JPS6163839U - - Google Patents

Info

Publication number
JPS6163839U
JPS6163839U JP1984145321U JP14532184U JPS6163839U JP S6163839 U JPS6163839 U JP S6163839U JP 1984145321 U JP1984145321 U JP 1984145321U JP 14532184 U JP14532184 U JP 14532184U JP S6163839 U JPS6163839 U JP S6163839U
Authority
JP
Japan
Prior art keywords
circuit board
plated
wire bonding
plating
wiring portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984145321U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222992Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984145321U priority Critical patent/JPH0222992Y2/ja
Publication of JPS6163839U publication Critical patent/JPS6163839U/ja
Application granted granted Critical
Publication of JPH0222992Y2 publication Critical patent/JPH0222992Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP1984145321U 1984-09-26 1984-09-26 Expired JPH0222992Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984145321U JPH0222992Y2 (https=) 1984-09-26 1984-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984145321U JPH0222992Y2 (https=) 1984-09-26 1984-09-26

Publications (2)

Publication Number Publication Date
JPS6163839U true JPS6163839U (https=) 1986-04-30
JPH0222992Y2 JPH0222992Y2 (https=) 1990-06-21

Family

ID=30703576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984145321U Expired JPH0222992Y2 (https=) 1984-09-26 1984-09-26

Country Status (1)

Country Link
JP (1) JPH0222992Y2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716740A (en) * 1980-07-04 1982-01-28 Hitachi Ltd Protective unit for blower of air conditioner or the like

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716740A (en) * 1980-07-04 1982-01-28 Hitachi Ltd Protective unit for blower of air conditioner or the like

Also Published As

Publication number Publication date
JPH0222992Y2 (https=) 1990-06-21

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