JPS6167219A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6167219A
JPS6167219A JP59188444A JP18844484A JPS6167219A JP S6167219 A JPS6167219 A JP S6167219A JP 59188444 A JP59188444 A JP 59188444A JP 18844484 A JP18844484 A JP 18844484A JP S6167219 A JPS6167219 A JP S6167219A
Authority
JP
Japan
Prior art keywords
polysilicon
film
manufacturing
silicon
single crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59188444A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582733B2 (enrdf_load_stackoverflow
Inventor
Ryoichi Mukai
良一 向井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59188444A priority Critical patent/JPS6167219A/ja
Publication of JPS6167219A publication Critical patent/JPS6167219A/ja
Publication of JPH0582733B2 publication Critical patent/JPH0582733B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02488—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/0245—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H01L21/02505—Layer structure consisting of more than two layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02598—Microstructure monocrystalline

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Recrystallisation Techniques (AREA)
JP59188444A 1984-09-07 1984-09-07 半導体装置の製造方法 Granted JPS6167219A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59188444A JPS6167219A (ja) 1984-09-07 1984-09-07 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59188444A JPS6167219A (ja) 1984-09-07 1984-09-07 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6167219A true JPS6167219A (ja) 1986-04-07
JPH0582733B2 JPH0582733B2 (enrdf_load_stackoverflow) 1993-11-22

Family

ID=16223789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59188444A Granted JPS6167219A (ja) 1984-09-07 1984-09-07 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6167219A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0582733B2 (enrdf_load_stackoverflow) 1993-11-22

Similar Documents

Publication Publication Date Title
US5310446A (en) Method for producing semiconductor film
US4448632A (en) Method of fabricating semiconductor devices
US5128732A (en) Stacked semiconductor device
JPH0588544B2 (enrdf_load_stackoverflow)
JPS6167219A (ja) 半導体装置の製造方法
US5094714A (en) Wafer structure for forming a semiconductor single crystal film
JPS6147627A (ja) 半導体装置の製造方法
JPS61187223A (ja) 半導体層の再結晶化方法
JPS6167218A (ja) 半導体装置の製造方法
JPS63265464A (ja) 半導体装置の製造方法
JPH0442358B2 (enrdf_load_stackoverflow)
JPS6347256B2 (enrdf_load_stackoverflow)
JPH0136972B2 (enrdf_load_stackoverflow)
JPS5825220A (ja) 半導体基体の製作方法
JPS58180019A (ja) 半導体基体およびその製造方法
JPS5893224A (ja) 半導体単結晶膜の製造方法
JPH0223027B2 (enrdf_load_stackoverflow)
JPS5837916A (ja) 半導体装置の製造方法
JPH0722120B2 (ja) 半導体装置の製造方法
JPS61201414A (ja) シリコン単結晶層の製造方法
JPS58112333A (ja) 半導体装置の製造方法
JPS61123125A (ja) 半導体装置の製造方法
JPS5961117A (ja) 半導体装置の製造方法
JPS61106484A (ja) 半導体装置用基板及びその製造方法
JPH0243331B2 (enrdf_load_stackoverflow)