JPS6166993U - - Google Patents

Info

Publication number
JPS6166993U
JPS6166993U JP1984152747U JP15274784U JPS6166993U JP S6166993 U JPS6166993 U JP S6166993U JP 1984152747 U JP1984152747 U JP 1984152747U JP 15274784 U JP15274784 U JP 15274784U JP S6166993 U JPS6166993 U JP S6166993U
Authority
JP
Japan
Prior art keywords
cut
printed circuit
hole
raised piece
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984152747U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412714Y2 (US06649357-20031118-C00005.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984152747U priority Critical patent/JPH0412714Y2/ja
Priority to KR2019850004879U priority patent/KR890007939Y1/ko
Priority to GB08523890A priority patent/GB2165399B/en
Priority to DE19853535923 priority patent/DE3535923A1/de
Priority to US06/785,784 priority patent/US4725920A/en
Publication of JPS6166993U publication Critical patent/JPS6166993U/ja
Application granted granted Critical
Publication of JPH0412714Y2 publication Critical patent/JPH0412714Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1984152747U 1984-10-09 1984-10-09 Expired JPH0412714Y2 (US06649357-20031118-C00005.png)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1984152747U JPH0412714Y2 (US06649357-20031118-C00005.png) 1984-10-09 1984-10-09
KR2019850004879U KR890007939Y1 (ko) 1984-10-09 1985-04-29 기판의 지지 구조체
GB08523890A GB2165399B (en) 1984-10-09 1985-09-27 Substrate support structures
DE19853535923 DE3535923A1 (de) 1984-10-09 1985-10-08 Substrathaltender aufbau
US06/785,784 US4725920A (en) 1984-10-09 1985-10-09 Holding structure of substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984152747U JPH0412714Y2 (US06649357-20031118-C00005.png) 1984-10-09 1984-10-09

Publications (2)

Publication Number Publication Date
JPS6166993U true JPS6166993U (US06649357-20031118-C00005.png) 1986-05-08
JPH0412714Y2 JPH0412714Y2 (US06649357-20031118-C00005.png) 1992-03-26

Family

ID=15547276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984152747U Expired JPH0412714Y2 (US06649357-20031118-C00005.png) 1984-10-09 1984-10-09

Country Status (5)

Country Link
US (1) US4725920A (US06649357-20031118-C00005.png)
JP (1) JPH0412714Y2 (US06649357-20031118-C00005.png)
KR (1) KR890007939Y1 (US06649357-20031118-C00005.png)
DE (1) DE3535923A1 (US06649357-20031118-C00005.png)
GB (1) GB2165399B (US06649357-20031118-C00005.png)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873764A (en) * 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
JPH02187093A (ja) * 1989-01-13 1990-07-23 Toshiba Corp 印刷配線板
US5162971A (en) * 1989-03-23 1992-11-10 Matsushita Electric Industrial Co., Ltd. High-density circuit module and process for producing same
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
DE4036081C2 (de) * 1990-04-26 1994-10-06 Mitsubishi Electric Corp Halbleiterspeicher-Steckmodul
US5090918A (en) * 1990-05-31 1992-02-25 John Fluke Mfg. Co., Inc. Isothermal termination block having a multi-layer thermal conductor
JP3018640B2 (ja) * 1991-08-29 2000-03-13 ソニー株式会社 回路接続基板構造
US5184283A (en) * 1991-12-23 1993-02-02 Ford Motor Company Power device assembly and method
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
JPH07105759B2 (ja) * 1993-03-30 1995-11-13 山一電機株式会社 光電変換器
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
DE19535490A1 (de) * 1995-09-23 1997-03-27 Bosch Gmbh Robert Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine
DE19600617A1 (de) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Elektrisches Gerät
US6078359A (en) * 1996-07-15 2000-06-20 The Regents Of The University Of California Vacuum compatible miniature CCD camera head
DE19636181A1 (de) * 1996-09-06 1998-03-12 Philips Patentverwaltung HF-Modul, z. B. Tuner
FR2822632B1 (fr) * 2001-03-21 2004-01-23 Sagem Carte electronique et circuit correspondant
JP3787291B2 (ja) * 2001-08-22 2006-06-21 ペンタックス株式会社 Ｅｍｃコア支持、シールド、及び放熱の為の構造
DE20211560U1 (de) * 2002-07-12 2003-12-11 Ghw Grote & Hartmann Gmbh Leiterplattenelement mit einer Stromversorgungsvorrichtung für auf der Leiterplatte angeordnete elektrische und elektronische Bauelemente
WO2005002302A1 (en) * 2003-06-24 2005-01-06 Bae Systems Plc Flexi-rigid printed circuit board with integral flexible heat sink area
US20050276024A1 (en) * 2004-06-10 2005-12-15 Westbury Steven D Flexi-rigid printed circuit board with integral flexible heat sink area
JP2023085706A (ja) * 2021-12-09 2023-06-21 日本航空電子工業株式会社 組立体及びハーネス組立体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2586854A (en) * 1947-04-19 1952-02-26 Farnsworth Res Corp Printed circuit construction
US3202879A (en) * 1959-12-24 1965-08-24 Ibm Encapsulated circuit card
DE1195829C2 (de) * 1962-11-28 1979-07-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrisches geraetechassis und verfahren zu seiner herstellung
FR1403061A (fr) * 1964-05-06 1965-06-18 Commissariat Energie Atomique Masse électrique, notamment pour plaquettes de circuits imprimés
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3409805A (en) * 1965-08-12 1968-11-05 Foxboro Co Printed-circuit board coupling circuit with d-c isolation
US3506877A (en) * 1968-09-25 1970-04-14 Us Navy Hermetically sealed and shielded circuit module
DE1911779B2 (de) * 1969-03-07 1971-10-21 Verdrahtungsanordnung zur elektrischen verbindung voneinan der verschiedener anschlussebenen
GB1411080A (en) * 1971-11-17 1975-10-22 Lucas Industries Ltd Mounting arrangements for printed circuit boards
IT1008331B (it) * 1973-03-28 1976-11-10 Rca Corp Pannello composito a circuito stampato
AT348018B (de) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich Traegerplatte
US3996500A (en) * 1975-06-16 1976-12-07 Richco Plastic Company Chassis connector and circuit board clip
US4250616A (en) * 1979-03-23 1981-02-17 Methode Electronics, Inc. Method of producing multilayer backplane
US4310870A (en) * 1979-12-31 1982-01-12 Motorola, Inc. Chassis captivation arrangement for an electronic device
DE3021655C2 (de) * 1980-06-10 1983-05-26 Rose-Elektrotechnik Gmbh & Co Kg Elektrotechnische Fabrik, 4952 Porta Westfalica Vorrichtung zum Positionieren von Leiterkarten, Montagewänden oder -platten in Elektronik-Schaltgehäusen
US4498119A (en) * 1980-11-03 1985-02-05 Lockheed Corporation Electronic circuit board and method and apparatus for thermal management thereof
US4388672A (en) * 1981-05-01 1983-06-14 Motorola Inc. Printed circuit board assembly

Also Published As

Publication number Publication date
GB2165399B (en) 1988-06-22
GB8523890D0 (en) 1985-10-30
KR860005454U (ko) 1986-06-11
GB2165399A (en) 1986-04-09
US4725920A (en) 1988-02-16
DE3535923A1 (de) 1986-04-10
DE3535923C2 (US06649357-20031118-C00005.png) 1989-02-02
KR890007939Y1 (ko) 1989-11-10
JPH0412714Y2 (US06649357-20031118-C00005.png) 1992-03-26

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