JPS6167219A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6167219A
JPS6167219A JP59188444A JP18844484A JPS6167219A JP S6167219 A JPS6167219 A JP S6167219A JP 59188444 A JP59188444 A JP 59188444A JP 18844484 A JP18844484 A JP 18844484A JP S6167219 A JPS6167219 A JP S6167219A
Authority
JP
Japan
Prior art keywords
film
singlecrystal
polysilicon
substrate
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59188444A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582733B2 (https=
Inventor
Ryoichi Mukai
良一 向井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59188444A priority Critical patent/JPS6167219A/ja
Publication of JPS6167219A publication Critical patent/JPS6167219A/ja
Publication of JPH0582733B2 publication Critical patent/JPH0582733B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3238Materials thereof being insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H10P14/3808Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3204Materials thereof being Group IVA semiconducting materials
    • H10P14/3211Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242Structure
    • H10P14/3244Layer structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242Structure
    • H10P14/3244Layer structure
    • H10P14/3251Layer structure consisting of three or more layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3451Structure
    • H10P14/3452Microstructure
    • H10P14/3458Monocrystalline

Landscapes

  • Recrystallisation Techniques (AREA)
JP59188444A 1984-09-07 1984-09-07 半導体装置の製造方法 Granted JPS6167219A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59188444A JPS6167219A (ja) 1984-09-07 1984-09-07 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59188444A JPS6167219A (ja) 1984-09-07 1984-09-07 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6167219A true JPS6167219A (ja) 1986-04-07
JPH0582733B2 JPH0582733B2 (https=) 1993-11-22

Family

ID=16223789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59188444A Granted JPS6167219A (ja) 1984-09-07 1984-09-07 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6167219A (https=)

Also Published As

Publication number Publication date
JPH0582733B2 (https=) 1993-11-22

Similar Documents

Publication Publication Date Title
US5310446A (en) Method for producing semiconductor film
US4448632A (en) Method of fabricating semiconductor devices
US4670088A (en) Lateral epitaxial growth by seeded solidification
US4371421A (en) Lateral epitaxial growth by seeded solidification
JPH0258779B2 (https=)
JPH0588544B2 (https=)
US5116768A (en) Fabrication method of a semiconductor integrated circuit having an SOI device and a bulk semiconductor device on a common semiconductor substrate
JPH0249276B2 (https=)
US5431126A (en) Method of forming semiconductor crystal and semiconductor device
JPS6167219A (ja) 半導体装置の製造方法
US5094714A (en) Wafer structure for forming a semiconductor single crystal film
JPS6147627A (ja) 半導体装置の製造方法
JPS5928328A (ja) 半導体装置の製造方法
JPS6167218A (ja) 半導体装置の製造方法
JPS5825220A (ja) 半導体基体の製作方法
JPS6347256B2 (https=)
JPH0560668B2 (https=)
JPS63265464A (ja) 半導体装置の製造方法
JPS58180019A (ja) 半導体基体およびその製造方法
JPS63174308A (ja) 半導体薄膜結晶層の製造方法
JPS5893224A (ja) 半導体単結晶膜の製造方法
JPS5837916A (ja) 半導体装置の製造方法
JPS58112333A (ja) 半導体装置の製造方法
JPS61201414A (ja) シリコン単結晶層の製造方法
JPH0223027B2 (https=)