セットする
。次いで金型9を閉塞し、金型9内に第3図eに示す如
くエポキシ樹脂12を充填して支持軸13を成形すると
共に外周にスリップリング10を一定間隔に一体形成す
る。然る後金型9内より取り出し、外周部を所定量切削
し、研摩して仕上げ整形し、第3図fに示す如くスリッ
プリングアセンブリ14を得る。(Embodiment) An embodiment of the method for manufacturing a slip ring assembly of the present invention will be described below with reference to FIGS. 3a to 3f.
As shown in Figure a, a large number of semicircular recesses 7 are arranged on the outer circumferential surface (in this example, five recesses) in parallel in the longitudinal direction to form a sprocket-shaped cross-section. In the semicircular recess 7 on the outer peripheral surface of the resin core rod 8, as shown in FIG. The lead wires 11, which are pure fluorocarbon electric wires with bare ends welded and insulated, are fitted and positioned one by one as shown in FIG. 3C, and the other ends of the lead wires 11 are connected as shown in FIG. 3D. The slip rings 10 are guided out of the mold 9, and the slip rings 10 are arranged and set in the mold 9 at regular intervals. Next, the mold 9 is closed, and as shown in FIG. 3e, the mold 9 is filled with epoxy resin 12 to form a support shaft 13, and slip rings 10 are integrally formed at regular intervals around the outer periphery. Thereafter, it is taken out from the mold 9, the outer circumferential portion is cut by a predetermined amount, and the slip ring assembly 14 is obtained by polishing and finishing shaping.
(発明の効果)
以上のように本発明のスリップリングアセンブリの製造
方法は、スリップリング14の補強用芯棒に、断面スプ
ロケット形になした絶縁樹脂製の芯棒8を用いているの
で、リード線11の整束時従来のように芯棒の絶縁被覆
が剥れるようなことが無く、絶縁不良が発生することが
無い。また、芯棒8の外周面にリード線11を接触させ
て整束するのに、芯pJ8の外周面に並設した半円形の
凹部7にリード線11を嵌合位置決めするので、リード
線11の位置決めが確実且つ簡単化し、リード線11の
整束作業が能率良く行うことができる。しかもリード線
1工の整束径を最小限にできるので、エポキシ樹脂12
を充填した際、支持軸13の下端より導出せしめられる
リード線11が乱れることが無い等の効・果がある。(Effects of the Invention) As described above, in the method for manufacturing a slip ring assembly of the present invention, the core rod 8 made of insulating resin and having a sprocket-shaped cross section is used as the reinforcing core rod of the slip ring 14. When the wires 11 are bundled, the insulation coating of the core rod does not peel off as in the conventional case, and insulation defects do not occur. Furthermore, when the lead wires 11 are brought into contact with the outer peripheral surface of the core rod 8 and bundled, the lead wires 11 are fitted and positioned in the semicircular recesses 7 arranged in parallel on the outer peripheral surface of the core pJ8. The positioning of the lead wires 11 can be performed reliably and easily, and the work of aligning the lead wires 11 can be performed efficiently. Moreover, since the bundle diameter of one lead wire can be minimized, the epoxy resin 12
There are effects such as that the lead wire 11 led out from the lower end of the support shaft 13 is not disturbed when it is filled.
第1図は従来のスリップリングアセンブリを示す一部破
断斜視図、第2図はそのスリップリングアセンブリに於
ける芯棒の外周面にリード線を整束した状態を示す断面
図、第3図a乃至gは本発明のスリップリングアセンブ
リの製造方法の工程を示す図である。
7−・−凹部、8・−−−一・芯棒、9−−−−−一金
型、10−・−スリップリング、11−−−−−−リー
ド線、12−・−一一一エボキシ樹脂、13− ・−支
持軸、14−−−−−−スリ・7プリングアセンブリ。
出願人 田中貴金属工業株式会社
第1図
第2図
第3図
(Q) (b)
(c)
第3図
手続補正書(方式)
%式%
1、事件の表示
昭和59年特許願第85862号
2、発明の名称
スリップリングアセンブリの製造方法
3、補正をする者
事件との関係 特許出願人
昭和60年9月4日
5、補正の対象
4、図面の簡単な説明
6、補正の内容Fig. 1 is a partially cutaway perspective view showing a conventional slip ring assembly, Fig. 2 is a sectional view showing a state in which lead wires are bundled around the outer circumferential surface of a core rod in the slip ring assembly, and Fig. 3 a. FIGS. 1A to 1G are diagrams illustrating steps of a method for manufacturing a slip ring assembly according to the present invention. 7--Concavity, 8--1 Core rod, 9--1 Mold, 10--Slip ring, 11--Lead wire, 12--111 Epoxy resin, 13--Support shaft, 14--Slip/7 pull assembly. Applicant Tanaka Kikinzoku Kogyo Co., Ltd. Figure 1 Figure 2 Figure 3 (Q) (b) (c) Figure 3 Procedural amendment (method) % formula % 1. Indication of case Patent Application No. 85862 of 1982 2. Name of the invention Method for manufacturing a slip ring assembly 3. Relationship with the person making the amendment Patent applicant September 4, 1985 5. Subject of the amendment 4. Brief description of the drawings 6. Contents of the amendment
Claims (1)
形になした絶縁性樹脂より成る芯棒を金型内の中心にセ
ットし、次に導電材より成る複数のスリップリングの各
内周面に溶接した複数のリード線を前記芯棒の外周面の
半円形の凹部に嵌合位置決めして端部を金型外に導出せ
しめると共に各スリップリングを一定間隔に金型内に配
列セットし、次いで金型内に樹脂を充填して支持軸を成
形すると共に外周にスリップリングを一定間隔に一体形
成し、然る後切削、研摩して仕上げ整形することを特徴
とするスリップリングアセンブリの製造方法。A core rod made of insulating resin with a sprocket-shaped cross section with many semicircular recesses lined up on its outer circumferential surface is set in the center of the mold, and then each inner circumference of a plurality of slip rings made of conductive material is placed in the center of the mold. A plurality of lead wires welded to the surface are fitted and positioned in semicircular recesses on the outer peripheral surface of the core rod, and the ends are led out of the mold, and each slip ring is arranged and set in the mold at regular intervals. Next, a mold is filled with resin to form a support shaft, slip rings are integrally formed on the outer periphery at regular intervals, and then the slip ring assembly is finished by cutting and polishing. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8586284A JPS6168877A (en) | 1984-04-27 | 1984-04-27 | Method of producing slip ring assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8586284A JPS6168877A (en) | 1984-04-27 | 1984-04-27 | Method of producing slip ring assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6168877A true JPS6168877A (en) | 1986-04-09 |
Family
ID=13870692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8586284A Pending JPS6168877A (en) | 1984-04-27 | 1984-04-27 | Method of producing slip ring assembly |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6168877A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933801A (en) * | 1972-07-31 | 1974-03-28 | ||
JPS5654672A (en) * | 1979-10-11 | 1981-05-14 | Nippon Telegr & Teleph Corp <Ntt> | Magnetic disk device |
-
1984
- 1984-04-27 JP JP8586284A patent/JPS6168877A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933801A (en) * | 1972-07-31 | 1974-03-28 | ||
JPS5654672A (en) * | 1979-10-11 | 1981-05-14 | Nippon Telegr & Teleph Corp <Ntt> | Magnetic disk device |
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